Abstract: A printed circuit board (PCB) printing method includes obtaining PCB parameters and stencil printing parameters of a PCB to be printed, determining print parameters for printing the PCB according to a print model parameter relationship, the obtained PCB parameters, and standard values of solder paste detection parameters, transmitting the determined print parameters to a printer for printing the PCB, receiving values of the solder paste detection parameters detected by a solder paste inspection device, determining whether the detected values are within a preset range of the standard values, and re-determining the print parameters when the detected values are not within the preset range of the standard values. The print model parameter relationship indicates a relationship of the PCB parameters and the print parameters to solder paste detection parameters. The solder paste detection parameters include information related to solder paste on the printed PCB.