Abstract: The invention relates to integrated circuits (1) that comprise, on the active surface thereof, a first dielectric layer defining a passivation layer (6) and contact pads (5) flush through openings (7) in said passivation layer, wherein said integrated circuits are to be incorporated in contactless portable objects (10) for connection by capacitive coupling to the terminals (13) of an antenna-forming circuit (11) mounted on a substrate (12) of said object. The invention also relates to contactless portable objects including such circuits. The invention is characterized in that the capacitive coupling is carried out using connection plates (8) of the integrated circuits, positioned at the surface of the passivation layer and electrically connected to the contact pads. The invention can particularly be used in UHF RFID objects.

Abstract: The invention relates to a method for manufacturing contactless portable objects having an integrated circuit, and to contactless portable objects having an integrated circuit. The method of the invention is characterized in that it comprises the following steps: providing a dielectric antenna substrate (6) which carries an antenna circuit (7) having at least one turn (7-1, 7-2, 7-3, 7-4) and two contact terminals (8-1, 8-2); providing a bridge (5) having a dielectric bridge substrate (1) and a chip (3) having an integrated circuit; and placing said bridge (5) with said chip (3) onto said dielectric antenna substrate (6) so that the bridge (5) straddles said at least one turn (7-1, 7-2, 7-3, 7-4) and forms an electric connection between said chip (3) and said antenna circuit (7). The invention is particularly useful for HF RFID objects.

Abstract: The invention relates to a method for manufacturing contactless portable objects with an integrated circuit. The method of the invention is characterized in that it comprises the steps of: providing a silicon wafer (1) having integrated circuits (2) comprising plates (7) for connecting said circuits by capacitive coupling to the contact terminals of an antenna conductor circuit (5) provided at the surface of a dielectric substrate (4) of the contactless object; cutting the integrated circuits from said silicon wafer; grasping the integrated circuits using a gripping means of an integrated circuit transfer machine; and transferring the grasped integrated circuits onto the dielectric substrate so that the plates of said circuits are positioned substantially opposite the contact terminals of the antenna circuits. The invention can particularly be used for manufacturing UHF RFID objects.

Abstract: The invention relates to portable electronic objects comprising an integrated circuit chip, and a mounting having two connection terminals for a circuit, as well as to a method for manufacturing such objects. The invention is characterized in that the chip is provided, on the active surface thereof, with two widened connection zones, in particular connection plates, said connection plates being positioned opposite said terminals and electrically connected, by ohmic contact, to the latter, and in that the surface defined by the connection plates, at the surface of the active integrated circuit having said plates, is greater than ½ of the surface of said surface. The invention can be used, in particular, for RFID objects.

Abstract: The invention relates to a method for manufacturing contactless portable objects having an integrated circuit, and to contactless portable objects having an integrated circuit. The method of the invention is characterized in that it comprises the following steps: providing a dielectric antenna substrate (6) which carries an antenna circuit (7) having at least one turn (7-1, 7-2, 7-3, 7-4) and two contact terminals (8-1, 8-2); providing a bridge (5) having a dielectric bridge substrate (1) and a chip (3) having an integrated circuit; and placing said bridge (5) with said chip (3) onto said dielectric antenna substrate (6) so that the bridge (5) straddles said at least one turn (7-1, 7-2, 7-3, 7-4) and forms an electric connection between said chip (3) and said antenna circuit (7). The invention is particularly useful for HF RFID objects.

Abstract: A method for connecting an electronic chip (10) to contacts (47and 48) of an electric circuit, the chip having two conductive plates (31and 32) located on the last layer of the chip and at least one electromagnetic shielding layer, at least one of the plates (31or 32) being entirely covered with an electrical insulating layer (34). The method includes placing an adhesive dielectric material (40) on the circuit between the contacts (47, 48), to fix the electronic chip (10) relative to the circuit, positioning electronic chip (10) on the circuit so that conductive plates (31et 32) are opposite the contacts (47and 48), so as to create between the chip and the electric circuit at least one capacitive link made up of the conductive plate (31or 32), the electrically insulating layer and the contact (47or 48).

Abstract: The invention relates to a method for manufacturing contactless portable objects with an integrated circuit. The method of the invention is characterized in that it comprises the steps of: providing a silicon wafer (1) having integrated circuits (2) comprising plates (7) for connecting said circuits by capacitive coupling to the contact terminals of an antenna conductor circuit (5) provided at the surface of a dielectric substrate (4) of the contactless object; cutting the integrated circuits from said silicon wafer; grasping the integrated circuits using a gripping means of an integrated circuit transfer machine; and transferring the grasped integrated circuits onto the dielectric substrate so that the plates of said circuits are positioned substantially opposite the contact terminals of the antenna circuits. The invention can particularly be used for manufacturing UHF RFID objects.

Abstract: The invention relates to integrated circuits (1) that comprise, on the active surface thereof, a first dielectric layer defining a passivation layer (6) and contact pads (5) flush through openings (7) in said passivation layer, wherein said integrated circuits are to be incorporated in contactless portable objects (10) for connection by capacitive coupling to the terminals (13) of an antenna-forming circuit (11) mounted on a substrate (12) of said object. The invention also relates to contactless portable objects including such circuits. The invention is characterised in that the capacitive coupling is carried out using connection plates (8) of the integrated circuits, positioned at the surface of the passivation layer and electrically connected to the contact pads. The invention can particularly be used in UHF RFID objects.

Abstract: A radiofrequency identification device (RFID) featuring an antenna (10) connected to a chip designed to be affixed to an object to be identified by a remote reader transmitting to the identification device electromagnetic signals received by the antenna and containing the data allowing the identification as well as the supply voltage (VDC) of the device, the antenna transmitting in return to said reader signals provided by the chip by retromodulation by means of a switch (22) in the chip whose open or closed position defines the digital identification data transmitted by the device. The chip features a variable impedance (30) connected in series with the switch to the terminals of the antenna and a means for detecting (32) the supply voltage to adjust the impedance value so that this supply voltage is always greater than a predetermined value (Vthreshold) below which the device can no longer transmit digital identification data.

Abstract: The invention concerns a method for connecting an electronic chip (10) to contacts (47 and 48) of an electric circuit and designed to receive the chip, the chip being provided with two conductive plates (31 and 32) located on the last layer making up the chip and at least one electromagnetic shielding layer, at least one of the plates (31 or 32) being entirely covered with an electrically insulating layer (34), the method including the following steps: Placing an adhesive dielectric material (40) on the circuit between the contacts (47, 48), so as to maintain the electronic chip (10) in a fixed position relative to the circuit, Positioning the electronic chip (10) on the circuit so that the conductive plates (31 et 32) are opposite the contacts (47 and 48) of the electric circuit, so as to create between the chip and the electric circuit at least one capacitive link made up of the conductive plate (31 or 32), the electrically insulating layer completely covering said plate and the contact (47 or 48).

Abstract: The invention relates to an integrated circuit for contactless radiofrequency device connected to a first antenna and to a second antenna designed to receive a radiofrequency signal coming from a reader. According to a main characteristic, the integrated circuit includes a first rectifier circuit and a second rectifier circuit to rectify each radiofrequency signal received from the first antenna and the second antenna, respectively, so as to produce two positive output voltages V1 and V2, the rectifier circuits being mounted in parallel in order to select an output voltage value that corresponds to the maximum voltage value between V1 and V2.

Abstract: A radiofrequency identification device (RFID) featuring an antenna (10) connected to a chip designed to be affixed to an object to be identified by a remote reader transmitting to the identification device electromagnetic signals received by the antenna and containing the data allowing the identification as well as the supply voltage (VDC) of the device, the antenna transmitting in return to said reader signals provided by the chip by retromodulation by means of a switch (22) in the chip whose open or closed position defines the digital identification data transmitted by the device. The chip features a variable impedance (30) connected in series with the switch to the terminals of the antenna and a means for detecting (32) the supply voltage to adjust the impedance value so that this supply voltage is always greater than a predetermined value (Vthreshold) below which the device can no longer transmit digital identification data.

Abstract: The invention relates to an integrated circuit (IC) comprising of a signal transmission channel (TX) including radio frequencies and a built-in tester (TEST) intended to test radio characteristics of said integrated circuit, said tester (TEST) comprising of—first means (COUPL) for recovering a part of the signal generated by the transmission channel (TX) at a first frequency (F0),—second means (M) for converting said recovered signal from the first frequency (F0) into a second frequency (F1),—an amplifier (A) for amplifying said signal at this second frequency (F1), and—a rectifier (R) for rectifying said signal.