Abstract: A first polymer layer is formed across a package region and a test region. A first metal pattern is formed in the package region and a first test pattern is simultaneously formed in the test region. The first metal pattern has an upper portion located on the first polymer layer and a lower portion penetrating through the first polymer layer, and the first test pattern is located on the first polymer layer and has a first opening exposing the first polymer layer. A second polymer layer is formed on the first metal pattern in the package region and a second test pattern is simultaneously formed on the first test pattern in the test region. The second polymer layer has a second opening exposing the upper portion of the first metal pattern, and the second test pattern has a third opening greater than the first opening of the first test pattern.

Abstract: An optimum PID control method for adapting a process facility system is provided. The process facility system includes a primary supply apparatus, a final control element, process facility, a PID controller, and a PID optimization module. When the PID optimization module identifies the primary supply apparatus is switched from an operating status to a shut-down status, the PID optimization module stores a control parameter value of the final control element that is present at the time when the shut down is made in a parameter value memory.