Abstract: A hot plate cooling system is provided, configured to cool a hot plate, including a chamber and a cooling module. The hot plate is placed in the chamber. The cooling module extends into the chamber and faces the hot plate. The cooling module includes a nozzle member, a shell member, and a discharge channel. The nozzle member faces the hot plate for spraying a working fluid onto the hot plate. The shell member has a receiving groove surrounding the nozzle member. The discharge channel is connected to the shell member and communicates with the receiving groove. When the nozzle member sprays the working fluid to cool the hot plate, the working fluid is conveyed through the nozzle member toward a surface of the hot plate, and the working fluid is sequentially discharged from the hot plate cooling system through the receiving groove to the discharge channel.

Abstract: A hot plate cooling system is provided, configured to cool a hot plate, including a chamber and a cooling module. The hot plate is placed in the chamber. The cooling module extends into the chamber and faces the hot plate. The cooling module includes a nozzle member, a shell member, and a discharge channel. The nozzle member faces the hot plate for spraying a working fluid onto the hot plate. The shell member has a receiving groove surrounding the nozzle member. The discharge channel is connected to the shell member and communicates with the receiving groove. When the nozzle member sprays the working fluid to cool the hot plate, the working fluid is conveyed through the nozzle member toward a surface of the hot plate, and the working fluid is sequentially discharged from the hot plate cooling system through the receiving groove to the discharge channel.

Abstract: A protection device is provided, including a first fixed member, a second fixed member, a supporting member, a roller, an awning, an electromagnetic device, and a power supply unit. The supporting member connects to the first and second fixed members. The roller is movably disposed on the supporting member. The power supply unit provides electrical power to the electromagnetic device, so that the electromagnetic device attracts the roller, and the awning remains in a received state. When the power supply unit stops providing electrical power to the electromagnetic device, the roller moves along the supporting member, and the awning is expanded to cover the equipment.

Abstract: A protection device is provided, including a first fixed member, a second fixed member, a supporting member, a roller, an awning, an electromagnetic device, and a power supply unit. The supporting member connects to the first and second fixed members. The roller is movably disposed on the supporting member. The power supply unit provides electrical power to the electromagnetic device, so that the electromagnetic device attracts the roller, and the awning remains in a received state. When the power supply unit stops providing electrical power to the electromagnetic device, the roller moves along the supporting member, and the awning is expanded to cover the equipment.

Abstract: A method for fabricating metal bonding for a semiconductor circuit component employing prescribed feed of metal ball is disclosed. The method comprises the steps of, first, placing a metal ball at the metallization site on the surface of the circuit die of the component; then, melting the metal ball on the site; and subsequently solidifying the molten metal and forming a metal bump at the site. A circuit die having formed with one or more metal bumps can then be made into a circuit component featuring stable and reliable electrical leads and suitable to be utilized as large power rating yet with reduced component size in electronic equipment.

Abstract: A method for fabricating metal bonding for a semiconductor circuit component employing prescribed feed of metal ball is disclosed. The method comprises the steps of, first, placing a metal ball at the metallization site on the surface of the circuit die of the component; then, melting the metal ball on the site; and subsequently solidifying the molten metal and forming a metal bump at the site. A circuit die having formed with one or more metal bumps can then be made into a circuit component featuring stable and reliable electrical leads and suitable to be utilized as large power rating yet with reduced component size in electronic equipment.

Abstract: A method for fabricating metal bonding for a semiconductor circuit component employing prescribed feed of metal ball is disclosed. The method comprises the steps of, first, placing a metal ball at the metallization site on the surface of the circuit die of the component; then, melting the metal ball on the site; and subsequently solidifying the molten metal and forming a metal bump at the site. A circuit die having formed with one or more metal bumps can then be made into a circuit component featuring stable and reliable electrical leads and suitable to be utilized as large power rating yet with reduced component size in electronic equipment.