Patents by Inventor Yansheng Hua

Yansheng Hua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating PCB board and PCB board
    Patent number: 9101084
    Abstract: A method of fabricating a printed circuit board is disclosed. The method includes opening a first window in a first base board and opening a second window in a second base board and a resin layer. The resin layer is between the second base board and the first base board. The method further includes bonding the first base board and the second base board through the resin layer; placing a heat dissipating conductor in the first window in the first base board through the second window; placing a resin portion on the first base board in the second window; embedding a sub-board in the second window of the second base board; and bonding the sub-board with the first base board through the resin portion.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: August 4, 2015
    Assignees: Peking University Founder Group Co., Ltd., Zhuhai Founder Tech. Multilayer PCB Co., Ltd., Zhuhai Founder PCB Development Co., Ltd.
    Inventor: Yansheng Hua