Patents by Inventor Yao Fei Chuang

Yao Fei Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for thinning a substrate
    Patent number: 8048807
    Abstract: Provided is a method for fabricating a semiconductor device that includes providing a semiconductor substrate having a front side and a backside, where active or passive devices are formed in the front side, rotating the semiconductor substrate, and etching the backside of the semiconductor substrate by introducing a first etchant while the substrate is rotated, the first etchant including an R—COOH.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: November 1, 2011
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming Chyi Liu, Yao Fei Chuang, Martin Liu, Gwo-Yuh Shiau, Chia-Shiung Tsai
  • Method and Apparatus for Thinning a Substrate
    Publication number: 20100062611
    Abstract: Provided is a method for fabricating a semiconductor device that includes providing a semiconductor substrate having a front side and a backside, where active or passive devices are formed in the front side, rotating the semiconductor substrate, and etching the backside of the semiconductor substrate by introducing a first etchant while the substrate is rotated, the first etchant including an R—COOH.
    Type: Application
    Filed: September 5, 2008
    Publication date: March 11, 2010
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ming Chyi Liu, Yao Fei Chuang, Martin Liu, Gwo-Yuh Shiau, Chia-Shiung Tsai