Abstract: A method for forming a package structure is provided. The method includes disposing a semiconductor die over a carrier substrate, wherein a removable film is formed over the semiconductor die, disposing a first stacked die package structure over the carrier substrate, wherein a top surface of the removable film is higher than a top surface of the first stacked die package structure, and removing the removable film to expose a top surface of the semiconductor die, wherein a top surface of the semiconductor die is lower than the top surface of the first stacked die package structure.

Abstract: An optical-fiber connector includes a coupling member, a core component, a sleeve member, a metal retaining member, and a pressing member. The core component is in the receiving space. The metal retaining member is connected to one of two ends of the coupling member. The elastic arm of the metal retaining member inclinedly extends toward the other end of the coupling member. Two sides of the elastic arm have a plurality of retaining structures. The sleeve member is at the other end of the coupling member and is connected to the pressing member. The pressing portion of the pressing member extends toward the elastic arm. The metal retaining member is adapted to be buckled with an adapter, so that the service life of the optical-fiber connector can be prolonged.

Abstract: A tiled display device includes two panels and two cover layers respectively disposed on the two panels. The two cover layers include a contact region. A top portion and a bottom portion of the contact region have a height H. One of the two cover layers has a thickness Tn. One of the two panels has a distance Xn between an upper surface of the one of the two panels and the bottom portion of the contact region. The one of the two panels is corresponding to the one of the two cover layers. The height H, the thickness Tn and the distance Xn satisfy the equation: 0<H/(Xn+Tn)<0.8.

Abstract: Various schemes pertaining to pre-encoding processing of a video stream with motion compensated temporal filtering (MCTF) are described. An apparatus determines a filtering interval for a received raw video stream having pictures in a temporal sequence. The apparatus selects from the pictures a plurality of target pictures based on the filtering interval, as well as a group of reference pictures for each target picture to perform pixel-based MCTF, which generates a corresponding filtered picture for each target picture. The apparatus subsequently transmits the filtered pictures as well as non-target pictures to an encoder for encoding the video stream. Subpictures of natural images and screen content images are separately processed by the apparatus.

Abstract: Semiconductor devices and methods of manufacture which utilize lids in order to constrain thermal expansion during annealing are presented. In some embodiments lids are placed and attached on encapsulant and, in some embodiments, over first semiconductor dies. As such, when heat is applied, and the encapsulant attempts to expand, the lid will work to constrain the expansion, reducing the amount of stress that would otherwise accumulate within the encapsulant.

Abstract: A method for detecting and compensating CNC tools being implemented in an electronic device, receives from a detector first parameters and second parameters in respect of a first tool. Such first parameters include at least one of service life, blade break information, and blade chipping information of the first tool, and such second parameters include at least one of length extension information, length wear information, radial wear information, and blade thickness wear information of the first tool. Based on the first parameters, instructions to process the workpiece are transmitted or not. Upon receiving the second parameters, instructions to adjust operation of the first tool are transmitted, to compensate for deterioration in normal use.

Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

Abstract: Systems and methods of making a glove pack and for removing gloves from the glove pack are disclosed. The glove pack includes a stack of gloves. The stack of gloves includes a first glove engaging a second glove. The first and second gloves each have an exterior gripping surface. Each exterior gripping surface of the first and second gloves engages and adheres to the exterior gripping surface of the other of the first or second glove in the stack of gloves thereby adhering the first and second gloves together in the stack of gloves such that when the first glove is removed from the stack of gloves at least a portion of the second glove moves with the first glove.

Abstract: A color correction system and a colorimeter positioning method therefore are provided. A first color block is displayed in a first display area of a display. During the period of displaying the first color block, a first sensing value is acquired for the first color block through a sensor of a colorimeter. The first sensing value is compared with a first reference value to determine whether the first sensing value meets the first specific condition. In response to the first sensing value meeting the first specific condition, a second color block is displayed in the first display area of the display. During the period of displaying the second color block, a second sensing value is acquired for the second color block through the sensor. The second sensing value is compared with a second reference value to determine whether the second sensing value meets the second specific condition.

Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.

Abstract: A semiconductor die package is provided. The semiconductor die package includes a semiconductor die and a package substrate supporting and electrically connected to the semiconductor die. The semiconductor die has a corner. The package substrate includes several conductive lines, and one of the conductive lines under the corner of the semiconductor die includes a first line segment and a second line segment connected to the first line segment. The first line segment is linear and extends in a first direction. The second line segment is non-linear and has a varying extension direction.

Abstract: A package structure is provided. The package structure includes a first conductive pad in a first insulating layer, a conductive via in a second insulating layer directly under the first conductive pad, and a first under bump metallurgy structure directly under the first conductive via. In a first horizontal direction, the conductive via is narrower than the first under bump metallurgy structure, and the first under bump metallurgy structure is narrower than the first conductive pad.

Abstract: A vehicle tire cloud computing management system and an application method thereof are provided. A vehicle tire cloud computing management system is formed by combining a vehicle tire management device including tire sensors, a setting tool, and radio frequency identification (RFID) tags with a cloud server, and a car computer. By using the tire sensors to detect tire-related data, and then by outputting the tire-related data to the setting tool, the cloud server, or the car computer for data computation, result judging and/or data storage, so that the function of the tire sensors is more focused on detecting tire conditions, and power consumption of the tire sensors is reduced, while the setting tool, the cloud server, and the car computer are used efficiently to perform computation, management, and application for data related to the tire sensors.

Abstract: A knitted component comprising two yarns, forming at least a heel region of an upper for an article of footwear, where one of the yarns comprises a thermoplastic material. The outer surface may include a fused area comprising a first thermoplastic yarn. The inner surface may be at least partially formed with a second yarn and may substantially exclude the thermoplastic material. There may be a transitional area including a reduced amount of thermoplastic material relative to a fused area. The knitted component may include a cushioning material between layers of the knit element.

Abstract: An image sensing device and a control device of an illumination device thereof are provided. The control device includes a control circuit, an operation circuit, and multiple driving signal generators. The control circuit generates multiple control signals. The operation circuit performs a logical operation on the control signals and an image capturing signal to generate multiple operation results. The driving signal generator respectively provides multiple driving signals to the illumination device according to the operation results, and the driving signals respectively have multiple different output powers.

Abstract: An electronic device is provided, including an electronic element, and a protective substrate. The protective substrate includes a concave portion, and a flat portion. The concave portion has a concave surface and a convex surface that is opposite to the concave surface. The flat portion is connected to the concave portion. The electronic element overlaps the concave portion and is arranged under the convex surface.

Abstract: An electrical connector includes: an insulative housing defining an upper face and a lower face and having a plurality of passageways running though the upper and lower face; and a plurality of contacts secured in the plurality of passageways of the insulative housing. Each of the plurality of contacts includes a base part, an upper arm extending from the base part, and a first part and a second part bent from opposite sides of the base part, a first limb bent from the first part and a second limb bent from the second part plate body. The first limb and the second limb are located staggered in an upper and lower direction, thereby the base part, the first and second part and the first and second limbs together form a tubular structure.

Abstract: A method for forming a package structure is provided, including forming an interconnect structure over a carrier substrate and forming a semiconductor die over a first side of the interconnect structure. A removable film is formed over the semiconductor die. The method includes forming a first stacked die package structure over the first side of the interconnect structure. A top surface of the removable film is higher than a top surface of the first stacked die package structure. The method includes forming a package layer, removing a portion of the package layer to expose a portion of the removable film, removing the removable film to form a recess, forming a lid structure over the semiconductor die and the first stacked die package structure. The lid structure has a main portion and a protruding portion disposed in the recess and extending from the main portion.

Abstract: A method for treating sleeping or movement disorder is provided. The method includes the operations as follows. A brainwave of a patient with sleeping or movement disorder is recorded. An onset of a STW oscillation episode from the brainwave is identified, wherein the STW oscillation episode is a STW signal having an oscillation frequency in a range of from about 2 Hz to about 4 Hz. a first stimulation is delivered to the patient when the onset of the STW oscillation episode is identified from the brainwave. The first stimulation is adapted according to a measurable feature of the STW oscillation episode. A system for treating sleeping or movement disorder is also provided.

Abstract: An optical-fiber connector includes a coupling member, a core component, a sleeve member, a metal retaining member, and a pressing member. The core component is in the receiving space. The metal retaining member is connected to one of two ends of the coupling member. The elastic arm of the metal retaining member inclinedly extends toward the other end of the coupling member. Two sides of the elastic arm have a plurality of retaining structures. The sleeve member is at the other end of the coupling member and is connected to the pressing member. The pressing portion of the pressing member extends toward the elastic arm. The metal retaining member is adapted to be buckled with an adapter, so that the service life of the optical-fiber connector can be prolonged.