Abstract: A testing apparatus for BGA IC comprises a test circuit board, a socket; and a plurality of detachable fixing units to detachably assemble the socket on the test circuit board. The socket comprises a socket body, a lid pivotally arranged on one end of the socket body to fix an IC on the socket body, and a plurality of conductive pins arranged in socket body to provide electric connection between the test circuit board and the IC. The lid has an upper locking unit locked to a lower locking unit of the socket body such that the IC can be firmly fixed on the socket body and leads contact balls of the IC are tightly connected to the corresponding conductive pins.

Abstract: A device and method for manufacturing an integrated real time clock integrated circuit (RTC IC) package is disclosed, in which the RTC IC and its related components are integrated into a single package. Therefore, the layout area required by the integrated RTC IC package is significantly reduced. Also, only a single manual assembling process is required. Furthermore, various examination steps are built into every process to manufacture the integrated RTC IC package to make sure the completed products are in normal condition. No extra examination and fix-up processes are required for the completed products so that manufacturing cost can be significantly reduced.