Patents by Inventor Yao-Tung Wu

Yao-Tung Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8367018
    Abstract: A chip with tri-layer electrodes and micro-cavity arrays for control of bioparticles and a manufacturing method thereof are revealed. The chip captures and releases bioparticles into and from preset cavities by dielectrophoresis (DEP) force generated by electrodes. The chip includes an upper layer body, a middle layer body, a lower layer body, respectively disposed with an electrode, and micro flow chambers. The electrodes of the upper layer body and the middle layer body are common electrodes while the electrode of the lower layer body is a dispersive electrode array exposed on the bottom of lower-layer microcavity. The cell capture and release at the single-cell level and the cell population level are attained by application of an AC electric field.
    Type: Grant
    Filed: December 7, 2009
    Date of Patent: February 5, 2013
    Assignee: Southern Taiwan University of Technology
    Inventors: Cheng-Hsin Chuang, You-Ming Hsu, Yao-Tung Wu
  • Publication number: 20110136698
    Abstract: A chip with tri-layer electrodes and micro-cavity arrays for control of bioparticles and a manufacturing method thereof are revealed. The chip captures and releases bioparticles into and from preset cavities by dielectrophoresis (DEP) force generated by electrodes. The chip includes an upper layer body, a middle layer body, a lower layer body, respectively disposed with an electrode, and micro flow chambers. The electrodes of the upper layer body and the middle layer body are common electrodes while the electrode of the lower layer body is a dispersive electrode array exposed on the bottom of lower-layer microcavity. The cell capture and release at the single-cell level and the cell population level are attained by application of an AC electric field.
    Type: Application
    Filed: December 7, 2009
    Publication date: June 9, 2011
    Inventors: Cheng-Hsin Chuang, You-Ming Hsu, Yao-Tung Wu