Patents by Inventor YAO-TSUNG LEE

YAO-TSUNG LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEALING MECHANISM
    Publication number: 20240093786
    Abstract: A sealing mechanism is provided, including a housing, a groove, and a sealing element. The housing includes a first member and a second member, and the groove is formed between the first and second members. The sealing element is formed in the groove by Low Pressure Molding (LPM) and surrounds at least one of the first and second members.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 21, 2024
    Inventors: Wei-Kai HSIAO, Yao-Tsung LEE
  • SEALING MECHANISM
    Publication number: 20220316597
    Abstract: A sealing mechanism is provided, including a housing, a groove, and a sealing element. The housing includes a first member and a second member, and the groove is formed between the first and second members. The sealing element is formed in the groove by Low Pressure Molding (LPM) and surrounds at least one of the first and second members.
    Type: Application
    Filed: September 14, 2021
    Publication date: October 6, 2022
    Inventors: Wei-Kai HSIAO, Yao-Tsung LEE
  • Motherboard assembly and central processing unit expansion card
    Patent number: 8559170
    Abstract: A central processing unit (CPU) expansion card may be inserted into a first connector of a motherboard. The CPU expansion card includes a board, a CPU socket mounted on the board, a number of memory slots mounted on the board and electrically connected to the CPU socket, and a second connector electrically connected to the CPU socket and mounted on the bottom side of the board to be inserted into the first connector of the motherboard.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: October 15, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yao-Tsung Lee, Yi-Cheng Tseng, Chun-Hsien Tsai, Feng-Ming Chang
  • MOTHERBOARD ASSEMBLY AND CENTRAL PROCESSING UNIT EXPANSION CARD
    Publication number: 20130021742
    Abstract: A central processing unit (CPU) expansion card may be inserted into a first connector of a motherboard. The CPU expansion card includes a board, a CPU socket mounted on the board, a number of memory slots mounted on the board and electrically connected to the CPU socket, and a second connector electrically connected to the CPU socket and mounted on the bottom side of the board to be inserted into the first connector of the motherboard.
    Type: Application
    Filed: August 11, 2011
    Publication date: January 24, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YAO-TSUNG LEE, YI-CHENG TSENG, CHUN-HSIEN TSAI, FENG-MING CHANG