Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes an interconnect structure overlying a semiconductor substrate and comprising a conductive wire. A passivation structure overlies the interconnect structure. An upper conductive structure overlies the passivation structure and comprises a first conductive layer, a dielectric layer, and a second conductive layer. The first conductive layer is disposed between the dielectric layer and the passivation structure. The second conductive layer extends along a top surface of the dielectric layer and penetrates through the first conductive layer and the passivation structure to the conductive wire.

Abstract: An electrical connector includes an insulating body provided with an accommodating cavity for insertion of a mating connector; and a plurality of terminals retained in the insulating body. At least one of the terminals has a retaining portion, an extending portion extending forward from the retaining portion, a contact portion bending upward from a front end of the extending portion and obliquely extending backward into the accommodating cavity, and a supporting portion bending upward and extending from one side of the extending portion. The supporting portion is located below the contact portion. When a non-matching mating connector is inserted into the accommodating cavity, the contact portion abuts the supporting portion, and the supporting portion is configured to block the contact portion from excessive downward deviation.

Abstract: An electrical connector includes an insulating body provided with an accommodating cavity for insertion of a mating connector; and a plurality of terminals retained in the insulating body. At least one of the terminals has a retaining portion, an extending portion extending forward from the retaining portion, a contact portion bending upward from a front end of the extending portion and obliquely extending backward into the accommodating cavity, and a supporting portion bending upward and extending from one side of the extending portion. The supporting portion is located below the contact portion. When a non-matching mating connector is inserted into the accommodating cavity, the contact portion abuts the supporting portion, and the supporting portion is configured to block the contact portion from excessive downward deviation.