Patents by Inventor Yao Wu

Yao Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230397321
    Abstract: A traffic signal lamp includes a plurality of light-emitting devices. Each light-emitting device includes a light-emitting element, a power distribution module, a power module, a controller and a measuring element. The power module is configured for converting an alternating current (AC) into a direct current (DC) and supplying the DC to the light-emitting element and the power distribution module. The measuring element is electrically coupled to the power distribution module and the light-emitting element. The controller is electrically coupled to the power distribution module and the measuring element. When a selected-one of the light-emitting devices receives the AC, the power distribution modules of the selected-one provides the DC to the controller and the measuring element of the selected-one and the power distribution module of the others of the light-emitting devices.
    Type: Application
    Filed: February 17, 2023
    Publication date: December 7, 2023
    Inventors: Kuang-Yao LIAO, Wei-Ting WU, Jhao-Tian PAN
  • Publication number: 20230391167
    Abstract: A heat exchanger for a vehicular air conditioning system is disclosed. The heat changer includes a heat exchanger body, a water storage tank, and a condensate water circulating device. The heat exchanger body is provided with an air-inlet side and an air-outlet side. The air-inlet side is configured to enable an external air flow to enter the heat exchanger body, so that the air flow conducts heat exchange with a refrigerant in the heat exchanger body. The air-outlet side is configured to exhaust the air flow completing heat exchange with the refrigerant. The water storage tank is arranged below the heat exchanger body and is configured to store condensate water formed on the heat exchanger body. The condensate water circulating device is configured to transport cold water in the water storage tank to the air-inlet side of the heat exchanger body for heat exchange with the heat exchanger body.
    Type: Application
    Filed: August 21, 2023
    Publication date: December 7, 2023
    Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventors: Yao LIU, Yu ZHAO, Zhengzhu ZHOU, Liwen JIANG, Kai WU
  • Patent number: 11835773
    Abstract: The disclosure provides an optic fiber connector, including a ferrule, a holder, a connector body having a plurality of first locking slots, a spring sleeved onto the holder, and a retainer having a plurality of locking hooks. The ferrule is assembled to the holder. The spring, the holder, and the ferrule are received in a space formed between the retainer and the connector body by locking the locking hooks with the locking slots respectively, wherein the spring is compressed by locking such that the retainer, the holder, the spring, and the connector body are abutted with each other.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: December 5, 2023
    Assignee: ACON OPTICS COMMUNICATIONS INC.
    Inventors: Jia Rong Wu, Tsung Yao Hsu
  • Publication number: 20230387103
    Abstract: A semiconductor structure is provided. At least one first well region is disposed in a semiconductor substrate and has a first conductivity type. At least one gate of a transistor is disposed over the first well region and extends in a first direction. At least one second well region and at least one third well region are disposed on opposite sides of the first well region and extend in the first direction. The second and third well regions have a second conductivity type. A first shielding structure is disposed on at least one end of the gate and partially overlaps the first well region in a vertical projection direction. The first shielding structure is separated from the end of the gate. A bulk ring is disposed in the semiconductor substrate and surrounds the gate, the second well region, the third well region, and the first shielding structure.
    Type: Application
    Filed: May 27, 2022
    Publication date: November 30, 2023
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Hsien-Feng LIAO, Jian-Hsing LEE, Chieh-Yao CHUANG, Ting-Yu CHANG, Yeh-Ning JOU, Shao-Chang HUANG, Kan-Sen CHEN, Nai-Lun CHENG, Ching-Yi HSU, Yu-Chen WU
  • Publication number: 20230386325
    Abstract: A driving assistance system and a driving assistance method are provided. The driving assistance system includes a plurality of image capturing devices, a congestion calculation module, and a determination module. The image capturing devices capture a plurality of regional images of a plurality of road sections of the target lane. The congestion calculation module calculates a plurality of congestion levels corresponding to the road sections according to the regional images. The determination module provides a lane changing message to the vehicle according to the congestion levels.
    Type: Application
    Filed: April 26, 2023
    Publication date: November 30, 2023
    Applicant: PEGATRON CORPORATION
    Inventors: Yu-Hung Tseng, Ping-Yao Wu, Chia-Wei Chen
  • Publication number: 20230387028
    Abstract: A semiconductor package is fabricated by attaching a first component to a second component. The first component is assembled by forming a first redistribution structure over a substrate. A through via is then formed over the first redistribution structure, and a die is attached to the first redistribution structure active-side down. The second component includes a second redistribution structure, which is then attached to the through via. A molding compound is deposited between the first redistribution structure and the second redistribution structure and further around the sides of the second component.
    Type: Application
    Filed: August 10, 2023
    Publication date: November 30, 2023
    Inventors: Po-Hao Tsai, Po-Yao Chuang, Meng-Liang Lin, Yi-Wen Wu, Shin-Puu Jeng, Techi Wong
  • Publication number: 20230378089
    Abstract: A package structure includes a redistribution structure, a first semiconductor die, a first passive component, a second semiconductor die, a first insulating encapsulant, a second insulating encapsulant, a second passive component and a global shielding structure. The redistribution structure includes dielectric layers and conductive layers alternately stacked. The first semiconductor die, the first passive component and the second semiconductor die are disposed on a first surface of the redistribution structure. The first insulating encapsulant is encapsulating the first semiconductor die and the first passive component. The second insulating encapsulant is encapsulating the second semiconductor die, wherein the second insulating encapsulant is separated from the first insulating encapsulant. The second passive component is disposed on a second surface of the redistribution structure.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 23, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Wen Wu, Shin-Puu Jeng, Shih-Ting Hung, Po-Yao chuang
  • Publication number: 20230378055
    Abstract: A semiconductor package is provided. The semiconductor package includes a redistribution structure, a semiconductor die, and an interposer structure. The interposer structure includes an insulating base having a first surface facing the semiconductor die and a second surface opposite to the first surface and conductive features formed over the insulating base. The conductive features include first portions on the first surface of the insulating base and vertically overlapping the semiconductor die, second portions on the first surface of the insulating base and located outside a projection area of the semiconductor die in a top view, third portions on the second surface of the insulating base and vertically overlapping the semiconductor die, and fourth portions on the second surface of the insulating base and located outside the projection area of the semiconductor die in the top view. The interposer structure includes capping layers and dielectric features.
    Type: Application
    Filed: July 25, 2023
    Publication date: November 23, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Wen WU, Techi WONG, Po-Hao TSAI, Po-Yao CHUANG, Shih-Ting HUNG, Shin-Puu JENG
  • Patent number: 11824007
    Abstract: A semiconductor package is fabricated by attaching a first component to a second component. The first component is assembled by forming a first redistribution structure over a substrate. A through via is then formed over the first redistribution structure, and a die is attached to the first redistribution structure active-side down. The second component includes a second redistribution structure, which is then attached to the through via. A molding compound is deposited between the first redistribution structure and the second redistribution structure and further around the sides of the second component.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: November 21, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Po-Hao Tsai, Po-Yao Chuang, Meng-Liang Lin, Yi-Wen Wu, Shin-Puu Jeng, Techi Wong
  • Publication number: 20230365490
    Abstract: The present disclosure provides industrially scalable methods of making (Z)-endoxifen or a salt thereof, crystalline forms of endoxifin, and compositions comprising them. The present disclosure also provides methods for treating hormone-dependent breast and hormone-dependent reproductive tract disorders.
    Type: Application
    Filed: March 30, 2023
    Publication date: November 16, 2023
    Inventors: Steven C. Quay, Yao-Lin Sun, LungHu Wang, ChangJung Wu, ChuanDer Huang
  • Publication number: 20230368782
    Abstract: Systems and methods are provided for training a machine learning model to learn speech representations. Labeled speech data or both labeled and unlabeled data sets is applied to a feature extractor of a machine learning model to generate latent speech representations. The latent speech representations are applied to a quantizer to generate quantized latent speech representations and to a transformer context network to generate contextual representations. Each contextual representation included in the contextual representations is aligned with a phoneme label to generate phonetically-aware contextual representations. Quantized latent representations are aligned with phoneme labels to generate phonetically aware latent speech representations.
    Type: Application
    Filed: July 3, 2023
    Publication date: November 16, 2023
    Inventors: Yao QIAN, Yu WU, Kenichi KUMATANI, Shujie LIU, Furu WEI, Nanshan ZENG, Xuedong David HUANG, Chengyi WANG
  • Publication number: 20230366782
    Abstract: A buffer for holding a pipe adapted to transport a fluid includes a base. The buffer further includes a plurality of fingers extending outwardly from a first side of the base, wherein a first finger of the plurality of fingers and a second finger of the plurality of fingers define a cavity for receiving the pipe, the first finger extends outwardly from a first end of the base, and the second finger extends outwardly from a central portion of the base, and a third finger of plurality of fingers extends outwardly from a second end of the base opposite the first end, wherein the second finger is between the first finger and the third finger. The buffer further includes at least one roller on a second side of the base opposite the first side.
    Type: Application
    Filed: July 26, 2023
    Publication date: November 16, 2023
    Inventors: Po Yao LI, Shao Chang TU, Tsung-Ying WU, Wei Chih LIN
  • Publication number: 20230367161
    Abstract: Disclosed are an array substrate, a liquid crystal display panel, and a control method. The array substrate (1) comprises a plurality of connecting wire assemblies (20) and a driver (30), each connecting wire assembly (20) comprises a wiring group (22) and an acquisition module (21), the acquisition module (21) is used to detect the electrical parameters of the wiring group (22) and feed them back to the driver (30). The present disclosure can adjust the input voltage according to the impedance of the wiring group (20), so that the driving voltage of each data line or each scanning line is the same and the display uniformity can be improved.
    Type: Application
    Filed: December 30, 2022
    Publication date: November 16, 2023
    Applicant: HKC CORPORATION LIMITED
    Inventors: Di WU, Haibo LI, Yao CHEN, Haijiang YUAN
  • Patent number: 11815643
    Abstract: A method and system for generating an acoustic log. The method may comprise disposing an acoustic logging tool in a wellbore, broadcasting a shaped signal with the acoustic logging tool such that the shaped signal interacts with a boundary of a casing and a material, recording a result signal from the boundary with the acoustic logging tool, and decomposing the result signal into a resonance mode. The method may further comprise applying a bandpass filter to the resonance mode to form a filtered signal, selecting a baseline signal from the filtered signal, removing the baseline signal from the filtered signal, and generating a log from the filtered signal. The system may comprise an acoustic logging tool. The acoustic logging tool may comprise at least one transmitter and at least one receiver. The system may further comprise a conveyance and an information handling system communicatively connected to the acoustic logging tool.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: November 14, 2023
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Yao Ge, Ruijia Wang, Xiang Wu
  • Publication number: 20230362086
    Abstract: A method comprising instantiating virtual routers (VRs) at each of a set of nodes that form a network. Each VR is coupled to the network and to a tenant of the node. The network comprises virtual links in an overlay network provisioned over an underlay network including servers of a public network. The method comprises configuring at least one VR to include a feedback control system comprising at least one objective function that characterizes the network. The method comprises configuring the VR to receive link state data of a set of virtual links of the virtual links, and control routing of a tenant traffic flow of each tenant according to a best route of the network determined by the at least one objective function using the link state data.
    Type: Application
    Filed: July 17, 2023
    Publication date: November 9, 2023
    Inventors: Nithin Michael, Ao Tang, Victor de Souza Lima e Silva, Thiago Sousa Santos, Ning Wu, Archit Baweja, Ki Suh Lee, Yao Wang, Andrey Gushchin, Sakethnath Are
  • Patent number: 11804451
    Abstract: A package structure includes a redistribution structure, a first semiconductor die, a first passive component, a second semiconductor die, a first insulating encapsulant, a second insulating encapsulant, a second passive component and a global shielding structure. The redistribution structure includes dielectric layers and conductive layers alternately stacked. The first semiconductor die, the first passive component and the second semiconductor die are disposed on a first surface of the redistribution structure. The first insulating encapsulant is encapsulating the first semiconductor die and the first passive component. The second insulating encapsulant is encapsulating the second semiconductor die, wherein the second insulating encapsulant is separated from the first insulating encapsulant. The second passive component is disposed on a second surface of the redistribution structure.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: October 31, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Wen Wu, Shin-Puu Jeng, Shih-Ting Hung, Po-Yao Chuang
  • Patent number: 11804176
    Abstract: A display substrate and a display device, the display substrate includes a first side for displaying and a second side, and includes: a base substrate; a display region including first and second display regions, the first display region including multiple pixel unit groups, each pixel unit group including multiple first pixel units, and each first pixel unit including a pixel region and an opening region; multiple first power lines located in the pixel region; a shielding layer including a hollow region and a shielding region; for one pixel unit group, the opening region of each first pixel unit at least partially overlaps with the shielding region, the opening region of at least one first pixel unit includes a first shielding connecting portion at least partially overlapping with the shielding region, the shielding layer is connected with at least one first power line through the first shielding connecting portion.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: October 31, 2023
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Cong Liu, Yao Huang, Jiachang Cai, Yudiao Cheng, Chao Wu
  • Publication number: 20230343128
    Abstract: The present disclosure provides a juvenile fish limb identification method based on a multi-scale cascaded perceptual convolutional neural network. The method includes the following steps: acquiring a video sequence of a juvenile fish, dividing a fish body into five non-overlapping parts, performing semantic annotation on the five non-overlapping parts, and taking the five non-overlapping parts as an input of the multi-scale cascaded perceptual convolutional neural network; and using a convolutional layer as a feature extractor, performing feature extraction on an input image containing the annotation of each limb, inputting extracted features into an Attention-region proposal network (RPN) structure, determining a category of each pixel, and generating a limb mask of each limb category using a multi-scale cascade method. According to the method, the limbs of the juvenile fish can be efficiently and accurately identified, and technical support is provided for posture quantification of the juvenile fish.
    Type: Application
    Filed: March 23, 2023
    Publication date: October 26, 2023
    Inventors: Xiaochan Wang, Yao Wu, Yinyan Shi, Xiaolei Zhang, Naimin Xu, Weimin Li, Dezhi Wang
  • Patent number: 11793435
    Abstract: The present disclosure provides a method for detecting the focus of attention. The method includes: obtaining the face of a person in the first image, as well as the result of facial recognition; determining whether the distance between the person and the target is within an effective attention range; determining whether the face is frontal; determining whether the effective attention period is not shorter than a period threshold; detecting the focus of attention for the person to the target.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: October 24, 2023
    Assignee: ACER INCORPORATED
    Inventors: Kuan-Chung Hou, Bo-Ting Wu, Chian-Ying Li, Ming-Hsuan Tu, Chien-Hung Lin, Jian-Chi Lin, Fu-Heng Wu, Kai-Lun Chang, Tsung-Yao Chen
  • Publication number: 20230317916
    Abstract: The present disclosure provides the use of prelithiated hard carbon in the preparation of lean lithium metal anode electrode, the incorporation of the lean lithium metal anode electrode into full cells, and the evaluation of the electrochemical performances in the full cell under practical conditions. A full cell using the prelithiated hard carbon with lean lithium metal anode electrode and a high-capacity cathode can exhibit high energy density, high Coulombic efficiency, and long cycling life.
    Type: Application
    Filed: June 29, 2021
    Publication date: October 5, 2023
    Applicant: UNIVERSITY OF WASHINGTON
    Inventors: Jihui Yang, Yao Liu, Xianyong Wu, Xiaoyu Jiang, Jun Liu