Abstract: A modularized probe head for high frequency probing is provided. The probe head mainly includes a probe head, a mounting board and an interposer between the probe head and the mounting board. The probe head has a plurality of cavities on its back surface. A plurality of decoupling components are installed inside the cavities and are electrically coupled to the ground/power circuitry of the probe head via by-pass circuitry. The interposer has a bottom surface corresponding to the back surface of the probe head, and includes a plurality of contact ends on the bottom surface. Some of the contact ends electrically contact the decoupling components and electrically coupled to the ground plane of the mounting board.

Abstract: A probe card interposer includes a substrate with a plurality of conductive bumps disposed on first surface of the substrate. Each conductive bump comprises a dielectric core and a plurality of conductive leads. The suspended ends of the conductive wires extend toward the centers of the corresponding dielectric cores and are elastically supported by the corresponding dielectric cores. Therefore, the interposer can be installed between a probe head and a multi-layer PCB to make good electrical contacts to the probe head through the conductive bumps. In the embodiment, a plurality of symmetric conductive bumps are disposed on second surface of the substrate and are electrically connected to the conductive bumps on first surface of the substrate through vias or conductive posts. The conductive bumps can electrically contact the multi-layer PCB.

Abstract: An image sensor package comprises a carrier, an image sensor chip, and a transparent substrate where the carrier has a chip cavity and a plurality of first pads formed around the chip cavity. A plurality of bonding pads are formed on the active surface of the image sensor chip. The image sensor chip is disposed in the chip cavity. A plurality of probe leads are formed on the transparent substrate. The probe leads have a plurality of free tips. When the transparent substrate is adhered to the carrier, the image sensor chip is hermetically sealed, and the free tips are electrically contacted to the bonding pads of the image sensor chip, and the probe leads are electrically connected to the first pads of the carrier. The height variations of the image sensor chip in the chip cavity can be offset by the probe leads.

Abstract: An assembly device of an image sensor chip is disclosed. A flexible circuit has a die-attached portion, a plurality of bendable portions, and a plurality of bonding portions where the bendable portions extend from the die-attached portion and are connected to the corresponding bonding portions. A plurality of inner leads are formed on the bonding portions. An image sensor chip with bumps is attached to the die-attached portion. The bendable portions are so bent that the bonding portions are located above the image sensor chip. By thermocompression bonding, the inner leads of the flexible circuit are bonded to the bumps on the image sensor chip. In one embodiment, a transparent cover is adhered to the bonding portions and located above a sensing area of the image sensor chip.

Abstract: A multi-chip image sensor module includes a flexible module board, an image sensor chip, a transparent cover, and at least an IC chip. The flexible module board has a first die-attached portion, a second die-attached portion, at least one bent portion, and at least one bonding portion where the bent portion connects the first die-attached portion and the bonding portion. The image sensor chip is attached to the first die-attached portion and the IC chip is disposed on the second die-attached portion. Inner leads on the bonding portion are electrically connected to the bonding pads of the image sensor chip when the bonding portion is bonded on the image sensor chip. The transparent cover is disposed above the sensing area of the image sensor chip, preferably adhered to the bonding portion.

Abstract: An image sensor package includes a chip carrier, an image sensor chip, a transparent cover, and an O-ring. The chip carrier has a plurality of inner leads. The image sensor chip has an active surface including a sensing area and a plurality of bonding pads thereon. The bonding pads are electrically connected to the inner leads by bumps or bonding wires. The transparent cover is disposed on the chip carrier. Moreover, the O-ring includes a photocurable adhesive to hermetically sealing the image sensor chip under low temperatures.

Abstract: An image sensor package mainly includes a substrate cover having a chip cavity, an image sensor chip, a flexible circuit, and a transparent carrier. The flexible circuit is attached to the transparent carrier. The image sensor chip is flip-chip mounted on the flexible circuit, and then the substrate cover is mounted on the flexible circuit. The flexible circuit has a plurality of first leads electrically connected to bumps of the image sensor chip, and a plurality of second leads to inner terminals of the substrate cover, so that the electrical connection is established between the image sensor chip and the substrate cover through the flexible circuit. A plurality of outer terminals are formed on the opposing surface of the substrate cover corresponding to the inner terminals. Accordingly, the image sensor package provides the excellent electrical transmission and the protection of the image sensor chip.

Abstract: An electronic device comprises a substrate and at least a warped spring connector. The substrate has a signal bonding pad and a ground plane. The warped spring connector is disposed on the substrate and is connected to the bonding pad. The warped spring connector includes at least a ground lead electrically connected to the ground plane, a dielectric layer on the ground lead, and a transmitting lead on the dielectric layer. The transmitting lead is bonded to the bonding pad. The ground lead is isolated from and close to the transmitting lead to solve cross-talk and noise problem. Furthermore, the coefficient of thermal expansion of the transmitting lead is different from that of the dielectric layer or the ground lead such that the warped spring connector has a suspending end suspending away from the substrate.

Abstract: An opto-electronic chip includes a plurality of multi-level bumps thereon, each consisting of multiple plated layers. The opto-electronic chip has a plurality of bonding pads and an photoelectric effecting region on its active surface. Each multi-level bump comprises at least an electroless-plated nickel (Ni) layer and an electroless-plated gold (Au) layer wherein the nickel layers cover the bonding pads and the gold layers are formed on the tops of the nickel layers. Furthermore, the thickness of the nickel layers is larger than that of the gold layers. The UBM processes in conventional bumping processes are not needed so that the contaminations or damages to the photoelectric effecting region of the opto-electronic chip due to UBM can be eliminated.

Abstract: A modularized probe head for modularly assembling on a probe card is configured for probing a semiconductor wafer under test. The probe head includes a silicon substrate having an active surface and an opposing back surface. The back surface of the silicon substrate is attached on a holder. The silicon substrate has a plurality of peripheral bond pads and contact pads on its active surface. At least a probing chip is mounted on the active surface of the silicon substrate. The probing chip has probing tips and side electrodes. The side electrodes are connected with the contact pads by means of solder material. The peripheral bonding pads of the silicon substrate are connected with a flexible printed circuit for electrically connecting to a multi-layer printed circuit board of a probe card.

Abstract: A probe card assembly is disclosed. The probe card assembly comprises a stiffener ring combining respectively with an upper printed circuit board and a lower printed circuit board. A plurality of coaxial transmitters are installed in the stiffener ring, and connect to the upper and lower printed circuit boards by cable connectors. The lower printed circuit board is assembled with a detachable probe head which comprises a silicon substrate with probing points and a probe head carrier. A downset is formed at the center of the probe head carrier. The standardized coaxial transmitters, printed circuit boards and probe heads are then assembled as a probe card assembly for testing all sorts of IC products.

Abstract: A probe card assembly is disclosed. The probe card assembly comprises a stiffener ring combining respectively with an upper printed circuit board and a lower printed circuit board. A plurality of coaxial transmitters are installed in the stiffener ring, and connect to the upper and lower printed circuit boards by cable connectors. The lower printed circuit board is assembled with a detachable probe head which comprises a silicon substrate with probing points and a probe head carrier. A downset is formed at the center of the probe head carrier. The standardized coaxial transmitters, printed circuit boards and probe heads are then assembled as a probe card assembly for testing all sorts of IC products.

Abstract: A modularized probe card with coaxial transmitter is disclosed. At least a coaxial transmitter is modularized and installed between a first printed circuit board and a second printed circuit board. The coaxial transmitter has a first connector and a second connector correspondingly connecting two ends of each coaxial cable of the coaxial transmitter for electrically connecting corresponding in location to first printed circuit board and second printed circuit board. A probe head is bonded on second printed circuit board. The second connector of the coaxial transmitter is connected with the second printed circuit board in a plug-in and pull-away type.

Abstract: A modularized probe card comprising an interface board, a probe head and at least a compressible electrical connection device is disclosed. The compressible electrical connection device comprises an insulation layer with a plurality of circuits on one of its surface. Two ends of each circuit connect respectively to the first contacting pad and the second contacting pad which combine with elastic contact members. Each elastic contact member has a supporter combining with a conductive layer for electrical connections by pushing and compressing. While a probe head is modularized installed on an interface board, the elastic contact members of the compressible electrical connection device is elastically contacted and compressed the probe head and the interface board to acquire modularized electrical connection of the probe card.

Abstract: A SOC (Substrate-On-Chip) packaging process is disclosed. A layer of two-stage thermosetting mixture with solvent is coating on an upside of a substrate. Thereafter, the substrate is heated for removing solvent so that the two-stage thermosetting mixture becomes a B-stage dry adhesive film without solvent. Thus, the bonding pads of the chip are not covered by the dry adhesive film and a better operating flexibility is obtained in the SOC packaging process.

Abstract: A modular probe card assembly comprises a silicon substrate with probes modularly assembled on a main board. At least a socket is installed around silicon substrate and electrically connects to probe needles by a flexible printed wiring film. A plurality of detachable coaxial wires electrically connect sockets with the main board for achieving variability of connecting paths during manufacturing. Thus, the probe card assembly has the effect of adjustable amendment and is suitable for high speed testing.