Patents by Inventor Yao-Min Yu

Yao-Min Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shiftless wafer blades
    Patent number: 11688620
    Abstract: In an embodiment, a system includes: a cassette comprising a slit opening configured to house a wafer; a blade configured to move the wafer to and from the slit opening by extending into the slit opening, wherein a blade thickness of the blade is at most ? of a height of the slit opening and wherein the blade is configured to secure the wafer within a pocket on the blade that is at least ? of a wafer thickness of the wafer.
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: June 27, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Chih Chen, Yao-Min Yu, Ching-Ling Lee, Ren-Dou Lee
  • SHIFTLESS WAFER BLADES
    Publication number: 20220392796
    Abstract: In an embodiment, a system includes: a cassette comprising a slit opening configured to house a wafer; a blade configured to move the wafer to and from the slit opening by extending into the slit opening, wherein a blade thickness of the blade is at most ? of a height of the slit opening and wherein the blade is configured to secure the wafer within a pocket on the blade that is at least ? of a wafer thickness of the wafer.
    Type: Application
    Filed: June 22, 2022
    Publication date: December 8, 2022
    Inventors: Chien-Chih CHEN, Yao-Min YU, Ching-Ling LEE, Ren-Dou LEE
  • Shiftless wafer blades
    Patent number: 11380569
    Abstract: In an embodiment, a system includes: a cassette comprising a slit opening configured to house a wafer; a blade configured to move the wafer to and from the slit opening by extending into the slit opening, wherein a blade thickness of the blade is at most ? of a height of the slit opening and wherein the blade is configured to secure the wafer within a pocket on the blade that is at least ? of a wafer thickness of the wafer.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: July 5, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Chih Chen, Yao-Min Yu, Ching-Ling Lee, Ren-Dou Lee
  • SHIFTLESS WAFER BLADES
    Publication number: 20200388520
    Abstract: In an embodiment, a system includes: a cassette comprising a slit opening configured to house a wafer; a blade configured to move the wafer to and from the slit opening by extending into the slit opening, wherein a blade thickness of the blade is at most ? of a height of the slit opening and wherein the blade is configured to secure the wafer within a pocket on the blade that is at least ? of a wafer thickness of the wafer.
    Type: Application
    Filed: June 22, 2020
    Publication date: December 10, 2020
    Inventors: Chien-Chih Chen, Yao-Min Yu, Ching-Ling Lee, Ren-Dou Lee
  • Shiftless wafer blades
    Patent number: 10699931
    Abstract: In an embodiment, a system includes: a cassette comprising a slit opening configured to house a wafer; a blade configured to move the wafer to and from the slit opening by extending into the slit opening, wherein a blade thickness of the blade is at most ? of a height of the slit opening and wherein the blade is configured to secure the wafer within a pocket on the blade that is at least ? of a wafer thickness of the wafer.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: June 30, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Chih Chen, Yao-Min Yu, Ching-Ling Lee, Ren-Dou Lee
  • SHIFTLESS WAFER BLADES
    Publication number: 20190074205
    Abstract: In an embodiment, a system includes: a cassette comprising a slit opening configured to house a wafer; a blade configured to move the wafer to and from the slit opening by extending into the slit opening, wherein a blade thickness of the blade is at most ? of a height of the slit opening and wherein the blade is configured to secure the wafer within a pocket on the blade that is at least ? of a wafer thickness of the wafer.
    Type: Application
    Filed: September 6, 2018
    Publication date: March 7, 2019
    Inventors: Chien-Chih CHEN, Yao-Min Yu, Ching-Ling Lee, Ren-Dou Lee