Abstract: A method for manufacturing a germanium (Ge) epitaxial layer is provided. First, a substrate is provided. Then, a first deposition process is performed to deposit a first Ge epitaxial film on the substrate. Next, a first annealing process is performed on the first Ge epitaxial film. Following that, a second deposition process is performed to directly deposit a second Ge epitaxial film on the first Ge epitaxial film. Thereafter, a second annealing process is performed on the second Ge epitaxial film, wherein the Ge epitaxial layer includes the first Ge epitaxial film and the second Ge epitaxial film, and a thickness of the Ge epitaxial layer is greater than 0.5 microns.

Abstract: A method for manufacturing a germanium (Ge) epitaxial layer is provided. First, a substrate is provided. Then, a first deposition process is performed to deposit a first Ge epitaxial film on the substrate. Next, a first annealing process is performed on the first Ge epitaxial film. Following that, a second deposition process is performed to directly deposit a second Ge epitaxial film on the first Ge epitaxial film. Thereafter, a second annealing process is performed on the second Ge epitaxial film, wherein the Ge epitaxial layer includes the first Ge epitaxial film and the second Ge epitaxial film, and a thickness of the Ge epitaxial layer is greater than 0.5 microns.

Abstract: In wireless communication system and method, a guard band detection (GBD) is performed in a channel to detect the existence of guard bands of a correct channel, so to predetermine that whether the current channel is correct or not. If GBD and a subsequent authorization are both passed in the channel, then the channel is determined as the correct channel. Besides, multiple point estimation (MPE) can be used to analyze the signal strengths in different frequencies to predict the location of the correct channel.

Abstract: A circuit board includes a substrate forming an opening, a first thermal module disposed on a first side of the substrate, a second thermal module disposed on a second side opposite to the first side of the substrate m, and a heat pipe installed on the substrate and passing through the opening. A first end of the heat pipe is connected to the first thermal module, and a second end of the heat pipe is connected to the second thermal module.

Abstract: A circuit board includes a substrate forming an opening, a first thermal module disposed on a first side of the substrate, a second thermal module disposed on a second side opposite to the first side of the substrate m, and a heat pipe installed on the substrate and passing through the opening. A first end of the heat pipe is connected to the first thermal module, and a second end of the heat pipe is connected to the second thermal module.