Abstract: A method for forming a semiconductor device structure is provided. The method includes providing a substrate and a nanostructure stack. The method includes forming an isolation layer over the base and surrounding the fin. The method includes forming a first protection layer over the nanostructure stack and the isolation layer. The method includes forming a second protection layer over the first protection layer. The method includes forming a mask layer over the second protection layer. The top portion of the second protection layer protrudes from the mask layer. The method includes thinning the top portion of the second protection layer. The method includes removing the mask layer. The method includes removing the first protection layer and the second protection layer over the nanostructure stack. The method includes forming a gate stack wrapped around the nanostructure stack.

Abstract: Embodiments of the present disclosure provide semiconductor device structures and methods of forming the same. The structure includes a source/drain region disposed over a substrate, a gate electrode layer disposed over the substrate, a first gate spacer disposed between the gate electrode layer and the source/drain region, and a dielectric spacer disposed between the gate electrode layer and the source/drain region. A first portion of the dielectric spacer is in contact with a first portion of the first gate spacer. The structure further includes a sacrificial layer disposed between a second portion of the first gate spacer and a second portion of the dielectric spacer.

Abstract: A circuit board includes a first signal conductive area, a second signal conductive area, a first ground conductive area and a second ground conductive area. The first signal conductive area and the second signal conductive area both extend along a first direction. The first ground conductive area and the second ground conductive area are located on two sides of the first signal conductive area and the second signal conductive area, respectively, thereby improving shielding effect. A connector assembly including the circuit board is also disclosed.

Abstract: An occluder support and a preparation method thereof are disclosed. The occluder support includes a mesh body formed of multiple first struts and a trailing structure connected to a distal end of the mesh body. The trailing structure includes multiple circumferentially arranged second struts each inwardly folded into a blunt shape and brought into contact with a corresponding one of the first struts of the mesh body. Each pair of second and first struts in contact have one or more holes penetrated therethrough and are connected by a suture passing through the one or more holes. The occluder support has a closed proximal end and an open distal end.

Abstract: Exemplary semiconductor processing methods may include providing deposition precursors to a processing region of a semiconductor processing chamber. The deposition precursors may include a silicon-carbon-and-nitrogen-containing precursor. A substrate may be disposed within the processing region. The methods may include forming plasma effluents of the deposition precursors. The methods may include depositing a layer of silicon-carbon-and-nitrogen-containing material on the substrate. The layer of silicon-carbon-and-nitrogen-containing material may be characterized by a dielectric constant of less than or about 4.0. The layer of silicon-carbon-and-nitrogen-containing material may be characterized by a leakage current at 2 MV/cm of less than or about 3E-08 A/cm2.

Abstract: The disclosure provides catalysts for synthesizing polyimides and preparation methods therefor, as well as polyimide compounds. The structural formula of the catalyst may be represented by formula (1): in formula (1), R3 is selected from O or NH; R4 is selected from O or NH; Ar2 is a substituted aryl group, and the substituent of the substituted aryl group comprises a carboxyl group; R5 is selected from a hydrogen atom, a chlorine atom, a bromine atom, an iodine atom, a cyano group, a nitro group, an ester group, an alkyl group, an alkoxy group or a haloalkyl group; and n is an integer ranging from 1 to 4.

Abstract: Systems, computer program products and/or computer-implemented methods described herein relate to a process to optimize performance of an operating neural network. A system can comprise a memory that stores computer executable components and a processor that executes the computer executable components, which can comprise an identification component that, employing an operating, multi-layered virtual computation module of looped neurons, identifies a first neuron of a first cluster of a first layer of the looped neurons as being an outlier neuron, an adjustment component that reassigns the outlier neuron from the first cluster to a second cluster of the first layer, and a scheduling component that, based on a dependency among layers of the multi-layered virtual computation module, including the first layer, adjusts a cross-layer functionality of the looped neurons for a workload currently being performed by the multi-layered virtual computation module.

Abstract: Disclosed is a computer-implemented method for model ensemble acceleration in an active learning loop. The method includes receiving a set of datapoint inputs, where each datapoint input is an unlabeled equivalent of other datapoint inputs in the set of datapoint inputs and has a different applied weight value. The method then executes a set of neural network models, where the execution of each neural network model is based on the received set of datapoint inputs. The outputs from the set of neural network models are analyzed, where an inference computation is performed, and a label for the set of datapoints is determined. The method then stores the labeled set of datapoint inputs in a database. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: In general, various aspects of the techniques are directed to causal analysis using large scale time series data. A computing system may convert large scale time series data to first time period records and second time period records according to a multi-scale time resolution. The computing system may implement a hierarchical machine learning model to generate embeddings that capture temporal characteristics of features of the large scale time series data. The computing system may generate a graph data structure indicating cause and effect correlations between features of the large scale time series data based on temporal dynamics captured in the cause and second time period records and/or the embeddings.

Abstract: A fixture and a construction method suitable for installation and uninstallation of large steel structures are provided. The fixture has a limit adapter component used to support and fix steel structures, a spherical sliding device connected with the limit adapter component, a locking device provided with an arc-shaped groove, an inclined strut whose two ends are hinged with the locking device and the spherical sliding device respectively, a jacking mechanism installed at the bottom of the locking device, and a gasket adjustment unit located outside the jacking mechanism and abutted with the bottom of the locking device.

Abstract: A method for fabricating an integrated circuit device is provided. The method includes depositing a first dielectric layer; depositing a second dielectric layer over the first dielectric layer; etching a trench opening in the second dielectric layer, wherein the trench opening exposes a first sidewall of the second dielectric layer and a second sidewall of the second dielectric layer, the first sidewall of the second dielectric layer extends substantially along a first direction, and the second sidewall of the second dielectric layer extends substantially along a second direction different from the first direction in a top view; forming a via etch stop layer on the first sidewall of the second dielectric layer, wherein the second sidewall of the second dielectric layer is free from coverage by the via etch stop layer; forming a conductive line in the trench opening; and forming a conductive via over the conductive line.

Abstract: An electrical connector includes a housing, a first terminal module, a first ground sheet and a second ground sheet. The first terminal module includes two first conductive terminals which are a first signal terminal and a second signal terminal, respectively. Each first conductive terminal includes a first contact arm. The first ground sheet and the second ground sheet are fixed relative to the housing. The first ground sheet includes a first grounding elastic arm. The second ground sheet includes a second ground elastic arm. The first grounding elastic arm and the second grounding elastic arm are arranged separately and extend toward each other.

Abstract: An electrical connector includes a first conductive housing, a second conductive housing, a first terminal module and a second terminal module. The first conductive housing and the second conductive housing are made separately and fixed together to jointly form a receiving slot. The first terminal module is at least partially disposed in the first conductive housing. The first terminal module includes a number of first conductive terminals which are not in contact with the first conductive housing. The second terminal module is at least partially disposed in the second conductive housing. The second terminal module includes a number of second conductive terminals which are not in contact with the second conductive housing. By using the conductive housing to replace an insulating housing in the related art, the shielding effect and the quality of signal transmission are improved.

Abstract: A catalytic structure has a plurality of high-entropy alloy (HEA) nanoparticles. Each HEA nanoparticle is composed of a homogenous mixture of elements of cobalt (Co), molybdenum (Mo), and at least two transition metal elements. For example, in some embodiments, each HEA nanoparticle is a quinary mixture of Co, Mo, iron (Fe), nickel (Ni), and copper (Cu). The homogenous mixture in each HEA nanoparticle forms a single solid-solution phase. The catalytic structure can be used to catalyze a chemical reaction, for example, ammonia decomposition or ammonia synthesis. Methods for forming the catalytic structure are also disclosed.

Abstract: A speaker includes housing having receiving space and sound-producing unit received in receiving space. The sound-producing unit includes frame; vibration unit; magnetic circuit unit; spring damping element elastically connects magnetic circuit unit to frame and supports magnetic circuit unit to vibrate in accommodating space. A weight is fixed to magnetic circuit unit. In speaker, magnet or yoke and spring damping element form another vibration unit. This another vibration unit and the vibration unit that is composed of voice diaphragm, dome, and voice coil are subjected to interaction forces and vibrate in opposite directions, which reduces force on frame. The weight is added to magnetic circuit unit, which reduces the impact of air in rear cavity on magnet. Moreover, by adjusting mass of weight and stiffness and damping of spring damping element, corresponding resonant frequency and damping of magnetic circuit unit may be set, thereby achieving an optimal vibration isolation effect.

Abstract: An array substrate, a display panel and a display device are provided. The array substrate includes sub-pixels, common electrode lines, a common signal transmission line and fanout wiring regions. The sub-pixels are located in the display region, and include a common electrode; the common electrode lines are electrically connected with the common electrode of the sub-pixels, and the common signal transmission line is disposed in the non-display region and electrically connected with the common electrode lines. A wire located in the fanout wiring region at an edge is electrically connected with the common signal transmission line, a conductive structure is disposed between the fanout wiring region and the common signal transmission line, the conductive structure is electrically connected with a wire located at an edge in the fanout wiring region, and the conductive structure is separated from the common signal transmission line.

Abstract: An electrical connector includes a housing, a first conductive terminal and a cover plate. The housing includes a receiving slot configured to at least partially receive a mating module along a first direction. The housing includes a first upper surface and a weight-reducing groove recessed downwardly from the first upper surface. The first conductive terminal is mounted to the housing. The first conductive terminal includes a first contact arm. The first contact arm includes a first contact portion protruding into the receiving slot. The cover plate is fixed to the first upper surface and covers the weight-reducing groove. With this arrangement, the present disclosure is beneficial to reducing the weight of the electrical connector, thereby facilitating to achieve lightweight.

Abstract: Methods and systems for media trend detection and maintenance are provided herein. A set of media items each having common media characteristics is identified. A set of pose values is determined for each respective media item of the set of media items. Each pose value is associated with a particular predefined pose for objects depicted by the set of media items. A set of distance scores is calculated. Each distance score represents a distance between the respective set of pose values determined for a media item and a respective set of pose values determined for an additional media item. A coherence score is determined for the set of media items based on the calculated set of distance scores. Responsive to a determination that the coherence score satisfies one or more coherence criteria, a determination is made that the set of media items corresponds to a media trend of a platform.

Abstract: An electrical connector includes a conductive housing, a first terminal module and a first insulating fixing block. The conductive housing defines a receiving slot configured to at least partially receive a mating module along a first direction. The conductive housing includes a first conductive housing. The first conductive housing includes a first front end surface and a first filling groove extending through the first front end surface along the first direction. The first terminal module includes a first conductive terminal which is not in contact with the first conductive housing. The first insulating fixing block is fixed in the first filling groove. The first insulating fixing block is located adjacent to a front end of the receiving slot.

Abstract: The present inventions relate to improved lyophilization methods for therapeutic proteins, such as monoclonal antibodies, using controlled nucleation. The controlled nucleation approach is time efficient, and produces lyophilized products with high quality and faster reconstitution times. The present inventions also relate to efficient lyophilization process to achieve moderate moisture content in room temperature stable therapeutic proteins.