Patents by Inventor Yao-Yuan SHANG
Yao-Yuan SHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230360938Abstract: A wafer cleaning method for cleaning contaminants on a wafer is provided, wherein the backside of the wafer has a clear area and an unclear area, and the contaminants are located in the unclear area. The wafer cleaning method includes inspecting the backside of the wafer and generating an inspection signal by an inspection device. The wafer cleaning method includes generating a control signal according to the inspection signal by a process module, wherein the control signal includes movement information of a brush element according to coordinates of the contaminants obtained from the inspection signal. The wafer cleaning method includes controlling the brush element to clean the contaminants on the backside of the wafer according to the control signal by a control device along a predetermined path.Type: ApplicationFiled: July 13, 2023Publication date: November 9, 2023Inventors: Kuo-Shu TSENG, Yao-Yuan SHANG, You-Feng CHEN
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Patent number: 11742227Abstract: A wafer cleaning system and method are provided. A brush element is configured to clean a backside of the wafer. The backside has a clear area and an unclear area, and some contaminants are located in the unclear area. A control device performs a first cleaning process to the brush element when the brush element is located at the clear area, and the control device performs a second cleaning process when the brush element is located at the unclear area. The contaminants are cleaned by an enhanced cleaning process. Since the contaminants are cleaned, the backside of the wafer is flatter, and quality of the exposed photoresist on the wafer is improved.Type: GrantFiled: December 23, 2019Date of Patent: August 29, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventors: Kuo-Shu Tseng, Yao-Yuan Shang, You-Feng Chen
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Patent number: 11387123Abstract: A method for fault detection in a fabrication facility is provided. The method includes moving a wafer carrier along a predetermined path multiple times using a transportation apparatus. The method also includes collecting data associated with an environmental condition within the wafer carrier or around the wafer carrier using a metrology tool on the predetermined path in a previous movement of the transportation apparatus. The method further includes measuring the environmental condition within the wafer carrier or around the wafer carrier using the metrology tool during the movement of the wafer carrier. In addition, the method includes issuing a warning when the measured environmental condition is outside a range of acceptable values. The range of acceptable values is derived from the data collected in the previous movement of the transportation apparatus.Type: GrantFiled: April 24, 2020Date of Patent: July 12, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventors: Powen Huang, Yao-Yuan Shang, Kuo-Shu Tseng, Yen-Yu Chen, Chun-Chih Lin, Yi-Ming Dai
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Publication number: 20200251365Abstract: A method for fault detection in a fabrication facility is provided. The method includes moving a wafer carrier along a predetermined path multiple times using a transportation apparatus. The method also includes collecting data associated with an environmental condition within the wafer carrier or around the wafer carrier using a metrology tool on the predetermined path in a previous movement of the transportation apparatus. The method further includes measuring the environmental condition within the wafer carrier or around the wafer carrier using the metrology tool during the movement of the wafer carrier. In addition, the method includes issuing a warning when the measured environmental condition is outside a range of acceptable values. The range of acceptable values is derived from the data collected in the previous movement of the transportation apparatus.Type: ApplicationFiled: April 24, 2020Publication date: August 6, 2020Inventors: Powen HUANG, Yao-Yuan SHANG, Kuo-Shu TSENG, Yen-Yu CHEN, Chun-Chih LIN, Yi-Ming DAI
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Patent number: 10651066Abstract: A method for fault detection in a fabrication facility is provided. The method includes moving a wafer carrier using a transportation apparatus. The method further includes measuring an environmental condition within the wafer carrier or around the wafer carrier using a metrology tool positioned on the wafer carrier during the movement of the wafer carrier. The method also includes issuing a warning when the detected environmental condition is outside a range of acceptable values.Type: GrantFiled: January 25, 2018Date of Patent: May 12, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Powen Huang, Yao-Yuan Shang, Kuo-Shu Tseng, Yen-Yu Chen, Chun-Chih Lin, Yi-Ming Dai
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Publication number: 20200135516Abstract: A wafer cleaning system and method are provided. A brush element is configured to clean a backside of the wafer. The backside has a clear area and an unclear area, and some contaminants are located in the unclear area. A control device performs a first cleaning process to the brush element when the brush element is located at the clear area, and the control device performs a second cleaning process when the brush element is located at the unclear area. The contaminants are cleaned by an enhanced cleaning process. Since the contaminants are cleaned, the backside of the wafer is flatter, and quality of the exposed photoresist on the wafer is improved.Type: ApplicationFiled: December 23, 2019Publication date: April 30, 2020Inventors: Kuo-Shu TSENG, Yao-Yuan SHANG, You-Feng CHEN
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Patent number: 10515833Abstract: Embodiments of a wafer cleaning system and method are provided. A brush element is configured to clean a backside of the wafer. The backside has a clear area and an unclear area, and some contaminants are located in the unclear area. A control device performs a first cleaning process to the brush element when the brush element is located at the clear area, and the control device performs a second cleaning process when the brush element is located at the unclear area. The contaminants are cleaned by an enhanced cleaning process. Since the contaminants are cleaned, the backside of the wafer is flatter, and quality of the exposed photoresist on the wafer is improved.Type: GrantFiled: January 24, 2014Date of Patent: December 24, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventors: Kuo-Shu Tseng, Yao-Yuan Shang, You-Feng Chen
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Patent number: 10345716Abstract: A method for fault detection in a fabrication system is provided. The method includes transferring a reticle carrier containing a reticle from an original position to a destination position. The method further includes detecting environmental condition in the reticle carrier during the transfer of the reticle carrier using a metrology tool that is positioned at the reticle carrier. The method also includes issuing a warning when the detected environmental condition is outside a range of acceptable values.Type: GrantFiled: January 23, 2018Date of Patent: July 9, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yao-Yuan Shang, Kuo-Shu Tseng, Yen-Yu Chen, Chun-Chih Lin, Yi-Ming Dai
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Publication number: 20190163070Abstract: A method for fault detection in a fabrication system is provided. The method includes transferring a reticle carrier containing a reticle from an original position to a destination position. The method further includes detecting environmental condition in the reticle carrier during the transfer of the reticle carrier using a metrology tool that is positioned at the reticle carrier. The method also includes issuing a warning when the detected environmental condition is outside a range of acceptable values.Type: ApplicationFiled: January 23, 2018Publication date: May 30, 2019Inventors: Yao-Yuan SHANG, Kuo-Shu TSENG, Yen-Yu CHEN, Chun-Chih LIN, Yi-Ming DAI
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Publication number: 20190164792Abstract: A method for fault detection in a fabrication facility is provided. The method includes moving a wafer carrier using a transportation apparatus. The method further includes measuring an environmental condition within the wafer carrier or around the wafer carrier using a metrology tool positioned on the wafer carrier during the movement of the wafer carrier. The method also includes issuing a warning when the detected environmental condition is outside a range of acceptable values.Type: ApplicationFiled: January 25, 2018Publication date: May 30, 2019Inventors: Powen HUANG, Yao-Yuan SHANG, Kuo-Shu TSENG, Yen-Yu CHEN, Chun-Chih LIN, Yi-Ming DAI
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Patent number: 9919350Abstract: A cup-wash device is provided. The cup-wash device includes a supporting disk and a base disposed on the supporting disk. The base includes a catchment groove, a first dispensing opening formed on an edge of the base, and a first channel connected with the catchment groove and the first dispensing opening. The cup-wash device also includes a cover disposed on the base and covering the first channel, and the cover has an injection opening connected to the catchment groove.Type: GrantFiled: March 16, 2015Date of Patent: March 20, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Kuo-Shu Tseng, Chih-Hsien Hung, Cheng-Yi Lin, You-Feng Chen, Yao-Yuan Shang
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Patent number: 9770092Abstract: A brush for back surface treatment (BST) is provided. The brush includes a base portion and a brushing portion. The brushing portion is connected to the base portion. The brushing portion has a plurality of gutters disposed on a surface away from the base portion, in which at least one of the gutters has at least one open end located at least partially on a perimeter of the surface.Type: GrantFiled: August 20, 2015Date of Patent: September 26, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Kuo-Shu Tseng, Yao-Yuan Shang
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Publication number: 20170049221Abstract: A brush for back surface treatment (BST) is provided. The brush includes a base portion and a brushing portion. The brushing portion is connected to the base portion. The brushing portion has a plurality of gutters disposed on a surface away from the base portion, in which at least one of the gutters has at least one open end located at least partially on a perimeter of the surface.Type: ApplicationFiled: August 20, 2015Publication date: February 23, 2017Inventors: Kuo-Shu TSENG, Yao-Yuan SHANG
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Patent number: 9570334Abstract: A method for positioning a wafer in semiconductor fabrication is provided. The method includes sending a wafer into a processing chamber by a transferring module. The method further includes producing a video image in relation to an edge of the wafer by a monitoring module. The method also includes performing an image analysis on the video image to determine if the edge of the wafer is in a correct position. If the edge of the wafer is not in a correct position a shifting value is calculated and the wafer is moved according to the shifting value.Type: GrantFiled: March 31, 2015Date of Patent: February 14, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yao-Yuan Shang, Kuo-Shu Tseng, Chune-Te Yang, Chi-Hsin Chan, Chung-Jhieh Chen
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Publication number: 20160293471Abstract: A method for positioning a wafer in semiconductor fabrication is provided. The method includes sending a wafer into a processing chamber by a transferring module. The method further includes producing a video image in relation to an edge of the wafer by a monitoring module. The method also includes performing an image analysis on the video image to determine if the edge of the wafer is in a correct position. If the edge of the wafer is not in a correct position a shifting value is calculated and the wafer is moved according to the shifting value.Type: ApplicationFiled: March 31, 2015Publication date: October 6, 2016Inventors: Yao-Yuan SHANG, Kuo-Shu TSENG, Chune-Te YANG, Chi-Hsin CHAN, Chung-Jhieh CHEN
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Publication number: 20160276207Abstract: A cup-wash device is provided. The cup-wash device includes a supporting disk and a base disposed on the supporting disk. The base includes a catchment groove, a first dispensing opening formed on an edge of the base, and a first channel connected with the catchment groove and the first dispensing opening. The cup-wash device also includes a cover disposed on the base and covering the first channel, and the cover has an injection opening connected to the catchment groove.Type: ApplicationFiled: March 16, 2015Publication date: September 22, 2016Inventors: Kuo-Shu TSENG, Chih-Hsien HUNG, Cheng-Yi LIN, You-Feng CHEN, Yao-Yuan SHANG
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Publication number: 20150214027Abstract: Embodiments of a wafer cleaning system and method are provided. A brush element is configured to clean a backside of the wafer. The backside has a clear area and an unclear area, and some contaminants are located in the unclear area. A control device performs a first cleaning process to the brush element when the brush element is located at the clear area, and the control device performs a second cleaning process when the brush element is located at the unclear area. The contaminants are cleaned by an enhanced cleaning process. Since the contaminants are cleaned, the backside of the wafer is flatter, and quality of the exposed photoresist on the wafer is improved.Type: ApplicationFiled: January 24, 2014Publication date: July 30, 2015Applicant: Taiwan Semiconductor Manufacturing Co., LtdInventors: Kuo-Shu TSENG, Yao-Yuan SHANG, You-Feng CHEN