Patents by Inventor Yao-chun WANG

Yao-chun WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250008693
    Abstract: A heat-dissipating element having a casing having a closed fluid space. At least a part of the fluid space is filled with a coolant fluid, and the coolant fluid is transformed between a liquid phase and a gas phase by an environment temperature transferred by the casing.
    Type: Application
    Filed: June 27, 2024
    Publication date: January 2, 2025
    Inventors: Tzu-Chia TAN, YAO-CHUN WANG, WEN-HUNG LIN, WEN-YUAN CHOU, PO-CHING LIN, SHANTI KARTIKA SARI
  • Publication number: 20240310126
    Abstract: A vapor chamber includes a first cover, a second cover and a partition. The second cover and the first cover are bonded together to form a heat dissipation space. The second cover has at least two through holes. The at least two through holes correspond to the heat dissipation space. The at least two through holes are configured for at least two pipes to be inserted therein. The partition is located in the heat dissipation space, and protrudes from the first cover. The partition divides the heat dissipation space into an air tight subspace and an open subspace which are not in fluid communication with each other. The partition surrounds the open subspace. The open subspace is in fluid communication with the at least two through holes.
    Type: Application
    Filed: September 27, 2023
    Publication date: September 19, 2024
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei LIU, Hua-Yuan LIN, Yao-Chun WANG, Zhijie YANG
  • Publication number: 20240206119
    Abstract: A vapor chamber including a first plate, second plate, plurality of first support structures, plurality of second support structures, and at least one tubular heat transfer structure is provided. The first plate and the second plate define an interior cavity having a first, second, and third portion, the first, second, and third portion each have a first, second, and third depth, respectively, the plurality of first support structures is disposed in the first portion, the plurality of support structures is disposed in the second portion and the third portion, respectively, the at least one tubular heat transfer structure is disposed in the first portion and includes a first working fluid having a first working fluid circulation path, the first portion, the second portion, and the third portion include a second working fluid having a second working fluid circulation path different from the first working fluid circulation path.
    Type: Application
    Filed: December 18, 2023
    Publication date: June 20, 2024
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Hua-Yuan LIN, Lei Lei LIU, Yao-Chun WANG
  • Publication number: 20240179871
    Abstract: A vapor chamber including a first plate, second plate, plurality of support structures, and plurality of heat transfer structures is provided. The first plate and the second plate define an interior cavity having a first portion, a pair of second portions, and a pair of third portions. The pair of second portions and pair of third portions surround the first portion. A length of the pair of third portions defines a longitudinal direction and is greater than a width of the pair of second portions. The plurality of heat transfer structures is disposed in the first portion and the plurality of support structures is disposed throughout the interior cavity. A position of the structure length of each of the plurality of heat transfer structures is in line with the longitudinal direction so that working fluid flows from the pair of third portions to and through the first portion unhindered.
    Type: Application
    Filed: November 30, 2023
    Publication date: May 30, 2024
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Hua-Yuan LIN, Yao-Chun WANG
  • Publication number: 20180279500
    Abstract: A heat dissipating system provided herein comprises a cooling tank for storing a cooling liquid and a heat element, wherein the cooling liquid is phase-changed into a working gas due to thermal energy generated by the heat element; an evaporator installed in the cooling tank for absorbing thermal energy of the working gas; a condenser uncovered by the cooling tank; at least one communicating member communicated with the evaporator and the condenser and filled with a coolant, wherein the coolant is heated in the evaporator and flows to the condenser through the communicating member in a gaseous state, and, after being cooled in the condenser, recovers into a liquid state and then returns to the evaporator through the communicating member; and a first gas driving module for driving air to flow around the condenser.
    Type: Application
    Filed: April 27, 2016
    Publication date: September 27, 2018
    Inventor: Yao-chun WANG
  • Publication number: 20170112017
    Abstract: A heat dissipating system provided herein comprises a cooling tank for storing a cooling liquid and a heat element, wherein the cooling liquid is phase-changed into a working gas due to thermal energy generated by the heat element; an evaporator installed in the cooling tank for absorbing thermal energy of the working gas; a condenser uncovered by the cooling tank; at least one communicating member communicated with the evaporator and the condenser and filled with a coolant, wherein the coolant is heated in the evaporator and flows to the condenser through the communicating member in a gaseous state, and, after being cooled in the condenser, recovers into a liquid state and then returns to the evaporator through the communicating member; and a first gas driving module for driving air to flow around the condenser.
    Type: Application
    Filed: April 27, 2016
    Publication date: April 20, 2017
    Inventor: Yao-chun WANG