Patents by Inventor Yan Shan Li

Yan Shan Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Critical dimension for trench and vias
    Patent number: 8293545
    Abstract: Test structures including test trenches are used to define critical dimension of trenches in a via level of an integrated circuit to produce substantially the same depth. The trenches are formed at the periphery of the IC to serve as guard rings.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: October 23, 2012
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Hai Cong, Yan Shan Li, Chun Hui Low, Yelehanka Ramachandramurthy Pradeep, Liang Choo Hsia