Patents by Inventor Yannick Vuillermet
Yannick Vuillermet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11940470Abstract: A substrate, comprising one or more first conductive layers, one or more second conductive layers, and a dielectric material that is arranged to encapsulate, at least in part, the first conductive layers and the second conductive layers. The one or more second conductive layers are electrically coupled to the first conductive layers. The first conductive layers and the second conductive layers are arranged to form a conductor. The first conductive layers are arranged to define a first rift in the conductor.Type: GrantFiled: May 31, 2022Date of Patent: March 26, 2024Assignee: Allegro MicroSystems, LLCInventors: Loïc André Messier, Simon E. Rock, Yannick Vuillermet
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Patent number: 11892476Abstract: Current sensor packages are described including a leadframe configured to carry a current to be sensed and a current sensor that is electrically isolated from the leadframe. The current sensor is disposed adjacent to a first portion of the leadframe that includes a plurality of notches. An encapsulating material is configured to encapsulate the current sensor and at least a part of the first portion of the leadframe that is adjacent to the current sensor and includes the plurality of notches. The current sensor includes a substrate, a first magnetic field sensing element that is formed on the substrate, and a second magnetic field sensing element that is formed on the substrate. The first magnetic field sensing element and the second magnetic field sensing element are disposed on opposite sides of a central axis of the first portion of the leadframe.Type: GrantFiled: February 15, 2022Date of Patent: February 6, 2024Assignee: Allegro MicroSystems, LLCInventors: Simon E. Rock, Thomas Kerdraon, Yannick Vuillermet, Loïc André Messier, Andreas P. Friedrich
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Patent number: 11885866Abstract: Auto-calibrating current sensor integrated circuits (ICs) are configured for mounting at a position relative to a conductor. The auto-calibrating current sensor ICs can include a plurality of magnetic field sensing elements disposed at different locations within the integrated circuit, respectively, and can be configured to measure a magnetic field produced by a current carried by the conductor. The auto-calibrating sensors can include an electromagnetic model of the IC and the conductor. The model can be operative to determine a magnetic field at points in space due to a given current in the conductor at a known location of the conductor from the IC, and also the inverse situation of determining an unknown current and/or location of the conductor based on measurements of a magnetic field at known locations in space due to an unknown current in the conductor. Related auto-calibration methods are also described.Type: GrantFiled: May 31, 2022Date of Patent: January 30, 2024Assignee: Allegro MicroSystems, LLCInventors: Yannick Vuillermet, Loïc André Messier, Simon E. Rock, Maxwell McNally, Alexander Latham, Andreas P. Friedrich
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Publication number: 20240027560Abstract: Auto-calibrating current sensor integrated circuits (ICs) are configured for mounting at a position relative to a conductor. The auto-calibrating current sensor ICs can include a plurality of magnetic field sensing elements disposed at different locations within the integrated circuit, respectively, and can be configured to measure a magnetic field produced by a current carried by the conductor. The auto-calibrating sensors can include an electromagnetic model of the IC and the conductor. The model can be operative to determine a magnetic field at points in space due to a given current in the conductor at a known location of the conductor from the IC, and also the inverse situation of determining an unknown current and/or location of the conductor based on measurements of a magnetic field at known locations in space due to an unknown current in the conductor. Related auto-calibration methods are also described.Type: ApplicationFiled: October 4, 2023Publication date: January 25, 2024Applicant: Allegro MicroSystems, LLCInventors: Yannick Vuillermet, Loïc André Messier, Simon E. Rock, Maxwell McNally, Alexander Latham, Andreas P. Friedrich
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Publication number: 20240004016Abstract: Auto-calibrating current sensor integrated circuits (ICs) are configured for mounting at a position relative to a conductor. The auto-calibrating current sensor ICs can include a plurality of magnetic field sensing elements disposed at different locations within the integrated circuit, respectively, and can be configured to measure a magnetic field produced by a current carried by the conductor. The auto-calibrating sensors can include an electromagnetic model of the IC and the conductor. The model can be operative to determine a magnetic field at points in space due to a given current in the conductor at a known location of the conductor from the IC, and also the inverse situation of determining an unknown current and/or location of the conductor based on measurements of a magnetic field at known locations in space due to an unknown current in the conductor. Related auto-calibration methods are also described.Type: ApplicationFiled: May 31, 2022Publication date: January 4, 2024Applicant: Allegro MicroSystems, LLCInventors: Yannick Vuillermet, Loïc André Messier, Simon E. Rock, Maxwell McNally, Alexander Latham, Andreas P. Friedrich
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Publication number: 20230417802Abstract: A current sensor system includes a current sensor integrated circuit (IC) and a printed circuit board (PCB) having a ground plane with a feature configured to reduce an eddy current. The current sensor IC includes a lead frame comprising a die attach pad and at least one lead, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface, at least one magnetic field sensing element supported by the semiconductor die and configured to sense a current in a proximate primary conductor, and a non-conductive mold material enclosing the semiconductor die and a portion of the at least one lead. The PCB ground plane feature can take various forms such as a hole of a dimension larger than the current sensor IC, elongated cuts, or x-shaped cuts.Type: ApplicationFiled: June 27, 2022Publication date: December 28, 2023Applicant: Allegro MicroSystems, LLCInventors: Yannick Vuillermet, Loïc André Messier
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Publication number: 20230384352Abstract: A substrate, comprising one or more first conductive layers, one or more second conductive layers, and a dielectric material that is arranged to encapsulate, at least in part, the first conductive layers and the second conductive layers. The one or more second conductive layers are electrically coupled to the first conductive layers. The first conductive layers and the second conductive layers are arranged to form a conductor. The first conductive layers are arranged to define a first rift in the conductor.Type: ApplicationFiled: May 31, 2022Publication date: November 30, 2023Applicant: Allegro MicroSystems, LLCInventors: Loïc André Messier, Simon E. Rock, Yannick Vuillermet
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Publication number: 20230333147Abstract: A current sensor assembly can include: a coil structure having a first coil and a second coil connected in series, the coil structure configured to generate a differential magnetic field responsive to an electrical current passing through the first and second coils; a first magnetic field sensing element disposed proximate to the first coil and operable to generate a first signal responsive to the differential magnetic field passing through the first magnetic field sensing element in a first direction; a second magnetic field sensing element disposed proximate to the second coil and operable to generate a second signal responsive to the differential magnetic field passing through the second magnetic field sensing element in a second direction; and a circuit operable to subtract the first and second signals to generate a differential signal proportional to the electrical current.Type: ApplicationFiled: April 15, 2022Publication date: October 19, 2023Applicant: Allegro MicroSystems, LLCInventors: Loïc André Messier, Yannick Vuillermet, Andreas P. Friedrich
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Publication number: 20230332965Abstract: A heterogeneous sensor system includes a magnetic field sensor and an inductive sensor. A checker is configured to receive the magnetic field sensor output signal and the inductive sensor output signal and determine whether an error has occurred based on a comparison of the magnetic field sensor output signal and the inductive sensor output signal. Targets include at least a portion that is conductive and may include a ferromagnetic portion for back biased magnetic sensing. Additional features include on axis and off axis positioning of the sensors with respect to the target, multi-track targets for absolute position sensing, angle sensing and torque sensing configurations.Type: ApplicationFiled: April 14, 2022Publication date: October 19, 2023Applicant: Allegro MicroSystems, LLCInventors: Emanuele Andrea Casu, Yannick Vuillermet, Andreas P. Friedrich
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Publication number: 20230298779Abstract: A system, comprising a bus bar having a first through-hole formed therein and a first current sensor that is disposed adjacent to the first branch. The first through-hole is arranged to define, at least in part, a first branch of the bus bar and a second branch of the bus bar. The first branch has different length and/or thickness than the second branch. The first current sensor is arranged to measure an electrical current through the bus bar.Type: ApplicationFiled: March 15, 2022Publication date: September 21, 2023Applicant: Allegro MicroSystems, LLCInventors: Loïc André Messier, Yannick Vuillermet, Evan Shorman, Simon E. Rock, Andreas P. Friedrich
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Publication number: 20230258693Abstract: Current sensor packages are described including a leadframe configured to carry a current to be sensed and a current sensor that is electrically isolated from the leadframe. The current sensor is disposed adjacent to a first portion of the leadframe that includes a plurality of notches. An encapsulating material is configured to encapsulate the current sensor and at least a part of the first portion of the leadframe that is adjacent to the current sensor and includes the plurality of notches. The current sensor includes a substrate, a first magnetic field sensing element that is formed on the substrate, and a second magnetic field sensing element that is formed on the substrate. The first magnetic field sensing element and the second magnetic field sensing element are disposed on opposite sides of a central axis of the first portion of the leadframe.Type: ApplicationFiled: February 15, 2022Publication date: August 17, 2023Applicant: Allegro MicroSystems, LLCInventors: Simon E. Rock, Thomas Kerdraon, Yannick Vuillermet, Loïc André Messier, Andreas P. Friedrich
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Publication number: 20230251290Abstract: A system, comprising: a printed circuit board; a first conductor having a first central longitudinal axis, the first conductor having a first through-hole that is formed therein; a second conductor having a second central longitudinal axis; and a first current sensor that is mounted on the printed circuit board, the first current sensor being disposed at least partially inside the first through-hole, the first current sensor including a first pair of magnetic field sensing elements, the magnetic field sensing elements in the first pair being aligned with a first alignment axis that is arranged at a first angle relative to the second central longitudinal axis, the first angle being less than 75 degrees.Type: ApplicationFiled: April 14, 2023Publication date: August 10, 2023Applicant: Allegro MicroSystems, LLCInventors: Yannick Vuillermet, Rémy Lassalle-Balier
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Patent number: 11656250Abstract: A current sensor system, includes: a plurality of conductors that are integrated into a substrate, each of the plurality of conductors having a respective first through-hole formed therein and a plurality of current sensors, each of the plurality of current sensors being disposed on the substrate. Each of the plurality of current sensors is disposed above or below the respective first through-hole of a different one of the plurality of conductors, and the substrate includes a plurality of conductive traces, each coupled to at least one of the plurality of current sensors.Type: GrantFiled: September 7, 2021Date of Patent: May 23, 2023Assignee: Allegro MicroSystems, LLCInventors: Yannick Vuillermet, Loïc André Messier
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Publication number: 20230071087Abstract: A current sensor system, includes: a plurality of conductors that are integrated into a substrate, each of the plurality of conductors having a respective first through-hole formed therein and a plurality of current sensors, each of the plurality of current sensors being disposed on the substrate. Each of the plurality of current sensors is disposed above or below the respective first through-hole of a different one of the plurality of conductors, and the substrate includes a plurality of conductive traces, each coupled to at least one of the plurality of current sensors.Type: ApplicationFiled: September 7, 2021Publication date: March 9, 2023Applicant: Allegro MicroSystems, LLCInventors: Yannick Vuillermet, Loïc André Messier
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Publication number: 20220397382Abstract: Methods and apparatus for prosing a sensor IC package having first and second sets of magnetic field sensing elements and a third set of magnetic field sensing elements located between the first and second positions, wherein the first, second, and third sets of magnetic field sensing elements have a first axis of sensitivity and a second axis of sensitivity, wherein the first and second axes of sensitivity are orthogonal. The sensor IC package is positioned in relation to a target comprising a two-pole magnet and the first and second axes of sensitivity are perpendicular to an axis about which the target rotates. Differential signals are processed to determine an absolute position of the target. A first secondary angle position is generated from the first and third sets of magnetic field sensing elements.Type: ApplicationFiled: June 10, 2021Publication date: December 15, 2022Applicant: Allegro MicroSystems, LLCInventors: Yannick Vuillermet, Andreas P. Friedrich
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Patent number: 11513141Abstract: A method can use a current sensor that can include a magnetic flux concentrator along with first and second magnetic field sensing elements disposed proximate to the magnetic flux concentrator, wherein the magnetic flux concentrator is operable to influence a direction of first and second magnetic fields at the first and second magnetic field sensing elements, respectively, the first and second magnetic fields resulting from an electrical current passing through a conductor, the first and second magnetic field sensing elements operable to generate first and second signals, respectively, in response to the first and second magnetic fields, respectively, wherein the current sensor can also include a differencing circuit operable to subtract the first and second signals to generate a difference signal related to the electrical current.Type: GrantFiled: June 30, 2021Date of Patent: November 29, 2022Assignee: Allegro MicroSystems, LLCInventors: Yannick Vuillermet, Cédric Gillet, Loïc André Messier, Xavier Blanc
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Patent number: 11385075Abstract: Methods and apparatus for an orientation insensitive speed sensor. Magnetic field sensing elements can be located on a circle, for example, to generate first and second channel signals which can be combined to generate an output signal. The location of the magnetic field sensing elements reduces the effects of stray fields. Embodiments can include true power own state processing to determine target position during start up.Type: GrantFiled: February 21, 2020Date of Patent: July 12, 2022Assignee: Allegro MicroSystems, LLCInventors: Andrea Foletto, Yannick Vuillermet, Florian Kulla
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Publication number: 20220155106Abstract: An apparatus, comprising: a transmitting coil; a first receiving coil having a first receiving coil portion and a second receiving coil portion, the first receiving coil portion and the second receiving coil portion being coupled to one another, and the first receiving coil portion and the second receiving coil portion each including N lobes, where N is an integer and N?1; a second receiving coil having a third receiving coil portion and a fourth receiving coil portion, the third receiving coil portion and the fourth receiving coil portion being coupled to one another, and the third receiving coil portion and the fourth receiving coil portion each including N lobes; wherein the first receiving coil is disposed over the second receiving coil.Type: ApplicationFiled: November 13, 2020Publication date: May 19, 2022Applicant: Allegro MicroSystems, LLCInventors: Emanuele Andrea Casu, Yannick Vuillermet
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Patent number: 11326903Abstract: An apparatus, comprising: a transmitting coil; a first receiving coil having a first receiving coil portion and a second receiving coil portion, the first receiving coil portion and the second receiving coil portion being coupled to one another, and the first receiving coil portion and the second receiving coil portion each including N lobes, where N is an integer and N?1; a second receiving coil having a third receiving coil portion and a fourth receiving coil portion, the third receiving coil portion and the fourth receiving coil portion being coupled to one another, and the third receiving coil portion and the fourth receiving coil portion each including N lobes; wherein the first receiving coil is disposed over the second receiving coil.Type: GrantFiled: November 13, 2020Date of Patent: May 10, 2022Assignee: Allegro MicroSystems, LLCInventors: Emanuele Andrea Casu, Yannick Vuillermet
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Patent number: 11226382Abstract: A current sensor system includes a plurality of conductors, each having a first major surface, a second major surface opposite the first major surface, and an aperture extending from the first major surface through a thickness of the conductor to the second major surface. Each of the plurality of conductors is configured to carry a current and wherein the apertures of each of the plurality of conductors are aligned with a common reference line. The current sensor system further includes a plurality of current sensors, each positioned at least partially in the aperture of a respective conductor and including one or more magnetic field sensing elements.Type: GrantFiled: April 7, 2020Date of Patent: January 18, 2022Assignee: Allegro MicroSystems, LLCInventors: David Augendre, Yannick Vuillermet