Abstract: The invention is a pet feeding device provides a feeding mechanism on a basis of fixed time and fixed amount of food for a pet. The pet feeding device includes a base and a rotatable tray. The base has a first opening and a second opening communicated with each other, and the second opening connects the base and an exterior environment. The rotatable tray having third openings is assembled to the base and rotates about an axis. The feed pellets received in the pet feeding device fall into the third openings with a rotation of the rotatable tray. In a process of rotation, the first opening covers portion of the third openings correspondingly in a unit time, and the feed pellets in the corresponding third openings drop out of the pet feeding device via the first opening and the second opening.

Abstract: A pet feeding device receiving a plurality of feed pellets for pet is provided. The pet feeding device includes a base and a rotating tray. The base has a first opening and a second opening communicated with each other, and the second opening connects the base and an exterior environment. The rotating tray having a plurality third openings is assembled to the base and rotates about an axis. The feed pellets received in the pet feeding device fall into the third openings respectively with a rotation of the rotating tray. In a process of rotation, the first opening covers portion of the third openings correspondingly in a unit time, and the feed pellets in the corresponding third openings drop out of the pet feeding device via the first opening and the second opening.

Abstract: A stacked type chip package structure including a lead frame, a chip package, a second chip, and a second molding compound is provided. The lead frame includes a plurality of first leads and second leads insulated from one another. The first leads have a first upper surface, and the second leads have a second upper surface which is not co-planar with the first upper surface. The chip package is disposed on the first leads and includes a substrate, a first chip, and a first molding compound. The second chip is stacked on the chip package and electrically connected to the second leads. The second molding compound is disposed on the lead frame and filled among the first leads and the second leads for encapsulating the chip package and the second chip.

Abstract: A stacked type chip package structure including a lead frame, a chip package, a second chip, and a second molding compound is provided. The lead frame includes a plurality of first leads and second leads insulated from one another. The first leads have a first upper surface, and the second leads have a second upper surface which is not co-planar with the first upper surface. The chip package is disposed on the first leads and includes a substrate, a first chip, and a first molding compound. The second chip is stacked on the chip package and electrically connected to the second leads. The second molding compound is disposed on the lead frame and filled among the first leads and the second leads for encapsulating the chip package and the second chip.

Abstract: A stacked type chip package structure including a chip carrier, a first chip, a second chip, a third chip, and an insulating material is provided. The chip carrier includes two die pads and a plurality of leads surrounding the die pads. The first chip and the second chip are disposed on the die pads respectively, and are electrically connected to the leads by wire bonding. The third chip traverses the first chip and the second chip, and is electrically connected to the first chip and the second chip respectively. The insulating material is disposed on the chip carrier for encapsulating the first chip, the second chip and the third chip, and fills among the die pads and the leads.

Abstract: An integrated circuit package and a manufacturing method thereof are provided. The package includes a die pad, a plurality of first and second contact pads, a first die, a second die and a molding compound. The contact pads adjacent to at least one side of the die pad are arranged along an inner row and an outer row with respect to the die pad. The first die is fixed on the first die and electrically connected to the first contact pads by wire-bonding. The second die is fixed on the first die and electrically connected to the second contact pads by wire-bonding. The molding compound covers the second die, the first die, the die pad, the first contact pads and the second contact pads. The bottoms of the die pad, the first contact pads and the second contact pads are exposed at the bottom surface of the molding compound.