Patents by Inventor Yannick Vidal

Yannick Vidal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11876311
    Abstract: A sensor device includes an electrically conductive body adapted to accommodate a first printed circuit board (PCB) and a second PCB, a flexible electrically conductive device connecting the first PCB and the second PCB, and an electrically conductive spring held between the first PCB and the second PCB by a snap-fit, a form-fit or a press-fit connection. A first portion of the electrically conductive spring is pressed against one of the first PCB and the second PCB and a second portion of the electrically conductive spring is pressed against the electrically conductive body to maintain an electrical connection between the electrically conductive body, the first PCB, and the second PCB.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: January 16, 2024
    Assignee: MEAS France
    Inventors: Vincent Leger, Yannick Vidal, Jerome Duclos
  • Publication number: 20230016596
    Abstract: A sensor includes a printed circuit board having a first region and a second region linked together by a flexible linking portion. A free end portion of the first region opposite the flexible linking portion is movable with respect to the second region. The flexible linking portion is part of the printed circuit board.
    Type: Application
    Filed: July 15, 2022
    Publication date: January 19, 2023
    Applicant: MEAS France
    Inventors: Emilien Durupt, Yannick Vidal, Vincent Leger
  • Publication number: 20220216628
    Abstract: A sensor device includes an electrically conductive body adapted to accommodate a first printed circuit board (PCB) and a second PCB, a flexible electrically conductive device connecting the first PCB and the second PCB, and an electrically conductive spring held between the first PCB and the second PCB by a snap-fit, a form-fit or a press-fit connection. A first portion of the electrically conductive spring is pressed against one of the first PCB and the second PCB and a second portion of the electrically conductive spring is pressed against the electrically conductive body to maintain an electrical connection between the electrically conductive body, the first PCB, and the second PCB.
    Type: Application
    Filed: January 4, 2022
    Publication date: July 7, 2022
    Applicant: MEAS France
    Inventors: Vincent Leger, Yannick Vidal, Jerome Duclos
  • Patent number: 11118967
    Abstract: The present invention relates to a radiation sensor, in particular for use with a vehicle sunload sensor arrangement. Furthermore, the present invention also relates to such a vehicle sensor arrangement and to a method of assembling a vehicle sensor arrangement. A radiation sensor comprises at least one first and one second photodetector, and a radiation shaping element, wherein said radiation shaping element comprises radiation blocking means for forming at least one aperture through which the radiation has limited access to said first and second photodetectors, and wherein said first and second photodetectors are arranged on a substrate and are distanced apart from each other along a sensor axis, and wherein the radiation blocking means is formed by a radiation screen mounted on the substrate to encompass the first and second photodetectors.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: September 14, 2021
    Assignee: MEAS FRANCE
    Inventors: Jean Milpied, Emilien Durupt, Yannick Vidal, David Mirassou
  • Publication number: 20210208015
    Abstract: A sensing device for a windshield includes an attachment member attachable to a surface of the windshield and a sensing element having a transducer. The attachment member has a pressing device. The pressing device applies a pressure on or over the transducer when the attachment member is attached to the surface and presses the transducer against the surface.
    Type: Application
    Filed: March 25, 2021
    Publication date: July 8, 2021
    Applicant: MEAS FRANCE
    Inventors: Vincent Leger, Yannick Vidal
  • Publication number: 20210102845
    Abstract: A temperature sensor device for sensing a temperature of a windshield of a vehicle includes a single printed circuit board having a circuitry, a temperature sensor mounted on the printed circuit board, and a thermally conductive pad attached to the temperature sensor. The thermally conductive pad is arranged to thermally and mechanically directly contact the windshield.
    Type: Application
    Filed: September 8, 2020
    Publication date: April 8, 2021
    Applicant: MEAS France
    Inventors: Yannick Vidal, Vincent Leger
  • Patent number: 10627264
    Abstract: A sensor mounting system for mounting onto a sensor mounting bracket a sensing device and a cover that covers the sensing device. The sensing device is mounted onto the sensor mounting bracket by sliding from a sensing device delivery position to a sensing device mounted position. The cover pivots relative to the sensing device from a cover delivery position to a cover locked position. When the sensing device is mounted onto the sensor mounting bracket, the cover is in the cover delivery position and contacts the sensor mounting bracket such that by pivoting the cover towards the cover locked position, the cover causes sliding of the sensing device into the sensing device mounted position.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: April 21, 2020
    Assignee: MEAS FRANCE
    Inventor: Yannick Vidal
  • Publication number: 20190277689
    Abstract: The present invention relates to a radiation sensor, in particular for use with a vehicle sunload sensor arrangement. Furthermore, the present invention also relates to such a vehicle sensor arrangement and to a method of assembling a vehicle sensor arrangement. A radiation sensor comprises at least one first and one second photodetector, and a radiation shaping element, wherein said radiation shaping element comprises radiation blocking means for forming at least one aperture through which the radiation has limited access to said first and second photodetectors, and wherein said first and second photodetectors are arranged on a substrate and are distanced apart from each other along a sensor axis, and wherein the radiation blocking means is formed by a radiation screen mounted on the substrate to encompass the first and second photodetectors.
    Type: Application
    Filed: March 7, 2019
    Publication date: September 12, 2019
    Applicant: MEAS France SAS
    Inventors: Jean Milpied, Emilien Durupt, Yannick Vidal, David Mirassou
  • Publication number: 20180038717
    Abstract: A sensor mounting system for mounting onto a sensor mounting bracket a sensing device and a cover that covers the sensing device. The sensing device is mounted onto the sensor mounting bracket by sliding from a sensing device delivery position to a sensing device mounted position. The cover pivots relative to the sensing device from a cover delivery position to a cover locked position. When the sensing device is mounted onto the sensor mounting bracket, the cover is in the cover delivery position and contacts the sensor mounting bracket such that by pivoting the cover towards the cover locked position, the cover causes sliding of the sensing device into the sensing device mounted position.
    Type: Application
    Filed: August 4, 2017
    Publication date: February 8, 2018
    Applicant: MEAS France
    Inventor: Yannick Vidal