Patents by Inventor Yaodu WEI

Yaodu WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11380338
    Abstract: Provided are a signal processing method and apparatus for enhancing sound quality. The signal processing method performed by a signal transmitting apparatus includes determining, based on a plurality of parameters, a valid bandwidth so as to encode an input signal; performing pre-processing on the input signal, based on the valid bandwidth; and encoding the pre-processed input signal, based on the valid bandwidth, and the signal processing method performed by a signal receiving apparatus includes decoding a bitstream or a packet received via a transmission channel; determining a valid bandwidth, based on a plurality of parameters used in the decoding; and performing post-processing on a decoded signal, based on the valid bandwidth.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: July 5, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ho-sang Sung, Holly Francois, Ki-hyun Choo, Eun-mi Oh, Kyung-hun Jung, Yaodu Wei
  • Publication number: 20210012786
    Abstract: Provided are a signal processing method and apparatus for enhancing sound quality. The signal processing method performed by a signal transmitting apparatus includes determining, based on a plurality of parameters, a valid bandwidth so as to encode an input signal; performing pre-processing on the input signal, based on the valid bandwidth; and encoding the pre-processed input signal, based on the valid bandwidth, and the signal processing method performed by a signal receiving apparatus includes decoding a bitstream or a packet received via a transmission channel; determining a valid bandwidth, based on a plurality of parameters used in the decoding; and performing post-processing on a decoded signal, based on the valid bandwidth.
    Type: Application
    Filed: September 29, 2020
    Publication date: January 14, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ho-sang SUNG, Holly FRANCOIS, Ki-hyun CHOO, Eun-mi OH, Kyung-hun JUNG, Yaodu WEI
  • Patent number: 10803877
    Abstract: Provided are a signal processing method and apparatus for enhancing sound quality. The signal processing method performed by a signal transmitting apparatus includes determining, based on a plurality of parameters, a valid bandwidth so as to encode an input signal; performing pre-processing on the input signal, based on the valid bandwidth; and encoding the pre-processed input signal, based on the valid bandwidth, and the signal processing method performed by a signal receiving apparatus includes decoding a bitstream or a packet received via a transmission channel; determining a valid bandwidth, based on a plurality of parameters used in the decoding; and performing post-processing on a decoded signal, based on the valid bandwidth.
    Type: Grant
    Filed: September 5, 2016
    Date of Patent: October 13, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ho-sang Sung, Holly Francois, Ki-hyun Choo, Eun-mi Oh, Kyung-hun Jung, Yaodu Wei
  • Publication number: 20190027156
    Abstract: Provided are a signal processing method and apparatus for enhancing sound quality. The signal processing method performed by a signal transmitting apparatus includes determining, based on a plurality of parameters, a valid bandwidth so as to encode an input signal; performing pre-processing on the input signal, based on the valid bandwidth; and encoding the pre-processed input signal, based on the valid bandwidth, and the signal processing method performed by a signal receiving apparatus includes decoding a bitstream or a packet received via a transmission channel; determining a valid bandwidth, based on a plurality of parameters used in the decoding; and performing post-processing on a decoded signal, based on the valid bandwidth.
    Type: Application
    Filed: September 5, 2016
    Publication date: January 24, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ho-sang SUNG, Holly FRANCOIS, Ki-hyun CHOO, Eun-mi OH, Kyung-hun JUNG, Yaodu WEI