Abstract: The present invention relates to the use of piperphentonamine or pharmaceutically acceptable salts thereof to prevent/treat encephalopathy in mammals, and the use of a combination of piperphentonamine or pharmaceutically acceptable salts thereof and other medicines in manufacture a medicine to prevent/treat encephalopathy in mammals. The mammals include human beings, and the encephalopathy includes cerebral injury related diseases or cerebrovascular diseases. The cerebrovascular diseases refer to cerebral ischemia, cerebral ischemia/reperfusion-induced injury or cerebral hemorrhage. The cerebral hemorrhage includes hypertensive cerebral hemorrhage, cerebral hemorrhage secondary to infarction, tumor cerebral hemorrhage or cerebral hemorrhage caused by arteritis. The cerebral ischemia means carotid system cerebral ischemia or vertebrobasilar cerebral ischemia.

Abstract: A process is provided for simultaneously attaching surface-mount (SM) integrated circuit (IC) devices (12) and chip-on-board (COB) IC devices (22) to a circuit board (10) using a combined solder reflow and adhesive cure thermal cycle. The process generally entails placing SM and COB devices (12, 22) on the circuit board (10), such that a suitable solder composition (14) and adhesive (24) are present between the circuit board (10) and the SM and COB devices (12, 22), respectively. The circuit board (10) and devices (12, 22) are then heated so as to simultaneously cure the adhesive (24) and reflow the solder composition (14). A preferred heating step entails at least one thermal cycle that attains a peak temperature well above the cure temperature of the adhesive (24), as well as above the melting or liquidus temperature of the solder composition (14). Accordingly, the thermal cycle is employed to cure the adhesive (24) well outside its conventional cure limits.

Abstract: A process for depositing an encapsulating material (16) on and around a COB die (10) and other wire-bonded device, without producing voids that encourage premature fatigue fracturing of the material (16) and wires (14) that electrically connect the device (10) to a circuit board (12). The process generally entails mounting and wire bonding a die (10) to a circuit board (12) with multiple bond wires (14). The encapsulation material (16) is then deposited along a first edge (18) of the die, and sequentially along the remaining edges (20, 22, 24) of the die (10), each successive edge being contiguous with the preceding edge, until the entire perimeter of the die (10) is surrounded and contacted with the material (16). The encapsulation material (16) encapsulates only those portions of the wires (14) immediately adjacent the die (10), with the remainder of the wires (14) remaining exposed.