Patents by Inventor Yannick Kervran

Yannick Kervran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220210563
    Abstract: A sound transducer, including: a substrate including a cavity and a first surface oriented to the cavity; a fixed part extending from the first surface into the cavity, and including a fixed end disposed on the first surface and a free end opposite to the fixed end; a moving part fixed on the substrate and disposed over the cavity, partially covering the cavity, and including a second surface oriented to the cavity; a first electrode, fixed on the free end; and a second electrode fixed on the second surface. The first electrode is laterally adjacent to the second electrode. The sound transducer has higher sensitivity and the first electrode has stronger stability, thereby improving the performance of the sound transducer.
    Type: Application
    Filed: December 30, 2020
    Publication date: June 30, 2022
    Inventor: Yannick Kervran
  • Patent number: 11368792
    Abstract: A sound transducer, including: a substrate including a cavity and a first surface oriented to the cavity; a fixed part extending from the first surface into the cavity, and including a fixed end disposed on the first surface and a free end opposite to the fixed end; a moving part fixed on the substrate and disposed over the cavity, partially covering the cavity, and including a second surface oriented to the cavity; a first electrode, fixed on the free end; and a second electrode fixed on the second surface. The first electrode is laterally adjacent to the second electrode. The sound transducer has higher sensitivity and the first electrode has stronger stability, thereby improving the performance of the sound transducer.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: June 21, 2022
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventor: Yannick Kervran
  • Patent number: 11212601
    Abstract: A sound transducer includes a substrate including a first surface, a second surface, and a cavity, a support structure disposed on the first surface and including an inner peripheral edge and a third surface, a fixing structure disposed on the third surface, a moving structure including an exterior peripheral edge and a fourth surface, a first set of comb fingers fixed to the inner peripheral edge, extending toward the moving structure, and being electrically isolated from the fixing structure and the moving structure, a second set of comb fingers fixed to the exterior peripheral edge, extending toward the support structure, and interdigitated with the first set of comb fingers, and an elastic connecting structure including a first connecting part connected to the fourth surface, a second connecting part connected to the fixing structure, and an elastic body; the moving structure is disposed above the cavity.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: December 28, 2021
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventor: Yannick Kervran
  • Patent number: 11159893
    Abstract: The present invention discloses a MEMS sound transducer. The sound transducer includes: a substrate having a back cavity; a stator, the stator having a central portion suspending on the back cavity and at least two fixed arms extending from the center portion to the substrate and fixed on the substrate; a movable cantilever, mounted to the substrate, at least partially facing the back cavity and disposed between two adjacent fixed arms; wherein, the movable cantilever has a fixed end mounted to the substrate and a free edge facing the fixed arms with space; the free edge has a plurality of moving comb-fingers formed thereon; the stator has a plurality of fixed comb-fingers formed on the fixed arms; the moving comb-fingers and the fixed comb-fingers fit to each other to form a capacitor with an overlap area.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: October 26, 2021
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventor: Yannick Kervran
  • Publication number: 20210258700
    Abstract: Provided is an optical microphone, including: an inner cavity and a sound inlet that allows the communication between the inner cavity and outside; an optoelectronic module including a light generator module and a light detector module; a MEMS module adjacent to the sound inlet and including a grating and a flexible diaphragm; and an ASIC module. The sound inlet is arranged in a shell wall of the shell. The optoelectronic module is arranged on another shell wall of the shell opposite to the sound inlet. A part of light emitted by the light generator module is diffracted by the grating, is incident on the flexible diaphragm and then is reflected to the light detector module by the flexible diaphragm, and another part of the light emitted by the light generator module is reflected to the light detector module by the reflective layer of the grating.
    Type: Application
    Filed: February 17, 2020
    Publication date: August 19, 2021
    Inventor: Yannick Kervran
  • Publication number: 20160302901
    Abstract: The invention relates to a system and method for determining the occlusal surface of a patient's jaw. The system comprises a contact-detecting member designed to be inserted between the patient's teeth and means for calculating the distribution of occlusal forces in order to produce a map. The detector member comprises a removable flexible plate formed by a sheet of flexible plastic material solidly connected to a grid of pressure sensors comprising a first layer including three layers, two electrode layers sandwiching an intermediate layer having a resistivity that varies according to the pressure applied thereto. The electrodes define so-called intersection zones forming at least 5000 sensors having a square cross-section of less than or equal to 600 micrometres. The intermediate layer comprises a microcrystalline silicon semiconductor wafer having a thickness less than or equal to 50 nanometres.
    Type: Application
    Filed: December 3, 2014
    Publication date: October 20, 2016
    Applicant: ODAXOS
    Inventors: Olivier Brel, Geneviève Brel, Yannick Kervran, Tayeb Mohammed-Brahim, Samuel Cran, Olivier Le Monies de Sagazan