Patents by Inventor Yanyan Xia

Yanyan Xia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Measurement machine and method for detecting a defect in solder joints
    Patent number: 11927436
    Abstract: Example implementations relate to an inspection method for training a measurement machine to accurately measure side joint lengths and detecting a defect among a plurality of solder joints. The method includes receiving a first data representing the side joint lengths of the plurality of solder joints measured by a first measurement machine and a second data representing the side joint lengths measured by a second measurement machine. Further, the method includes determining a correlation value based on a statistical analysis of a relationship between the first data and the second data. The method further includes updating an algorithm used by the first measurement machine to measure the side joint lengths, based on the correlation value to reduce deviation between the first data and the second data. Later, the updated algorithm is used as a dimensional metrology in the first measurement machine for detecting the defect in the solder joints.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: March 12, 2024
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Jaime E. Llinas, Saravanan Rathakrishnan, Yanyan Xia, ZeLin Wu, Yanli Li, JunHui Li, Jian Miremadi
  • MEASUREMENT MACHINE AND METHOD FOR DETECTING A DEFECT IN SOLDER JOINTS
    Publication number: 20230059410
    Abstract: Example implementations relate to an inspection method for training a measurement machine to accurately measure side joint lengths and detecting a defect among a plurality of solder joints. The method includes receiving a first data representing the side joint lengths of the plurality of solder joints measured by a first measurement machine and a second data representing the side joint lengths measured by a second measurement machine. Further, the method includes determining a correlation value based on a statistical analysis of a relationship between the first data and the second data. The method further includes updating an algorithm used by the first measurement machine to measure the side joint lengths, based on the correlation value to reduce deviation between the first data and the second data. Later, the updated algorithm is used as a dimensional metrology in the first measurement machine for detecting the defect in the solder joints.
    Type: Application
    Filed: August 17, 2021
    Publication date: February 23, 2023
    Inventors: Jaime E. Llinas, Saravanan Rathakrishnan, Yanyan Xia, ZeLin Wu, Yanli Li, JunHui Li, Jian Miremadi