Patents by Inventor Yanran DING

Yanran DING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shared-aperture antenna
    Patent number: 10879616
    Abstract: A shared-aperture antenna includes a first copper metal layer; a second copper metal layer; and a dielectric substrate layer sandwiched between the first copper metal layer and the second copper metal layer. The dielectric substrate layer includes a plurality of metallized vias. The first copper metal layer is in communication with the second copper metal layer via the plurality of metallized vias. The plurality of metallized vias includes first metallized vias forming an inner circular ring and second metallized vias forming an outer circular ring with respect to the center of the antenna. The first copper metal layer, the dielectric substrate layer, the second copper metal layer, and the first metallized vias form a substrate integrated waveguide (SIW) circular cavity slot antenna. The first copper metal layer, the dielectric substrate layer, the second copper metal layer, the first metallized vias and the second metallized vias form a coaxial cavity slot antenna.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: December 29, 2020
    Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA
    Inventors: Yujian Cheng, Yanran Ding, Jinfan Zhang, Chunxu Bai, Yong Fan, Kaijun Song, Xianqi Lin, Bo Zhang
  • SHARED-APERTURE ANTENNA
    Publication number: 20200076086
    Abstract: A shared-aperture antenna includes a first copper metal layer; a second copper metal layer; and a dielectric substrate layer sandwiched between the first copper metal layer and the second copper metal layer. The dielectric substrate layer includes a plurality of metallized vias. The first copper metal layer is in communication with the second copper metal layer via the plurality of metallized vias. The plurality of metallized vias includes first metallized vias forming an inner circular ring and second metallized vias forming an outer circular ring with respect to the center of the antenna. The first copper metal layer, the dielectric substrate layer, the second copper metal layer, and the first metallized vias form a substrate integrated waveguide (SIW) circular cavity slot antenna. The first copper metal layer, the dielectric substrate layer, the second copper metal layer, the first metallized vias and the second metallized vias form a coaxial cavity slot antenna.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 5, 2020
    Inventors: Yujian CHENG, Yanran DING, Jinfan ZHANG, Chunxu BAI, Yong FAN, Kaijun SONG, Xianqi LIN, Bo ZHANG