Patents by Inventor YAN-NING CHEN

YAN-NING CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High heat-dissipation circuit board assembly system and power supply including the same
    Patent number: 10064315
    Abstract: The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: August 28, 2018
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.
    Inventors: Chien-Hsiung Tsao, Yan-Ning Chen
  • HIGH HEAT-DISSIPATION CIRCUIT BOARD ASSEMBLY SYSTEM AND POWER SUPPLY INCLUDING THE SAME
    Publication number: 20170303427
    Abstract: The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.
    Type: Application
    Filed: October 19, 2016
    Publication date: October 19, 2017
    Inventors: CHIEN-HSIUNG TSAO, YAN-NING CHEN