Patents by Inventor Yanyong SONG

Yanyong SONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240411184
    Abstract: An array substrate includes a substrate, signal lines, conductive bumps, an insulating layer, and thin film transistors each including a gate, source, and drain. The conductive blocks are disposed on a portion of the substrate located in a bonding region. The insulating layer is located between every two adjacent conductive bumps. A distance from a surface of a conductive metal layer included in a conductive bump away from the substrate to the substrate is less than or equal to a distance from a surface of the insulating layer away from the substrate to the substrate. The gate and signal lines are disposed in a same layer. The conductive metal layer is disposed in a same layer as the source and drain. On the substrate, an orthogonal projection of the conductive metal layer is located within an orthogonal projection of a signal line connected to the conductive metal layer.
    Type: Application
    Filed: August 22, 2024
    Publication date: December 12, 2024
    Inventors: Yanyong SONG, Yanfeng LI, Haoyi XIN, Xu QIAO, Chenrong QIAO, Wei REN, Yu XING, Jingjing XU, Rula SHA, Guolei ZHI, Guangshuai WANG, Liwen XIN, Jingwei HOU
  • Patent number: 12105383
    Abstract: An array substrate has a display area and a bezel area located on at least one side of the display area. The bezel area includes a bonding region. The array substrate includes a substrate, a plurality of signal lines, a plurality of conductive bumps, and an insulating layer. The signal lines are disposed on the substrate. The conductive blocks are disposed on a portion of the substrate located in the bonding region, and a conductive bump is connected to at least one signal line. The insulating layer covers the plurality of signal lines and is located between every two adjacent conductive bumps. The conductive bump includes a conductive metal layer. A distance from a surface of the conductive metal layer away from the substrate to the substrate is less than or equal to a distance from a surface of the insulating layer away from the substrate to the substrate.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: October 1, 2024
    Assignees: ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yanyong Song, Yanfeng Li, Haoyi Xin, Xu Qiao, Chenrong Qiao, Wei Ren, Yu Xing, Jingjing Xu, Rula Sha, Guolei Zhi, Guangshuai Wang, Liwen Xin, Jingwei Hou
  • Patent number: 12072586
    Abstract: A pixel electrode, including: a plurality of strip-shaped first electrodes, where the plurality of the first electrodes are arranged along a first direction, each of the first electrodes extends along a second direction, and the second direction intersects with the first direction; a second electrode, where the second electrode is connected to first ends of the plurality of first electrodes, and the first ends of the plurality of first electrodes are connected through the second electrode; and a third electrode, where the third electrode is connected to a second end of at least one of the first electrodes, and a direction of an electric field of an area in which the third electrode is disposed intersects with both the first direction and the second direction.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: August 27, 2024
    Assignees: Ordos Yuansheng Optoelectronics Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Wei Ren, Wei Li, Yanfeng Li, Haoyi Xin, Jing Li, Jingjing Xu, Chenrong Qiao, Yanyong Song, Xu Qiao, Rula Sha, Min Zhang
  • Publication number: 20230296942
    Abstract: A pixel electrode, including: a plurality of strip-shaped first electrodes, where the plurality of the first electrodes are arranged along a first direction, each of the first electrodes extends along a second direction, and the second direction intersects with the first direction; a second electrode, where the second electrode is connected to first ends of the plurality of first electrodes, and the first ends of the plurality of first electrodes are connected through the second electrode; and a third electrode, where the third electrode is connected to a second end of at least one of the first electrodes, and a direction of an electric field of an area in which the third electrode is disposed intersects with both the first direction and the second direction.
    Type: Application
    Filed: December 11, 2020
    Publication date: September 21, 2023
    Inventors: Wei REN, Wei LI, Yanfeng LI, Haoyi XIN, Jing LI, Jingjing XU, Chenrong QIAO, Yanyong SONG, Xu QIAO, Rula SHA, Min ZHANG
  • Publication number: 20230047799
    Abstract: Provided is a pixel structure. The pixel structure includes: a first electrode, a second electrode, and a liquid crystal layer that are disposed on one side of a substrate and successively stacked, wherein one of the first electrode and the second electrode is a pixel electrode and the other of the first electrode and the second electrode is a common electrode, and the second electrode includes a plurality of electrode branches sequentially arranged in a first direction, wherein each of the electrode branches includes a first end portion, a body portion, and a second end portion that are successively connected in a second direction, the body portion including at least one body segment.
    Type: Application
    Filed: October 28, 2022
    Publication date: February 16, 2023
    Inventors: Wei REN, Wei LI, Yanfeng LI, Haoyi XIN, Jing LI, Jingjing XU, Chenrong QIAO, Yanyong SONG, Xu QIAO, Rula SHA, Min ZHANG
  • Publication number: 20220291538
    Abstract: An array substrate has a display area and a bezel area located on at least one side of the display area. The bezel area includes a bonding region. The array substrate includes a substrate, a plurality of signal lines, a plurality of conductive bumps, and an insulating layer. The signal lines are disposed on the substrate. The conductive blocks are disposed on a portion of the substrate located in the bonding region, and a conductive bump is connected to at least one signal line. The insulating layer covers the plurality of signal lines and is located between every two adjacent conductive bumps. The conductive bump includes a conductive metal layer. A distance from a surface of the conductive metal layer away from the substrate to the substrate is less than or equal to a distance from a surface of the insulating layer away from the substrate to the substrate.
    Type: Application
    Filed: April 14, 2021
    Publication date: September 15, 2022
    Applicants: ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yanyong SONG, Yanfeng LI, Haoyi XIN, Xu QIAO, Chenrong QIAO, Wei REN, Yu XING, Jingjing XU, Rula SHA, Guolei ZHI, Guangshuai WANG, Liwen XIN, Jingwei HOU