Abstract: A semiconductor wafer device is provided in this invention. The semiconductor wafer device includes a plurality of chips, circuits, cutting streets, and a polymer layer. The cutting streets include a plurality of longitudinal cutting streets and transverse cutting streets, which are formed between the neighboring chips, and the polymer layer is formed on the cutting streets. In addition, this invention also provides a semiconductor wafer device with a plurality of bumps formed thereon and the bumps are encompassed with a polymer layer.

Abstract: A method of making a ball grid array package comprises the steps of: (a) providing a film having an opening defined therein; (b) placing the film on a substrate; (c) attaching a semiconductor chip onto the substrate such that the semiconductor chip is positioned in the opening of the film; (d) electrically coupling the semiconductor chip to the substrate; (e) providing a molding die having a runner, a gate and a molding cavity defined therein, wherein the runner is connected to the molding cavity through the gate; (f) closing and clamping the molding die in a manner that the semiconductor chip is positioned in the molding cavity wherein the edges of the molding cavity fit entirely within the opening of the film and the edges of the runners and the gates are entirely positioned against the film; (g) transferring a hardenable molding compound into the molding cavity; (h) hardening the molding compound; (i) unclamping and opening the molding die; and (j) simultaneously removing the film and degating.