Patents by Inventor Yao-Hsien SHAO

Yao-Hsien SHAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967613
    Abstract: A semiconductor structure includes a substrate, and an active device and a passive device over the substrate. The active device is disposed in a first region of the substrate, and the passive device is disposed in a second region of the substrate. The semiconductor structure further includes a shielding structure and a passivation layer. The shielding structure includes a barrier layer and a ceiling layer. The barrier layer is on the passive device and the active device, and the ceiling layer is on the barrier layer. The passivation layer is under the barrier layer and covers a top surface of the passive device. An air cavity is defined by sidewalls of the barrier layer, a bottom surface of the ceiling layer, and the substrate.
    Type: Grant
    Filed: May 16, 2023
    Date of Patent: April 23, 2024
    Assignee: WIN SEMICONDUCTORS CORP.
    Inventors: Ju-Hsien Lin, Jung-Tao Chung, Shu-Hsiao Tsai, Hsi-Tsung Lin, Chen-An Hsieh, Yi-Han Chen, Yao-Ting Shao
  • Patent number: 11569714
    Abstract: A hairpin motor stator includes a stator core, a plurality of slots, a first hairpin wire and a temperature sensor. The stator core defines a rotor accommodating space. The slots are located on the stator core, and each slot extends in a radial direction from the rotor accommodating space. Each slot has a side opening adjacent to the rotor accommodating space. One of the slots is a temperature sensor accommodating slot. The first hairpin wire is located in the temperature sensor accommodating slot and proximal to the side opening of the temperature sensor accommodating slot. The temperature sensor is between the side opening of the temperature sensor accommodating slot and the first hairpin wire. The temperature sensor is larger than the side opening of the temperature sensor accommodating slot such that the temperature sensor is enclosed in the temperature sensor accommodating slot.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: January 31, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yi-Ming Wu, Yao-Hsien Shao, Yu-Kuan Lin
  • Publication number: 20220344994
    Abstract: A hairpin stator includes an iron core, a plurality of slot-positions and a plurality of hairpin wires. The slot-positions are located in the circumferential direction of the iron core, and form a plurality of adjacent slot-position layers in the radial direction. The iron core includes polar regions, each polar region includes phases, and each phase includes phase slots. The hairpin wires are arranged in the slot-positions of the phase slots of the same phases of the polar regions, and the hairpin wires are connected to form windings. The hairpin wires include transpolar hairpin wires. A span of the transpolar hairpin wires on an insertion side of the iron core is equal to a quotient, which is obtained by dividing a total number of the phase slots by a total number of the polar regions, plus 1 or minus 1.
    Type: Application
    Filed: November 17, 2021
    Publication date: October 27, 2022
    Inventors: Yu-Wei CHUANG, Yao-Hsien SHAO, Ji DAI
  • Publication number: 20220140703
    Abstract: A hairpin motor stator includes a stator core, a plurality of slots, a first hairpin wire and a temperature sensor. The stator core defines a rotor accommodating space. The slots are located on the stator core, and each slot extends in a radial direction from the rotor accommodating space. Each slot has a side opening adjacent to the rotor accommodating space. One of the slots is a temperature sensor accommodating slot. The first hairpin wire is located in the temperature sensor accommodating slot and proximal to the side opening of the temperature sensor accommodating slot. The temperature sensor is between the side opening of the temperature sensor accommodating slot and the first hairpin wire. The temperature sensor is larger than the side opening of the temperature sensor accommodating slot such that the temperature sensor is enclosed in the temperature sensor accommodating slot.
    Type: Application
    Filed: May 3, 2021
    Publication date: May 5, 2022
    Inventors: Yi-Ming WU, Yao-Hsien SHAO, Yu-Kuan LIN