Abstract: Various implementations described herein refer to a device having an encoder coupled to memory. The ECC encoder receives input data from memory built-in self-test circuitry, generates encoded data by encoding the input data and by adding check bits to the input data, and writes the encoded data to memory. The device may have an ECC decoder coupled to memory. The ECC decoder reads the encoded data from memory, generates corrected data by decoding the encoded data and by extracting the check bits from the encoded data, and provides the corrected data and double-bit error flag as output. The ECC decoder has error correction logic that performs error correction on the decoded data based on the check bits, wherein if the error correction logic detects a multi-bit error in the decoded data, the error correction logic corrects the multi-bit error in the decoded data to provide the corrected data.

Abstract: Various implementations described herein refer to a device having an encoder coupled to memory. The ECC encoder receives input data from memory built-in self-test circuitry, generates encoded data by encoding the input data and by adding check bits to the input data, and writes the encoded data to memory. The device may have an ECC decoder coupled to memory. The ECC decoder reads the encoded data from memory, generates corrected data by decoding the encoded data and by extracting the check bits from the encoded data, and provides the corrected data and double-bit error flag as output. The ECC decoder has error correction logic that performs error correction on the decoded data based on the check bits, wherein if the error correction logic detects a multi-bit error in the decoded data, the error correction logic corrects the multi-bit error in the decoded data to provide the corrected data.

Abstract: A computer-implemented method for designing a floorplan for an integrated circuit includes determining a circuit design for the integrated circuit, wherein the circuit design for the integrated circuit has a system device and a logic device. Logical definitions for the system device and the logic device are determined. A plurality of interconnect devices are determined. A plurality of interconnect figures of merit (FOMs) associated with the plurality of interconnect devices are also determined. The method includes determining, with an optimization operation, a candidate floorplan for the circuit design based upon the logical definitions for the system device, the logic device, the plurality of interconnect devices, and the interconnect FOMs for the interconnect devices. The candidate floorplan is determined based upon parameters associated with computational performance, power consumption, and physical area of the candidate floorplan for the circuit design.

Abstract: A computer-implemented method for designing a floorplan for an integrated circuit includes determining a circuit design for the integrated circuit, wherein the circuit design for the integrated circuit has a system device and a logic device. Logical definitions for the system device and the logic device are determined. A plurality of interconnect devices are determined. A plurality of interconnect figures of merit (FOMs) associated with the plurality of interconnect devices are also determined. The method includes determining, with an optimization operation, a candidate floorplan for the circuit design based upon the logical definitions for the system device, the logic device, the plurality of interconnect devices, and the interconnect FOMs for the interconnect devices. The candidate floorplan is determined based upon parameters associated with computational performance, power consumption, and physical area of the candidate floorplan for the circuit design.

Abstract: Various implementations described herein refer to an integrated circuit having first circuitry and second circuitry. The first circuitry receives first input data and bypasses error correction circuitry to determine whether the first input data has one or more first errors. The second circuitry receives second input data and enables the error correction circuitry to determine whether the second input data has one or more second errors.

Abstract: Briefly, embodiments of claimed subject matter relate to adjusting, such as extending, a clock signal to permit completion of a write operations to a first memory type and/or to permit completion of read operations from a second memory type, wherein the first memory type and the second memory type are dissimilar from each other. In certain embodiments, the first memory type may comprise a magnetic random-access memory (MRAM) cell array, and the second memory type may comprise a static random-access memory (SRAM) cell array.

Abstract: Various implementations described herein are directed to an integrated circuit with logic circuitry having one or more components. The integrated circuit may include performance sensing circuitry that provides a performance sensing output associated with detecting variation of switching delays of the one or more components forming the logic circuitry. The integrated circuit may include transient sensing circuitry that receives the performance sensing output and provides a transient sensing output for determining stability of operating conditions of the performance sensing circuitry during one or more sampling periods. The transient sensing circuitry may use a finite state machine (FSM) to sense and classify changes in temporal behavior of the transient sensing output.

Abstract: Briefly, embodiments of claimed subject matter relate to adjusting, such as extending, a clock signal to permit completion of a write operations to a first memory type and/or to permit completion of read operations from a second memory type, wherein the first memory type and the second memory type are dissimilar from each other. In certain embodiments, the first memory type may comprise a magnetic random-access memory (MRAM) cell array, and the second memory type may comprise a static random-access memory (SRAM) cell array.

Abstract: Various implementations described herein refer to a device having an encoder coupled to memory. The ECC encoder receives input data from memory built-in self-test circuitry, generates encoded data by encoding the input data and by adding check bits to the input data, and writes the encoded data to memory. The device may have an ECC decoder coupled to memory. The ECC decoder reads the encoded data from memory, generates corrected data by decoding the encoded data and by extracting the check bits from the encoded data, and provides the corrected data and double-bit error flag as output. The ECC decoder has error correction logic that performs error correction on the decoded data based on the check bits, wherein if the error correction logic detects a multi-bit error in the decoded data, the error correction logic corrects the multi-bit error in the decoded data to provide the corrected data.

Abstract: Various implementations described herein refer to an integrated circuit having first circuitry and second circuitry. The first circuitry receives first input data and bypasses error correction circuitry to determine whether the first input data has one or more first errors. The second circuitry receives second input data and enables the error correction circuitry to determine whether the second input data has one or more second errors.

Abstract: On chip diagnosis method and on chip diagnosis block with mixed redundancy (IO redundancy and word-register redundancy) is provided. During a BIST (Built-In Self Test), information needed to apply redundancy resources is stored inside two arrays (fill_array, shift_array) on chip. A final diagnosis may apply redundancy resources based on this stored information. The first array (fill_array) is used to keep a minimum error mapping and the second array (shift_array) is used to control the fill of the first array.

Abstract: A fuse blowing interface (7) for a memory chip (1) comprising a latch register for latching a calculated memory repair solution when a prefuse request signal is received from an external tester device (8); and a fuse blowing unit with electrical fuses which are blown according to the calculated memory repair solution when a blow request signal is received from the external tester device (8).

Abstract: On chip diagnosis method and on chip diagnosis block with mixed redundancy (IO redundancy and word-register redundancy) is provided. During a BIST (Built-In Self Test), information needed to apply redundancy resources is stored inside two arrays (fill_array, shift_array) on chip. A final diagnosis may apply redundancy resources based on this stored information. The first array (fill_array) is used to keep a minimum error mapping and the second array (shift_array) is used to control the fill of the first array.

Abstract: A fuse blowing interface (7) for a memory chip (1) comprising a latch register for latching a calculated memory repair solution when a prefuse request signal is received from an external tester device (8); and a fuse blowing unit with electrical fuses which are blown according to the calculated memory repair solution when a blow request signal is received from the external tester device (8).