Patents by Inventor Yanwen Fei

Yanwen Fei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Test structures and models for estimating the yield impact of dishing and/or voids
    Patent number: 7348594
    Abstract: A test structure comprising a test pattern is formed on a substrate. The test pattern includes a first comb structure having a plurality of tines, and a second structure. The second structure may be a snake structure having a plurality of side walls or a second comb structure having a plurality of side walls. The tines of the first comb structure are positioned within side walls of the snake structure or second comb structure. The tines of the first comb structure are offset from a center of the side walls. Test data collected from the test structure are analyzed, to estimate product yield. The test structure may have a lower layer pattern, such that topographical variations of the lower layer pattern propagate to an upper layer pattern of the test structure.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: March 25, 2008
    Assignee: PDF Solutions, Inc.
    Inventors: Dennis J. Ciplickas, Brian E. Stine, Yanwen Fei
  • Test structures and models for estimating the yield impact of dishing and/or voids
    Publication number: 20050074908
    Abstract: A test structure comprising a test pattern is formed on a substrate. The test pattern includes a first comb structure having a plurality of tines, and a second structure. The second structure may be a snake structure having a plurality of side walls or a second comb structure having a plurality of side walls. The tines of the first comb structure are positioned within side walls of the snake structure or second comb structure. The tines of the first comb structure are offset from a center of the side walls. Test data collected from the test structure are analyzed, to estimate product yield. The test structure may have a lower layer pattern, such that topographical variations of the lower layer pattern propagate to an upper layer pattern of the test structure.
    Type: Application
    Filed: October 8, 2004
    Publication date: April 7, 2005
    Inventors: Dennis Ciplickas, Brian Stine, Yanwen Fei