Patents by Inventor Yaokun Zheng

Yaokun Zheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for cutting substrate of irregular pattern and display device
    Patent number: 10414683
    Abstract: A method for cutting a substrate of irregular pattern comprises: forming a cutting line on the substrate, wherein the closed region enclosed by the cutting line is the irregular pattern that is required; forming a trough line at the cutting line; and applying an external force to the substrate so as to divide the substrate at the trough line. The method can remarkably improve accuracy and efficiency of cutting a substrate of irregular pattern.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: September 17, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Liyuan Jiang, Yaokun Zheng, Lianjie Qu, Yajie Wang, Yanqi Jiang
  • METHOD FOR CUTTING SUBSTRATE OF IRREGULAR PATTERN AND DISPLAY DEVICE
    Publication number: 20160318791
    Abstract: A method for cutting a substrate of irregular pattern comprises: forming a cutting line on the substrate, wherein the closed region enclosed by the cutting line is the irregular pattern that is required; forming a trough line at the cutting line; and applying an external force to the substrate so as to divide the substrate at the trough line. The method can remarkably improve accuracy and efficiency of cutting a substrate of irregular pattern.
    Type: Application
    Filed: July 11, 2016
    Publication date: November 3, 2016
    Inventors: Liyuan JIANG, Yaokun ZHENG, Lianjie QU, Yajie WANG, Yanqi JIANG
  • Method for cutting substrate of irregular pattern and display device
    Patent number: 9416041
    Abstract: A method for cutting a substrate of irregular pattern includes: forming a cutting line on the substrate, wherein the closed region enclosed by the cutting line is the irregular pattern that is required; forming a trough line at the cutting line; and applying an external force to the substrate so as to divide the substrate at the trough line. The method can remarkably improve accuracy and efficiency of cutting a substrate of irregular pattern.
    Type: Grant
    Filed: October 15, 2013
    Date of Patent: August 16, 2016
    Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Liyuan Jiang, Yaokun Zheng, Lianjie Qu, Yajie Wang, Yanqi Jiang
  • METHOD FOR CUTTING SUBSTRATE OF IRREGULAR PATTERN AND DISPLAY DEVICE
    Publication number: 20150218033
    Abstract: A method for cutting a substrate of irregular pattern includes: forming a cutting line on the substrate, wherein the closed region enclosed by the cutting line is the irregular pattern that is required; forming a trough line at the cutting line; and applying an external force to the substrate so as to divide the substrate at the trough line. The method can remarkably improve accuracy and efficiency of cutting a substrate of irregular pattern.
    Type: Application
    Filed: October 15, 2013
    Publication date: August 6, 2015
    Inventors: Liyuan Jiang, Yaokun Zheng, Lianjie Qu, Yajie Wang, Yanqi Jiang