Abstract: An array structure for light emitting diodes (LEDs) uses a patterned metal layer buried beneath LED chips to electrically interconnect non-adjacent chips in series, such that each chip in the LED array can be adjacently surrounded by LED chips of different colors. Thus, when the emission from the LED array is projected to a spot in the far field, its color uniformity over the spot is enhanced. Methods are also described for fabricating the multi-layer circuit board for such an array. Top and bottom patterned metal layers are formed, separated by a patterned insulating layer, so that electrical connections may be made between the metal layers. This provides “vias” between the metal layers for creating “cross-under” electrical connections under the second insulation layer, such that spatially-separated LED chips can be interconnected into strings, while maintaining electrical isolation between LED chips of different colors.

Abstract: An integrated circuit structure has an IC chip, at least a functional bump, and at least a dummy bump positioned on a joint surface of the IC chip. A terminal surface of the dummy bump is different in appearance from a terminal surface of the functional bump, which improves an inspection process during production of the IC chip.