Patents by Inventor Yao-Pi Chung

Yao-Pi Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for manufacturing an ethylene vinyl acetate sole using first and second mold units
    Patent number: 5560877
    Abstract: A process for manufacturing an ethylene vinyl acetate (EVA) sole that involves weighing molding compounds for manufacturing the sole. The molding compounds include, by weight, 65-75% of ethylene vinyl acetate pellets, 3-5% of blowing agents, 20-30% of fillers, and 1-2% of crosslinking agents. The molded compounds are mixed, and extruded by means of a twin screw extruder so as to form a web of unfoamed extruded output. The web is cut into sheets. At least one of the sheets is placed into a first mold unit, which is heated and pressurized so as to form a rough foamed sole. The rough foamed sole is placed into a second mold unit, which is heated, pressurized, and cooled so as to form an embossed sole with a predetermined pattern. The embossed sole is trimmed so as to form a finished ethylene vinyl acetate sole.
    Type: Grant
    Filed: July 21, 1995
    Date of Patent: October 1, 1996
    Assignee: Taiwan Footwear Research Institute
    Inventors: Wun-Bin Yung, Jen-Hon Wu, Chung-Pin Chang, Yao-Pi Chung