Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.

Abstract: A guaranteeing server and a guaranteeing method for transaction on blockchain are disclosed. The guaranteeing server is coupled to a blockchain network and comprises a memory unit and one or more processing units. The memory unit stores a plurality of instructions and the processing units execute the instructions to perform steps of: receiving a transaction data from a user, wherein the transaction data includes a wallet data including a wallet address data and a user's signature data; checking whether a cryptocurrency balance associated with the wallet address data on the blockchain network is sufficient to execute the transaction; when the cryptocurrency balance is sufficient to execute the transaction, transmitting the transaction data to the blockchain network for performing a blockchain operation; and transmitting a transaction guarantee information corresponding to the transaction data to an opposing party of the transaction.