Abstract: The disclosure provides an electronic device. The electronic device includes a plurality of units. Each of the units includes an integrated substrate. The integrated substrate includes a first dielectric layer, a first conductive layer, a second dielectric layer, and a second conductive layer. The first dielectric layer has a first side and a second side opposite to the first side. The first conductive layer is disposed on the first side. The second dielectric layer has a third side facing the second side and a fourth side opposite to the third side. The second conductive layer is disposed on the fourth side. A loss tangent of at least one of the first dielectric layer and the second dielectric layer is less than or equal to 0.1 and greater than 0. The electronic device of an embodiment of the disclosure may improve product yield.

Abstract: An electronic device includes a carrier, a first electronic element, and a first connecting element. The carrier has a first bonding pad, a first conductive layer, a second conductive layer and an insulating layer with a via. The first conductive layer is disposed between the first bonding pad and the insulating layer, and electrically connected to the second conductive layer through the via. The first electronic element is disposed on the carrier and has a substrate. The first connecting element is disposed between the top surface of the first bonding pad and the first electronic element and electrically connected to the first bonding pad and the first electronic element. The substrate has a through hole which is overlapped with the first bonding pad and the first connecting element. A minimum distance between the through hole and the via is greater than zero.

Abstract: Disclosed is a reconfigurable surface configured to modulate a phase of an electromagnetic wave. The reconfigurable surface includes a first substrate, a plurality of modulating units, and a ground signal layer. The plurality of modulating units are disposed on the first substrate. One of the plurality of modulating units includes a first electrode, a second electrode, and a modulating medium. The first electrode is disposed on the first substrate. The second electrode is disposed adjacent to the first electrode. The modulating medium is located between the first electrode and the second electrode. The ground signal layer is disposed under the first substrate. A manufacturing method of a reconfigurable surface is also provided.

Abstract: An electronic device includes a carrier, a plurality of electronic elements and a connecting terminal. The carrier has at least one bonding pad. The electronic elements are disposed on the carrier, and each of the electronic elements includes a substrate. A distance between two adjacent substrates of the electronic elements is not less than 300 ?m. The connecting terminal is disposed between one of the substrate and the carrier. One of the electronic elements are electrically connected to the at least one bonding pad via the connecting terminal.

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes an antenna structure, a first circuit structure, and a chip. The antenna structure includes a first dielectric layer, a first metal pattern, a second dielectric layer, and a second metal pattern. The first dielectric layer has a first surface and a second surface. The first metal pattern is disposed on the first surface. The second dielectric layer is disposed on the first metal pattern. The second metal pattern is disposed on the second dielectric layer. The first circuit structure is disposed on the antenna structure, and includes a third dielectric layer, a first conductive layer, and a first pad. The third dielectric layer is disposed on the second surface and has a fourth surface away from the second surface. The first conductive layer is disposed on the fourth surface. The first pad is disposed on the first conductive layer.

Abstract: An electronic device includes a carrier having at least one bonding pad, a plurality of electronic elements disposed on the carrier and one of the electronic elements including a substrate and at least one connecting terminal disposed between the substrate and the carrier. The electronic elements are electrically connected to the at least one bonding pad via the at least one connecting terminal.

Abstract: A modulation method and a modulation device for modulating beamforming are provided. The modulation method includes: providing a memory element that stores a beamforming table; providing a driving element; providing a plurality of modulation element groups; providing a signal source to provide at least one initial electromagnetic wave to the modulation element groups; providing a plurality of driving signals corresponding to the modulation element groups according to the beamforming table by the driving element; modulating the at least one initial electromagnetic wave to be a main wave beam with a specific radiation waveform according to the drive signals by the modulation element groups.

Abstract: A manufacturing method of an electronic device includes the following steps. First, a curved substrate is formed. Next, a first conductive layer is formed on a first insulating layer. Then, a second conductive layer is formed on a second insulating layer. Thereafter, the first insulating layer and the second insulating layer are bonded to the curved substrate. The manufacturing method of the electronic device may reduce problems such as peeling and/or offset of the manufactured electronic device.

Abstract: An electronic device is provided. The electronic device includes a first substrate and a first pattern layer. The first substrate has a first surface and a second surface opposite to each other. The first pattern layer is disposed on the first surface and includes a first grid region and a second grid region. The first grid region includes multiple first grids. The second grid region includes multiple second grids. The first grid region is connected to the second grid region. One of the first grid and the second grid includes a metal grid. The other one of the first grid and the second grid includes a non-metal grid. The electronic device of the embodiment of the disclosure can improve appearance.

Abstract: A detection device detects an output electromagnetic wave signal passing through a test object. The detection device includes an electromagnetic wave signal generating unit, an output element, a receiving element and a measuring unit. The electromagnetic wave signal generating unit is used for generating an initial electromagnetic wave signal. The output element is used for outputting the initial electromagnetic wave signal. The receiving element is used for receiving the output electromagnetic wave signal. The measuring unit is used for measuring the value of the output electromagnetic wave signal.

Abstract: An antenna device includes a first grid layer, a second grid layer, and a first insulation layer. The first grid layer has a first function region. The second grid layer has a second function region and a second dummy region electrically insulated from the second function region. The first insulation layer is disposed between the first grid layer and the second grid layer, and the first function region overlaps the second function region.

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, a first metal layer, a first insulating layer, a second metal layer, and a second insulating layer. The first metal layer is disposed on the substrate and configured to transmit a ground signal. The first insulating layer is disposed on the first metal layer and includes at least one first opening. The second metal layer is disposed on the first insulating layer and electrically connected to the first metal layer through the at least one first opening. The second insulating layer is disposed on the second metal layer and includes at least one second opening. In the top view direction, the at least one first opening is separated from the at least one second opening. The electronic device in the embodiments of the disclosure and the manufacturing method thereof may improve the process yield.

Abstract: An electronic device includes a glass substrate, a first metal layer, a second metal layer, and a third metal layer. The glass substrate includes a first surface, a second surface corresponding to the first surface, and at least two first through holes. The first through hole includes a third surface, and the third surface is connected to the first surface and the second surface. A first conductive layer is disposed on the first surface. A second conductive layer is disposed on the second surface. A third conductive layer is disposed on the third surface and is electrically connected to the first conductive layer and the second conductive layer. The first through hole has a major axis and a minor axis in a top view direction. A method of manufacturing the electronic device is also included.

Abstract: A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.

Abstract: A modulation device includes a substrate, a metal layer, at least one driving element, and a modulation unit. The metal layer is disposed on the substrate and has at least one hole. The at least one driving element is disposed on the substrate and overlapped with the at least one hole. The modulation unit is electrically connected to the at least one driving element.

Abstract: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.

Abstract: An electronic device and a repair method thereof are provided. The repair method of the electronic device includes: providing a panel, wherein the panel includes a substrate, a first conductive layer disposed on the substrate, a transistor disposed on the substrate, and a dielectric layer disposed between the first conductive layer and the transistor, wherein the transistor comprises a first electrode and a second electrode; and cutting at least one of the first electrode and the second electrode with a laser beam, wherein a cutting point formed by the laser beam does not overlap with the first conductive layer.

Abstract: An electronic device includes a substrate, a plurality of conductive patterns, and a tunable element. A plurality of conductive patterns are disposed on the substrate. The tunable element is disposed on at least one conductive pattern in the plurality of conductive patterns and includes a first pad, a second pad, and a third pad. The first pad, the second pad, and the third pad are separated from each other. The first pad and the second pad are overlapped with the at least one conductive pattern in the plurality of conductive patterns. The third pad is disposed between the first pad and the second pad.

Abstract: An electronic device including a substrate, a first metal pattern, a first insulating pattern, and a second metal pattern is provided. The first metal pattern is disposed on the substrate. The first insulating pattern is disposed on the first metal pattern. The second metal pattern is disposed on the first metal pattern and the first insulating pattern. The second metal pattern includes a first contact portion and a second contact portion. In a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion.

Abstract: An electronic device includes a carrier, a plurality of electronic elements and a connecting terminal. The carrier has at least one bonding pad. The electronic elements are disposed on the carrier, and each of the electronic elements includes a substrate. A distance between two adjacent substrates of the electronic elements is not less than 300 ?m. The connecting terminal is disposed between one of the substrate and the carrier. One of the electronic elements are electrically connected to the at least one bonding pad via the connecting terminal.