Abstract: A transparent conductive substrate structure used for a thermoforming process includes a transparent cover plate and a touch sensing layer structure. The transparent cover plate includes a toughening layer on one side thereof. The touch sensing layer structure arranged on one surface of the toughening layer, and includes a first transparent conductive layer, a dielectric layer, a barrier layer, a second transparent conductive layer, and a buffer protective layer. Each transparent conductive layer is directly applied to the transparent cover plate, so that the thickness between the transparent conductive layers is below 1 ?m. The thickness between layers may be reduced to increase the sensitivity of the touch sensing layer structure. To prevent each transparent conductive layer and an electrode wire layer from breaking during the thermoforming process, the transparent conductive substrate structure is combined with the buffer protective layer to strengthen the structure of each transparent conductive layer.

Abstract: A transparent conductive substrate structure used for a thermoforming process includes a transparent cover plate and a touch sensing layer structure. The transparent cover plate includes a toughening layer on one side thereof. The touch sensing layer structure arranged on one surface of the toughening layer, and includes a first transparent conductive layer, a dielectric layer, a barrier layer, a second transparent conductive layer, and a buffer protective layer. Each transparent conductive layer is directly applied to the transparent cover plate, so that the thickness between the transparent conductive layers is below 1 ?m. The thickness between layers may be reduced to increase the sensitivity of the touch sensing layer structure. To prevent each transparent conductive layer and an electrode wire layer from breaking during the thermoforming process, the transparent conductive substrate structure is combined with the buffer protective layer to strengthen the structure of each transparent conductive layer.

Abstract: A laser etching method for a transparent conductive plate includes the steps as follows: providing a transparent conductive plate having a transparent conductive layer; continuingly emitting a plurality of laser beams to the transparent conductive layer, and controlling the center points of the laser beams to move in a front path and a rear path partially overlapping a beginning portion of the front path for forming an end connection groove connecting the beginning and the end thereof, or controlling the center points of the laser beams to move in a transverse path and a longitudinal path without overlapping the transverse path for forming a T-shaped groove, or controlling the center points of the laser beams to sequentially move in a first path, a curve path, and a second path substantially perpendicular to the first path for forming a curve groove.

Abstract: A laser etching method for a transparent conductive plate includes the steps as follows: providing a transparent conductive plate having a transparent conductive layer; continuingly emitting a plurality of laser beams to the transparent conductive layer, and controlling the center points of the laser beams to move in a front path and a rear path partially overlapping a beginning portion of the front path for forming an end connection groove connecting the beginning and the end thereof, or controlling the center points of the laser beams to move in a transverse path and a longitudinal path without overlapping the transverse path for forming a T-shaped groove, or controlling the center points of the laser beams to sequentially move in a first path, a curve path, and a second path substantially perpendicular to the first path for forming a curve groove.

Abstract: A method of manufacturing a touch member includes firstly providing a plate like substrate including a planar electrode area and a planar circuit area arranged on the surface thereof. Secondly the first plane is covered a first conductive material is coated on the electrode area to form a transparent electrode layer. The first conductive material is constituted of carbon nanotubes. Subsequently, a second conductive material is applied on the circuit area to form a circuit layer. The circuit layer is led from the electrode layer. Finally, the substrate is shaped to from a flexible or stereoscopic transparent electrode.

Abstract: A touch panel comprises: a substrate, a transparent conductive layer and a conductive circuit layer. The transparent conductive layer is formed on a surface of the substrate, and the transparent conductive layer has a touch area and an un-touch area. The un-touch area has a plurality of barrier blocks arranged in a matrix, and the barrier blocks form a plurality of vertical and horizontal barrier slots. The conductive circuit layer is directly distributed on the barrier slots formed by the barrier blocks of the touch area, so as to increase the space to distributing circuits on the conductive circuit layer and save cost to manufacturing.

Abstract: The method disclosed comprises steps of preparing a transparent conducting material, and forming a transparent conducting ink with the transparent conducting material mixing with carbon materials. Next, prepare a transparent plastic film, and form a transparent conducting layer by forming the transparent conducting ink film on the transparent plastic film via spray coating, screen printing, ink jet printing or roll to roll ink coating film. Lastly, project laser beams on the transparent conducting layer of the transparent plastic film. The transparent conducting layer includes carbon materials for facilitating the light condensing effect of the laser beams. In the laser beams etching process, the line width of the transparent conducting layer etching is produced less than 50 um, the width of the ineffective area near the etching edge after the etching of the transparent conducting layer is less than 10 um in order to complete a high resolution laser etching process.

Abstract: A structure of a focusing mesh for a field emission display includes a cathode substrate and a rectangular mesh. The cathode substrate with one edge formed a cathode conductor including a joint area. The mesh includes a plurality of pores formed in matrix and a L-shaped recess formed at one side of the mesh to provide a rectangular strip as a leading wire of the mesh drooped by self weight to contact with the joint area of the cathode conductor. As such, during vacuuming to envelop the field emission display, it will not cause the crack of wire, air leakage and even make easier to be enveloped and increase the good fabrication rate of a field emission display.

Abstract: A method for manufacturing glue-pasting area of field emission display forms a plurality of elongated low walls on glue-pasting area of the anode plate or the cathode plate by printing. The elongated low wall includes a length side parallel with a package side of the display. The elongated low walls are arranged on the glue-pasting area in staggered and parallel fashion, where a first gap is defined between two adjacent elongated low walls and the first gap is a channel for overflow glue after the cathode plate is pressed with the anode plate. After the glass glue is pasted on the elongated low wall and the cathode plate is pressed with the anode plate, the overflow glue is constrained b the gap to control the width of glue.

Abstract: A method of fabricating the parallel leading wire in a focusing mesh of field emission display and a structure thereof is provided. A cathode leading wire is formed along one edge of a cathode plate in a field emission display. When the metal mesh is formed on the cathode plate, one edge of the mesh becomes a leading wire parallel to another edge thereof. The leading wire has a designated length and a thickness thinner than the metal mesh. Without applying external force, the parallel leading wire is drooped and contacted the cathode plate because of itself weight. Be way of sintering, parallel leading wire is connected to cathode leading wire and enveloped by the metal mesh within the cathode plate.

Abstract: A structure of a focusing mesh for a field emission display includes a cathode substrate and a rectangular mesh. The cathode substrate with one edge formed a cathode conductor including a joint area. The mesh includes a plurality of pores formed in matrix and a L-shaped recess formed at one side of the mesh to provide a rectangular strip as a leading wire of the mesh drooped by self weight to contact with the joint area of the cathode conductor. As such, during vacuuming to envelop the field emission display, it will not cause the crack of wire, air leakage and even make easier to be enveloped and increase the good fabrication rate of a field emission display.

Abstract: A method of fabricating the parallel leading wire in a focusing mesh of field emission display and a structure thereof is provided. A cathode leading wire is formed along one edge of a cathode plate in a field emission display. When the metal mesh is formed on the cathode plate, one edge of the mesh becomes a leading wire parallel to another edge thereof. The leading wire has a designated length and a thickness thinner than the metal mesh. Without applying external force, the parallel leading wire is drooped and contacted the cathode plate because of itself weight. Be way of sintering, parallel leading wire is connected to cathode leading wire and enveloped by the metal mesh within the cathode plate.

Abstract: A method of fabricating the parallel leading wire in a focusing mesh of field emission display and a structure thereof is provided. A cathode leading wire is formed along one edge of a cathode plate in a field emission display. When the metal mesh is formed on the cathode plate, one edge of the mesh becomes a leading wire parallel to another edge thereof. The leading wire has a designated length and a thickness thinner than the metal mesh. Without applying external force, the parallel leading wire is drooped and contacted the cathode plate because of itself weight. Be way of sintering, parallel leading wire is connected to cathode leading wire and enveloped by the metal mesh within the cathode plate.

Abstract: A field emission display with multiple display directions includes an anode structure and a cathode structure. The anode structure has a plurality of peripheral sides, and each of the peripheral sides has an interior surface. A conductive layer and a phosphor layer formed on each interior surface of the shell substrate. The cathode structure is disposed within the shell substrate of the anode structure. The cathode structure has a plurality of peripheral sides facing respective interior surfaces of the anode structure and a conductive layer and an electron emission layer formed on each peripheral side of the cathode structure.