Abstract: Provided is a display panel. The display panel includes: a substrate, at least one row of light-emitting elements disposed on the substrate, a plurality of pixel drive circuits, a plurality of connection lines, and a plurality of compensation portions. A length of a first connection line electrically connected to a first pixel drive circuit is less than a length of a second connection line electrically connected to a second pixel drive circuit. A capacitance of the first connection line is compensated by electrically connecting the compensation portion to the first connection line, and thus a difference between the capacitance of the first connection line and a capacitance of the second connection line is reduced.

Abstract: A display substrate includes a first display region, a second display region, and a frame region. Light-emitting devices include first light-emitting devices in the first display region and second light-emitting devices in the second display region. Pixel drive circuits include first pixel drive circuits in the frame region and second pixel drive circuits in the second display region. The first pixel drive circuits are electrically connected to the first light-emitting devices. The second pixel drive circuits are electrically connected to the second light-emitting devices. Each of shift registers cascaded in the frame region is connected to the first pixel drive circuits and the second pixel drive circuits which are electrically connected to one row of first light-emitting devices and the same one row of second light-emitting devices respectively.

Abstract: A display panel and a display device are provided. The display panel includes: a base substrate, having a first display region and a second display region, the first display region is located at at least one side of the second display region; a plurality of first pixel circuits, located in the first display region; a plurality of first light-emitting elements, located in the first display region to each drive at least one first light-emitting element; a plurality of second pixel circuits, located in the first display region; a plurality of second light-emitting elements, located in the second display region to each drive at least one second light-emitting element; and a plurality of conductive lines, the second pixel circuit is connected to the second light-emitting element through at least one conductive line.

Abstract: Provided is a display panel. The display panel includes: a substrate, at least one row of light-emitting elements disposed on the substrate, a plurality of pixel drive circuits, a plurality of connection lines, and a plurality of compensation portions. A length of a first connection line electrically connected to a first pixel drive circuit is less than a length of a second connection line electrically connected to a second pixel drive circuit. A capacitance of the first connection line is compensated by electrically connecting the compensation portion to the first connection line, and thus a difference between the capacitance of the first connection line and a capacitance of the second connection line is reduced.

Abstract: The present disclosure provides a film bulk acoustic wave resonator and a preparation method thereof, and relates to the technical field of semiconductors. The film bulk acoustic wave resonator includes a substrate and a bottom electrode, a piezoelectric layer and a top electrode which are located on an upper surface of the substrate, the bottom electrode is provided with a first arched part so as to form a first cavity between the first arched part and the substrate; and a first reflection cavity is formed between the bottom electrode and the piezoelectric layer and located in a slope of the first arched part, the bottom electrode is provided with the first arched part and the first reflection cavity may be located in an oblique plane of the slope of the first arched part.

Abstract: The present application provides a resonator and a method of preparing same, and relates to the field of semiconductor technologies. The method includes: providing a device wafer, wherein the device wafer includes a first substrate and a piezoelectric layer, a bottom electrode, and a first mass loading layer formed in sequence on the first substrate; forming, on the bottom electrode, a sacrificial layer covering the first mass loading layer; forming a supporting layer on one side of the device wafer with the sacrificial layer; forming a second substrate on the supporting layer through a bonding process; removing the first substrate to expose the piezoelectric layer; forming a top electrode and a second mass loading layer in sequence on the piezoelectric layer; and releasing the sacrificial layer to form a cavity between the first mass loading layer and the supporting layer.

Abstract: The present application provides a resonator and a preparation method for a resonator, and relates to the technical field of semiconductors. The method involves introducing a first single crystal substrate to facilitate the epitaxial growth of a high-quality single crystal piezoelectric layer on the first single crystal substrate, and firstly performing ion implantation on the first single crystal substrate to form a damaged layer at a certain depth within it. Therefore, while the first single crystal substrate is removed, it is firstly possible to adopt the heating process, and after the first single crystal substrate is subjected to high-temperature treatment, a first layer and a second layer are split at the damaged layer, thereby a part of the first single crystal substrate is firstly removed, and then the remaining part of the first single crystal substrate is removed by trimming, etching, and other modes.

Abstract: A resonator and a preparation method of a resonator, and a filter relate to the technical field of resonators.

Abstract: The present disclosure provides a single crystal film bulk acoustic resonator, a manufacturing method for a single crystal film bulk acoustic resonator, and a filter, and relates to the technical field of filters. The method includes: sequentially forming a buffer layer, a piezoelectric layer, and a first electrode that are stacked on a temporary base substrate; forming a first bonding layer on the first electrode; providing a substrate; etching the substrate to form a plurality of first bumps on a surface of the substrate; forming a second bonding layer covering top surfaces of the plurality of first bumps on the surface of the substrate; and bonding the second bonding layer located at the top surfaces of the plurality of first bumps to the first bonding layer.

Abstract: This present disclosure provides a bulk acoustic wave resonator and a bulk acoustic wave filter, and relates to the technical field of filters. A substrate and a piezoelectric stack structure arranged on the substrate are included. The piezoelectric stack structure includes a bottom electrode, a piezoelectric material layer and a top electrode which are sequentially stacked, and an outline of an orthographic projection of the top electrode on the substrate includes at least one Bezier curve of order greater than or equal to 2.

Abstract: A resonator, a filter and a duplexer, which relate to the technical field of resonators. The resonator includes: a substrate, and a lower electrode layer, a piezoelectric layer and an upper electrode layer, which are sequentially formed on the substrate, wherein an acoustic reflection structure is formed on a surface of the substrate that is close to the lower electrode layer, and an overlapping region of the acoustic reflection structure, the lower electrode layer, the piezoelectric layer and the upper electrode layer along a stacking direction forms a resonant region; and in the resonant region, the surface, which is away from the substrate, of at least one of the lower electrode layer, the piezoelectric layer and the upper electrode layer is etched to form an etched region, the depth of the etched region is less than the thickness of an etched layer, and the area of the etched region is less than the area of the resonant region.

Abstract: A flexible circuit board includes two first wiring boards, a first adhesive, and a first conductive structure. Each of the two first wiring boards includes a first bent portion, and two first bent portions of the two wiring boards is connected to each other. The first adhesive layer is sandwiched between the two first bent portions. The first conductive structure penetrates the two first bent portions and the first adhesive layer and electrically connects the two first bent portions.

Abstract: A method for manufacturing a flexible circuit board includes providing a first laminated structure, the first laminated structure including two first wiring boards, a first adhesive layer sandwiched between the two first wiring boards, and a first conductive structure. The first conductive structure penetrates the two first wiring boards and the first adhesive layer and electrically connects the two first wiring boards. The first adhesive layer defines a first opening, the first opening includes a first edge away from the first conductive structure. The first laminated structure is cut along the first edge and then the two first wiring boards are unfolded. A flexible circuit board manufactured by such method is also disclosed.

Abstract: A method for manufacturing a flexible circuit board includes providing a first laminated structure, the first laminated structure including two first wiring boards, a first adhesive layer sandwiched between the two first wiring boards, and a first conductive structure. The first conductive structure penetrates the two first wiring boards and the first adhesive layer and electrically connects the two first wiring boards. The first adhesive layer defines a first opening, the first opening includes a first edge away from the first conductive structure. The first laminated structure is cut along the first edge and then the two first wiring boards are unfolded. A flexible circuit board manufactured by such method is also disclosed.

Abstract: Disclosed are a cell-targeted nano-material and biomedical uses thereof. The magnetic nano-material can bind with specificity to iron protein receptors having high expression on the surface of tissue cells, and can enter the cells. The present material can bind with specificity to a broad spectrum of tissue cells having a high expression of iron protein receptors, and can enable highly efficient cell targeting in animal models. The material can be used as a magnetic resonance imaging contrast and a fluorescent molecular probe for disease diagnosis, as well as a vector of medicine for disease treatment.

Abstract: A foldable frame assembly includes a base frame having a wheel-carrying end for mounting a wheel unit, a handgrip end, and an intermediate portion connected to a prop member so as to lift the base frame to a standing position. A tabletop has a front tabletop end pivoted to the intermediate portion for suspending a machine above the ground surface so as to enable a rear tabletop end to turn from a working position to a folded position. A bracing member has an anchoring end pivotally mounted on the wheel-carrying end, and a slidable end coupled with the rear tabletop end such that when the rear tabletop end is turned from the working position to the folded position, the slidable end is turned to be close to the intermediate portion. A rear locking unit is disposed to guard against movement of the slidable end.

Abstract: A foldable frame assembly includes a base frame having a wheel-carrying end for mounting a wheel unit, a handgrip end, and an intermediate portion connected to a prop member so as to lift the base frame to a standing position. A tabletop has a front tabletop end pivoted to the intermediate portion for suspending a machine above the ground surface so as to enable a rear tabletop end to turn from a working position to a folded position. A bracing member has an anchoring end pivotally mounted on the wheel-carrying end, and a slidable end coupled with the rear tabletop end such that when the rear tabletop end is turned from the working position to the folded position, the slidable end is turned to be close to the intermediate portion. A rear locking unit is disposed to guard against movement of the slidable end.