Patents by Inventor Yaode ZENG

Yaode ZENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION, PREPREG CONTAINING SAME, AND LAMINATE BOARD AND PRINTED CIRCUIT BOARD
    Publication number: 20220135788
    Abstract: The present disclosure provides a resin composition, as well as a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 48-54 parts by weight of a halogen-free epoxy resin, 16-31 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group; and 15-32 parts by weight of a cyanate ester resin. The prepreg, laminate and printed circuit board prepared from the resin composition have a low coefficient of thermal expansion.
    Type: Application
    Filed: April 8, 2019
    Publication date: May 5, 2022
    Inventors: Liexiang HE, Yaode ZENG, Zhongqiang YANG, Yu YANG, Hualin PAN, Yongjing XU