Abstract: The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.

Abstract: A probe device includes a case, a fixing base, a probe stage, a first camera and a first mirror. The case includes a bottom plate and a first side wall, which includes a first through hole and is vertically connected to the bottom plate. The fixing base, disposed inside the case, can move along a Z-axis direction. The probe stage, disposed inside the case, is used to carry a probe having a probe tip. The first camera is disposed outside the case and fixed to the first side wall. The first mirror is disposed relative to the first camera with a first angle formed between a surface of the first mirror and the normal line of the first camera. The first mirror can move along the Z-axis direction so that the first camera captures images of the probe tip through the first through hole via the first mirror.

Abstract: The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.