Patents by Inventor Yanqin WU

Yanqin WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240344562
    Abstract: A liner configured to be mounted on a radially inner or outer surface of a bearing ring has a generally cylindrical base having first and second axial ends and at least one groove and at least one side wall extending radially from the first or second axial end. The liner is non-metallic and has a base portion covering the inner or outer surface of the bearing ring and a plurality of side wall sections extending radially over at least a portion of at least one axial side of the ring. The base is formed from a plurality of circumferentially adjacent axially extending subsections, each pair of which is connected by a least one hinge having a radial thickness less than a radial thickness of the base portion. Also a bearing assembly that includes a bearing housing and the bearing ring with the liner contacting the bearing housing.
    Type: Application
    Filed: April 3, 2024
    Publication date: October 17, 2024
    Inventors: Tianfu JIN, Zhangxu ZHOU, Han WU, Ricky Allan BURGESS, Yanqin GAO
  • Publication number: 20240028808
    Abstract: A method and a device for a chip layout, computer equipment, and a medium. The method includes steps of: determining external interfaces and internal interfaces of a chip, where the internal interface is a port of a component of the chip; constructing, according to the external interfaces and the internal interfaces, an objective function, where the objective function is applied to describe a wiring length of the chip; determining a target value of the objective function through a preset genetic algorithm, where the target value is applied to determine a first layout diagram of the chip; determining, based on an operation temperature of an internal chip as the component of the chip, a second layout diagram of the chip; performing an image fusion on the first layout diagram and the second layout diagram to obtain a target layout diagram of the chip.
    Type: Application
    Filed: July 19, 2023
    Publication date: January 25, 2024
    Inventors: Hongbin TU, Lufeng ZHANG, Xuan LI, Guang YI, Cheng LIAO, Xiyue ZHANG, Yi ZHENG, Yanqin WU, Haotian WANG, Chen GAO, Xiang ZHANG
  • Patent number: 9809895
    Abstract: A method of preparing aluminum alloy-resin composite and an aluminum alloy-resin composite obtained by the same are provided. of the method comprises: S1: anodizing a surface of an aluminum alloy substrate to form an oxide layer on the surface, the oxide layer including nanopores; S2: immersing the resulting aluminum alloy substrate obtained in step S1 in a buffer solution having a pH of about 10 to about 13, to form a corrosion pores on an outer surface of the oxide layer; and S3: injection molding a resin onto the surface of the resulting aluminum alloy substrate obtained in step S2 in a mold to obtain the aluminum alloy-resin composite.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: November 7, 2017
    Assignees: SHENZHEN BYD AUTO R&D COMPANY LIMITED, BYD COMPANY LIMITED
    Inventors: Jian Sun, Yanqin Wu, Qiang Guo, Liang Chen
  • Patent number: 9802388
    Abstract: A method of preparing an aluminum alloy resin composite comprises: providing an aluminum alloy substrate having an oxide layer on a surface thereof, wherein the oxide layer has one or more nanopores; forming one or more corrosion pores on an outer surface of the oxide layer by using a corrosion agent, wherein the corrosion agent is at least one selected from a group of ammonia, ammonium salt, hydrazine, hydrazine derivative, and water-soluble amine compound; and injection molding a resin composition to the surface of the aluminum alloy substrate.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: October 31, 2017
    Assignees: SHENZHEN BYD AUTO R&D COMPANY LIMITED, BYD COMPANY LIMITED
    Inventors: Jian Sun, Yanqin Wu, Qiang Guo, Liang Chen
  • Publication number: 20140363686
    Abstract: A method of preparing aluminum alloy-resin composite and an aluminum alloy-resin composite obtained by the same are provided. of the method comprises: S1: anodizing a surface of an aluminum alloy substrate to form an oxide layer on the surface, the oxide layer including nanopores; S2: immersing the resulting aluminum alloy substrate obtained in step S1 in a buffer solution having a pH of about 10 to about 13, to form a corrosion pores on an outer surface of the oxide layer; and S3: injection molding a resin onto the surface of the resulting aluminum alloy substrate obtained in step S2 in a mold to obtain the aluminum alloy-resin composite.
    Type: Application
    Filed: August 22, 2014
    Publication date: December 11, 2014
    Inventors: Jian SUN, Yanqin WU, Qiang GUO, Liang CHEN
  • Publication number: 20140363659
    Abstract: A method of preparing an aluminum alloy resin composite comprises: providing an aluminum alloy substrate having an oxide layer on a surface thereof, wherein the oxide layer has one or more nanopores; forming one or more corrosion pores on an outer surface of the oxide layer by using a corrosion agent, wherein the corrosion agent is at least one selected from a group of ammonia, ammonium salt, hydrazine, hydrazine derivative, and water-soluble amine compound; and injection molding a resin composition to the surface of the aluminum alloy substrate.
    Type: Application
    Filed: August 22, 2014
    Publication date: December 11, 2014
    Inventors: Jian SUN, Yanqin WU, Qiang GUO, Liang CHEN