Abstract: A display panel including a bottom plate, a plurality of display modules, and a plurality of connection pixel packages is provided. The display modules are tiled in an array arrangement on the bottom plate. Each of the display modules includes a circuit substrate and a plurality of display pixels. The circuit substrate includes a plurality of connection electrodes. The display pixels are disposed on the circuit substrate and at least one of the display pixels has at least one second pixel unit. Each of the connection pixel packages includes at least one first pixel unit. The connection pixel packages are disposed on the connection electrodes of the adjacent circuit substrates to connect the display modules. A light emitting surface of the at least one first pixel unit and a light emitting surface of the at least one second pixel unit are coplanar.

Abstract: A light-emitting device including an epitaxial layer, a support layer, an insulating layer, a first electrode pad, and a second electrode pad is provided. The epitaxial layer includes a first type doped semiconductor layer, a light-emitting layer and a second type doped semiconductor layer, wherein the light-emitting layer is disposed on a partial area of the first type doped semiconductor layer and is between the first type doped semiconductor layer and the second type doped semiconductor layer. The support layer covers the second type doped semiconductor layer while the insulating layer covers the epitaxial layer and the support layer. The first and the second electrode pads are disposed over the insulating layer and electrically connected to the first and the second type doped semiconductor layers, respectively. The support layer extends from a first position below the first electrode pad to a second position below the second electrode pad.

Abstract: A transparent display includes a transparent substrate, a wiring layer, a plurality of light-emitting package units, and a plurality of connecting elements. The wiring layer is disposed on a surface of the transparent substrate. Each of the light-emitting package units includes a micro-substrate, frontward light-emitting elements, backward light-emitting elements, and a sealant. The micro-substrate has a first surface facing away from the transparent substrate and a second surface facing the transparent substrate. The frontward light-emitting elements are disposed on the first surface of the micro-substrate, in which the micro-substrate is configured to block the light from the frontward light-emitting elements toward the transparent substrate. The backward light-emitting elements are disposed on the second surface of the micro-substrate. The sealant covers the micro-substrate, the frontward light-emitting elements, and the backward light-emitting elements.

Abstract: A subpixel structure includes a substrate and a light emitting diode chip. The light emitting diode chip is disposed on the substrate. The light emitting diode chip has a chip area and a light emitting area, and the light emitting area is less than or equal to one tenth of the chip area.

Abstract: A pixel structure includes an original light emitting diode die and a repairing light emitting diode die emitting light of a same color, and an extending conductor. The original light emitting diode die includes a first epitaxial layer, and a first electrode and a second electrode disposed at opposite sides of the first epitaxial layer. The repairing light emitting diode die includes a second epitaxial layer, and a third electrode and a fourth electrode disposed at a same side of the second epitaxial layer. The extending conductor includes a first portion, a second portion and a cut-off region. The first portion is electrically connected to the second electrode of the original light emitting diode die. The second portion is electrically connected to the third electrode of the repairing light emitting diode die. The cut-off region is located in the first portion or between the first portion and the second portion.

Abstract: A display panel including a bottom plate, a plurality of display modules, and a plurality of connection pixel packages is provided. The display modules are tiled in an array arrangement on the bottom plate. Each of the display modules includes a circuit substrate and a plurality of display pixels. The circuit substrate includes a plurality of connection electrodes. The display pixels are disposed on the circuit substrate and at least one of the display pixels has at least one second pixel unit. Each of the connection pixel packages includes at least one first pixel unit. The connection pixel packages are disposed on the connection electrodes of the adjacent circuit substrates to connect the display modules. A light emitting surface of the at least one first pixel unit and a light emitting surface of the at least one second pixel unit are coplanar.

Abstract: A pixel structure includes an original light emitting diode die and a repairing light emitting diode die emitting light of a same color, and an extending conductor. The original light emitting diode die includes a first epitaxial layer, and a first electrode and a second electrode disposed at opposite sides of the first epitaxial layer. The repairing light emitting diode die includes a second epitaxial layer, and a third electrode and a fourth electrode disposed at a same side of the second epitaxial layer. The extending conductor includes a first portion, a second portion and a cut-off region. The first portion is electrically connected to the second electrode of the original light emitting diode die. The second portion is electrically connected to the third electrode of the repairing light emitting diode die. The cut-off region is located in the first portion or between the first portion and the second portion.

Abstract: A pixel structure including a substrate, a first conductor, a second conductor, and a plurality of dies is provided. The first conductor is disposed on the substrate and includes a plurality of first body portions extending along a first direction, a plurality of first branch portions extending along a second direction, and a plurality of second branch portions extending along the first direction. The second conductor is disposed on the substrate and includes a plurality of second body portions extending along the second direction and a plurality of third branch portions extending along the first direction. The die includes two electrodes, wherein the first branch portions are connected between the first body portions and the second branch portions, and the two electrodes are respectively connected to the first branch portions and the second body portions or respectively connected to the second branch portions and the third branch portions.

Abstract: A pixel structure includes an original light emitting diode die and a repairing light emitting diode die emitting light of a same color, and an extending conductor. The original light emitting diode die includes a first epitaxial layer, and a first electrode and a second electrode disposed at opposite sides of the first epitaxial layer. The repairing light emitting diode die includes a second epitaxial layer, and a third electrode and a fourth electrode disposed at a same side of the second epitaxial layer. The extending conductor includes a first portion, a second portion and a cut-off region. The first portion is electrically connected to the second electrode of the original light emitting diode die. The second portion is electrically connected to the third electrode of the repairing light emitting diode die. The cut-off region is located in the first portion or between the first portion and the second portion.

Abstract: A transfer support adapted to contact a plurality of elements is provided. The transfer support has a first surface, a second surface opposite to the first surface, a recess located on the second surface, a plurality of platforms protruded from the first surface, a plurality of supporting pillars distributed in the recess and a plurality of through holes. The platforms have carry surfaces adapted to contact the plurality of elements. The through holes extend from the carry surfaces of the platforms to the recess, and two of the adjacent supporting pillars are spaced apart from each other to form an air passage. In addition, a transfer module is also provided.

Abstract: A subpixel structure includes a substrate and a light emitting diode chip. The light emitting diode chip is disposed on the substrate. The light emitting diode chip has a chip area and a light emitting area, and the light emitting area is less than or equal to one tenth of the chip area.

Abstract: A pixel structure including a substrate, a first conductor, a second conductor, and a plurality of dies is provided. The first conductor is disposed on the substrate and includes a plurality of first body portions extending along a first direction, a plurality of first branch portions extending along a second direction, and a plurality of second branch portions extending along the first direction. The second conductor is disposed on the substrate and includes a plurality of second body portions extending along the second direction and a plurality of third branch portions extending along the first direction. The die includes two electrodes, wherein the first branch portions are connected between the first body portions and the second branch portions, and the two electrodes are respectively connected to the first branch portions and the second body portions or respectively connected to the second branch portions and the third branch portions.

Abstract: A pixel structure includes an original light emitting diode die and a repairing light emitting diode die emitting light of a same color, and an extending conductor. The original light emitting diode die includes a first epitaxial layer, and a first electrode and a second electrode disposed at opposite sides of the first epitaxial layer. The repairing light emitting diode die includes a second epitaxial layer, and a third electrode and a fourth electrode disposed at a same side of the second epitaxial layer. The extending conductor includes a first portion, a second portion and a cut-off region. The first portion is electrically connected to the second electrode of the original light emitting diode die. The second portion is electrically connected to the third electrode of the repairing light emitting diode die. The cut-off region is located in the first portion or between the first portion and the second portion.

Abstract: A light-emitting device including an epitaxial layer, a support layer, an insulating layer, a first electrode pad, and a second electrode pad is provided. The epitaxial layer includes a first type doped semiconductor layer, a light-emitting layer and a second type doped semiconductor layer, wherein the light-emitting layer is disposed on a partial area of the first type doped semiconductor layer and is between the first type doped semiconductor layer and the second type doped semiconductor layer. The support layer covers the second type doped semiconductor layer while the insulating layer covers the epitaxial layer and the support layer. The first and the second electrode pads are disposed over the insulating layer and electrically connected to the first and the second type doped semiconductor layers, respectively. The support layer extends from a first position below the first electrode pad to a second position below the second electrode pad.

Abstract: A light-emitting device including an epitaxial layer, a support layer, an insulating layer, a first electrode pad, and a second electrode pad is provided. The epitaxial layer includes a first type doped semiconductor layer, a light-emitting layer and a second type doped semiconductor layer, wherein the light-emitting layer is disposed on a partial area of the first type doped semiconductor layer and is between the first type doped semiconductor layer and the second type doped semiconductor layer. The support layer covers the second type doped semiconductor layer while the insulating layer covers the epitaxial layer and the support layer. The first and the second electrode pads are disposed over the insulating layer and electrically connected to the first and the second type doped semiconductor layers, respectively. The support layer extends from a first position below the first electrode pad to a second position below the second electrode pad.

Abstract: A photolithography process includes providing a first test layout including test patterns, and a first light source; forming an initial mask layout according to the first test layout; forming a mask layout including mask layout patterns through an optical proximity correction or a phase-shifting masking; forming exposed patterns by exposing the mask layout using the first light source; and determining a weak region from the first test layout. A first distance between adjacent test patterns in the weak region is unequal to a second distance between corresponding exposed patterns. The photolithography process further includes performing a re-layout on the weak region to increase the first distance, thereby providing an adjusted test layout; performing a light-source optimization to obtain an adjusted light source; and determining the adjusted test layout and the adjusted light source as a second test layout and a second light source, respectively when process window requirements are satisfied.

Abstract: A healthy motion environment managing apparatus includes a wearable intelligent equipment, an environment adjusting equipment, a fitness equipment and an environment parameter collecting equipment. The wearable intelligent equipment includes an input unit, a memory unit, a processing unit and a communication unit. The environment parameter collecting equipment configured for sending a value of a collected current environment parameter to the wearable intelligent equipment. The processing unit compares a difference of the value of the collected current environment parameter and a value of one of optimum motion environment parameters, if the difference is larger than a set threshold, a start instruction is sent to the environment adjusting equipment via the communication unit. The invention can adjust the motion environment quickly and conveniently and can improve the user experience greatly.

Abstract: A transfer support adapted to contact a plurality of elements is provided. The transfer support has a first surface, a second surface opposite to the first surface, a recess located on the second surface, a plurality of platforms protruded from the first surface, a plurality of supporting pillars distributed in the recess and a plurality of through holes. The platforms have carry surfaces adapted to contact the plurality of elements. The through holes extend from the carry surfaces of the platforms to the recess, and two of the adjacent supporting pillars are spaced apart from each other to form an air passage. In addition, a transfer module is also provided.

Abstract: A correction method for a mask pattern is provided. The method includes providing a chip pattern region including a plurality of main features, and providing first auxiliary patterns around each main feature. The method also includes performing a first optical proximity correction to correct the main features into first correction features, and providing a plurality of detection regions. Each detection region is connected to an adjacent first correction feature via the first auxiliary pattern. In addition, the method includes performing an exposure process to obtain a light intensity distribution corresponding to each detection region after performing the exposure process. Moreover, the method includes correcting the first auxiliary patterns into second auxiliary patterns based on an auxiliary pattern correction model and the light intensity distribution of each detection region.

Abstract: Methods for correcting target patterns and masks having corrected target patterns are provided. An exemplary correction method includes dividing contours of target patterns into fragments; performing an optical proximity correction to obtain mask patterns; obtaining simulated exposure patterns; detecting the simulated exposure patterns to find out existence of at least one weak point; determining a correction window in the target patterns; comparing the target patterns in the correction window with the simulated exposure patterns to obtain a position error of each fragment; calculating an effect value of a correction value of each fragment in the correction window on position errors of all fragments in the correction window; determining the correction value of each fragment according to the effect value of the correction value in the correction window on position errors of all fragments and the position error of each fragment; and obtaining corrected target patterns using the correction value.