Abstract: An optical module configuration includes a circuit board and a transmitter optical subassembly. The circuit board includes an accommodation through opening. The transmitter optical subassembly includes a light emitting unit and a thin film LiNbOx modulator. The thin film LiNbOx modulator is optically coupled with the light emitting unit, and the thin film LiNbOx modulator is disposed in the accommodation through opening. The accommodation through opening allows placement of various thin film LiNbOx modulators supportive of different optical module specifications.

Abstract: A multi-channel wavelength division multiplexing light emitting device includes a casing and an optical communication assembly accommodated in the casing. The optical communication assembly includes a substrate, a plurality of first light emitting units disposed on the substrate, a plurality of second light emitting units disposed on the substrate, a first wavelength division multiplexer, and a second wavelength division multiplexer. The first light emitting units are arranged to correspond with the first wavelength division multiplexer. The second light emitting units are arranged to correspond with the second wavelength division multiplexer.

Abstract: A multi-channel wavelength division multiplexing light emitting device includes a casing and an optical communication assembly accommodated in the casing. The optical communication assembly includes a substrate, a plurality of first light emitting units disposed on the substrate, a plurality of second light emitting units disposed on the substrate, a first wavelength division multiplexer, and a second wavelength division multiplexer. The first light emitting units are arranged to correspond with the first wavelength division multiplexer. The second light emitting units are arranged to correspond with the second wavelength division multiplexer.