Abstract: Apparatus for selective electrolytic deposition of a metal such as a noble metal such as gold onto the inside surface of bush type hollow bodies such as connector contact members comprising at least one system comprising substantially coaxial injector nozzle and suction nozzle. The suction nozzle has a diameter greater than that of the injector nozzle. Each bush to be plated is positioned facing a system so that the bush, the injector nozzle and the suction nozzle are in alignment, so that the injector nozzle does not enter the bush and so that a peripheral gap remains between the bush and the suction nozzle. A liquid electrolyte charged with a salt of the metal to be deposited is injected via the injector nozzles. An electrode is in electrical contact with the liquid electrolyte on the exit side of the injector nozzles. An electric current is passed between the bush and the electrode.