Patents by Inventor Yao-Wen Fan

Yao-Wen Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230244283
    Abstract: An electronics unit (EU) stand may include a base and a fan carrier. The base is to couple to an electronics unit having heat generating components. The fan carrier supports a fan. The fan carrier is movably coupled to the base to move the fan between a first position relative to the base and second position relative to the base.
    Type: Application
    Filed: July 17, 2020
    Publication date: August 3, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Yao-Wen Fan, Yi-Hsieh Chiu, Yu Wei Tan, Cheng-Yan Chiang
  • Publication number: 20230121942
    Abstract: Examples disclosed herein provide an enclosure of a computing device. One example enclosure includes a cover to provide access to components within the enclosure, and the cover is coupled to the enclosure via a shape memory material (SMM) structure. As an example, the SMM structure is to provide for removability of the cover according to a temperature of a heat generating component disposed within the enclosure.
    Type: Application
    Filed: March 27, 2020
    Publication date: April 20, 2023
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Yao-Wen Fan, Yu-Wei Tan, Jia-Hung Lai, Yi-Hsieh Chiu
  • Publication number: 20220382341
    Abstract: In one example in accordance with the present disclosure, a computing device mount is described. The computing device mount includes a stand to support a computing device and a spacer removably attached to the stand. The spacer is placed in a recess of the computing device to mount the computing device to a mounting surface. The spacer also aligns holes on the computing device with holes on the mounting surface.
    Type: Application
    Filed: November 15, 2019
    Publication date: December 1, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Yao-Wen Fan, Yu Wei Tan, Yi-Hsieh Chiu
  • Publication number: 20220341537
    Abstract: In some examples, an apparatus can include a body having a computing device stand structure for attachment of the body to a computing device and a display mount interface spacer structure for attachment of the body between a computing device and a display mount interface.
    Type: Application
    Filed: November 6, 2019
    Publication date: October 27, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Yao-Wen Fan, Yu Wei Tan, Yi Hsieh Chiu
  • Patent number: 11181954
    Abstract: In an example, a standoff may include a bracket, a post attachable to the bracket, and a spacer removably attachable to the post. The post may include a first portion having a first diameter, and a second portion having a second diameter larger than the first diameter of the first portion of the post. The spacer may include a first portion having a first internal diameter at a first end of the spacer, and a second portion having a second internal diameter at a second end of the spacer opposite the first end, wherein the second internal diameter is larger than the first internal diameter of the first portion of the spacer.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: November 23, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Yao-Wen Fan, Yu-Wei Tan, Sheng-Lung Liao
  • Publication number: 20210289652
    Abstract: In an example, a device mount may include a plurality of mounting standoffs which may be arranged in a mounting arrangement. Each mounting standoff of the plurality of mounting standoffs may include a fixed end and a free end disposed away from the fixed end. The fixed end may securably mount to a chassis of an electronic device. Additionally, the free end may engage with a mounting interface of a device board. The mounting standoff may also include a threaded cavity extending into the mounting standoff from the fixed end. The mounting standoff may also include a retention nut to engage with the free end to fix the device board to the mounting standoff.
    Type: Application
    Filed: September 14, 2017
    Publication date: September 16, 2021
    Inventors: Yao Wen Fan, Pei Yu Wang, Yu Wei Tan, Huang Chung Hung
  • Patent number: 11116101
    Abstract: In an example, a movable standoff may include or be attached to a bracket having a post opening, and a post insertable into the post opening. The post may include a low shoulder portion disposed at a first end and a high shoulder portion. Further, the movable standoff may include a nut to fasten to a second end of the post, the first end being opposite from the second end. The high shoulder portion may be disposed in between the first end and the second end. The movable standoff may additionally include a bias member disposed in between the nut and the bracket.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: September 7, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Yao-Wen Fan, Yu Wei Tan, Sheng-Lung Liao
  • Publication number: 20210255673
    Abstract: In an example, a standoff may include a bracket, a post attachable to the bracket, and a spacer removably attachable to the post. The post may include a first portion having a first diameter, and a second portion having a second diameter larger than the first diameter of the first portion of the post. The spacer may include a first portion having a first internal diameter at a first end of the spacer, and a second portion having a second internal diameter at a second end of the spacer opposite the first end, wherein the second internal diameter is larger than the first internal diameter of the first portion of the spacer.
    Type: Application
    Filed: September 20, 2018
    Publication date: August 19, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Yao-Wen Fan, Yu-Wei Tan, Sheng-Lung Liao
  • Publication number: 20200396854
    Abstract: In an example, a movable standoff may include or be attached to a bracket having a post opening, and a post insertable into the post opening. The post may include a low shoulder portion disposed at a first end and a high shoulder portion. Further, the movable standoff may include a nut to fasten to a second end of the post, the first end being opposite from the second end. The high shoulder portion may be disposed in between the first end and the second end. The movable standoff may additionally include a bias member disposed in between the nut and the bracket.
    Type: Application
    Filed: March 6, 2018
    Publication date: December 17, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Yao-Wen Fan, Yu Wei Tan, Sheng-Lung Liao
  • Patent number: 10331165
    Abstract: A hinge assembly includes a first bracket and a second bracket. The first bracket includes a first attachment member, a pin member and an elastomer member. The second bracket includes a second attachment member and a hollow cylinder member.
    Type: Grant
    Filed: April 2, 2014
    Date of Patent: June 25, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Yao-Wen Fan, Kuan-Ting Wu, Cheng-Feng Liao, Chien-Ting Lin
  • Publication number: 20170182737
    Abstract: An example composite material having a substrate formed from carbon and/or glass fibers, and an opaque-plastic film positioned onto the substrate, where the opaque-plastic film has a surface roughness of between 0.001 nm and 1 mm.
    Type: Application
    Filed: July 31, 2014
    Publication date: June 29, 2017
    Inventors: KUAN-TING WU, YAO-WEN FAN, CHENG-FENG LIAO
  • Publication number: 20170096732
    Abstract: Example implementations relate to manufacturing multilayer coatings on substrates. In examples, a substrate with an electrically conducting surface may be provided. A first layer of a first material may be electrophoretically deposited on at least a portion of the electrically conducting surface of the substrate. A second layer of a second, electrically conducting material may be deposited on at least a portion of the first layer using physical vapor deposition. A third layer of a third material may be electrophoretically deposited on at least a portion of the second layer.
    Type: Application
    Filed: June 23, 2014
    Publication date: April 6, 2017
    Inventors: KUAN-TING WU, YU-CHUAN KANG, YAO-WEN FAN
  • Publication number: 20170010631
    Abstract: A hinge assembly includes a first bracket and a second bracket. The first bracket includes a first attachment member, a pin member and an elastomer member. The second bracket includes a second attachment member and a hollow cylinder member.
    Type: Application
    Filed: April 2, 2014
    Publication date: January 12, 2017
    Inventors: YAO-WEN FAN, KUAN-TING WU, CHENG-FENG LIAO, CHIEN-TING LIN
  • Publication number: 20080278045
    Abstract: The present invention relates to a case assembly structure. The case assembly structure includes a first case and a second case. The first case has a first connection portion including an extension part and a trench from the external side to the internal side thereof. The second case has a second connection portion including a protrusion corresponding to the trench of the first connection portion of the first case. An inner wall of the extension part of the first connection portion is in contact with the external side of the second connection portion of the second case such that the first case and the second case are combined together.
    Type: Application
    Filed: July 11, 2007
    Publication date: November 13, 2008
    Applicant: Delta Electronics, Inc.
    Inventors: Yao-Wen Fan, Chun Wen, Chun-Chen Chen