Abstract: The invention relates to a method for manufacturing an electrical circuit board. It includes the provision of a sheet of electrically conductive material and a layer of adhesive material. In order to have a color appear in spaces cut or etched into the sheet of electrically conductive material, the adhesive material includes a coloring agent. The invention also relates to an electrical circuit board for a smart card, which circuit board is manufactured using this method, and a smart card including such an electrical circuit board.

Abstract: The invention relates to a method for manufacturing an electrical circuit board. It includes the provision of a sheet of electrically conductive material and a layer of adhesive material. In order to have a colour appear in spaces cut or etched into the sheet of electrically conductive material, the adhesive material includes a colouring agent. The invention also relates to an electrical circuit board for a smart card, which circuit board is manufactured using this method, and a smart card including such an electrical circuit board.

Abstract: The invention concerns a method of producing a circuit including the step consisting of connecting, to a bottom wall of a cavity, an electronic component with or without an intermediate wired link, the method including a step prior to an etching step which consists of depositing a layer of protective material on a conductive layer in the bottom of the cavity, said material being a liquid material capable of hardening and, once hardened, resistant to the etching solution.

Abstract: The inventions relates to a method of manufacturing a circuit incorporating a solid state light emitting component, the method including providing an insulating layer, producing at least one through hole in the insulating layer, providing a conductive layer, bonding a main surface of the conductive layer to the insulating layer, and positioning at least one solid state light emitting component in the hole of the insulating layer and connecting this component to the conductive layer.

Abstract: The inventions relates to a method of manufacturing a circuit incorporating a solid state light emitting component, the method including providing an insulating layer, producing at least one through hole in the insulating layer, providing a conductive layer, bonding a main surface of the conductive layer to the insulating layer, and positioning at least one solid state light emitting component in the hole of the insulating layer and connecting this component to the conductive layer.

Abstract: A flexible printed circuit includes 2 insulating flexible layers, and 3 conductive layers each including electrical tracks, the conductive and the insulating layers are provided stacked in alternated fashion. Electrical tracks of 3 conductive layers are electrically connected together through respective layers of insulating substrate to form an RFID antenna.

Abstract: Method for conditioning of an electronic microcircuit designed for the production of an electronic module which can be glued by means of a simple glue or by soldering. For this purpose the microchip has a geometric shape compatible with a recess in a card provided to accommodate it and has a means serving as a mask compatible with the card. Ultimately this mask also serves to prevent an outflow of a resin coating used to protect a chip included in this type of module. The mask is glued to a support having, on a first face, the contact area, and on a second face the mask and the chip. The mask includes a window determining the placement of the chip.

Abstract: Method for conditioning of an electronic microcircuit designed for the production of an electronic module which can be glued by means of a simple glue or by soldering. For this purpose the microchip has a geometric shape compatible with a recess in a card provided to accommodate it and has a means serving as a mask compatible with the card. Ultimately this mask also serves to prevent an outflow of a resin coating used to protect a chip included in this type of module. The mask is glued to a support having, on a first face, the contact area, and on a second face the mask and the chip. The mask includes a window determining the placement of the chip.

Abstract: A method of making a presensitized lithographic plate is disclosed wherein a steel support having a tin-plated layer is depassivated and coated with a photosensitive product. Depassivation is accomplished by immersion of the support in an electrolytic bath of sodium carbonate. The electrolysis is performed with the support as a cathode and reversed so that the support is an anode of the bath. Preferably, the bath is an aqueous solution of 50 grams per liter of sodium carbonate at a temperature of 65.degree. C. with a current density of the bath being approximately 2.5 amperes per dm.sup.2. It is also contemplated that the depassivated tin-plated layer may be coated with copper before application of the photosensitive product. This can be accomplished by immersion in an electrolytic bath of copper cyanide. Preferably, the copper cyanide bath is at a temperature of 65.degree. C. with immersion occurring for approximately 3 minutes with the support in the cathode position and having a current density of 2.