Patents by Inventor Yao Huang Huang

Yao Huang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interposer for semiconductor package
    Patent number: 8772921
    Abstract: An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.
    Type: Grant
    Filed: January 10, 2012
    Date of Patent: July 8, 2014
    Assignee: United Test and Assembly Center Ltd.
    Inventors: Chin Hock Toh, Yao Huang Huang, Ravi Kanth Kolan, Wei Liang Yuan, Susanto Tanary, Yi Sheng Anthony Sun
  • INTERPOSER FOR SEMICONDUCTOR PACKAGE
    Publication number: 20120104628
    Abstract: An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.
    Type: Application
    Filed: January 10, 2012
    Publication date: May 3, 2012
    Applicant: UNITED TEST AND ASSEMBLY CENTER LTD.
    Inventors: Chin Hock TOH, Yao Huang HUANG, Ravi Kanth KOLAN, Wei Liang YUAN, Susanto TANARY, Yi Sheng Anthony SUN
  • Interposer for semiconductor package
    Patent number: 8115292
    Abstract: An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.
    Type: Grant
    Filed: October 23, 2009
    Date of Patent: February 14, 2012
    Assignee: United Test and Assembly Center Ltd.
    Inventors: Chin Hock Toh, Yao Huang Huang, Ravi Kanth Kolan, Wei Liang Yuan, Susanto Tanary, Anthony Yi Sheng Sun
  • INTERPOSER FOR SEMICONDUCTOR PACKAGE
    Publication number: 20100109142
    Abstract: An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.
    Type: Application
    Filed: October 23, 2009
    Publication date: May 6, 2010
    Applicant: UNITED TEST AND ASSEMBLY CENTER LTD.
    Inventors: Chin Hock Toh, Yao Huang Huang, Ravi Kanth Kolan, Wei Liang Yuan, Susanto Tanary, Yi Sheng Anthony Sun
  • Interdental brush
    Publication number: 20070226932
    Abstract: An interdental brush includes a frame, a brush, a fixing element, and a wrapping element. One inserting aperture is formed at one end of the frame and it is extended inside the frame. The handling portion of the Brush is inserted into the inserting aperture of the frame while the fixing element is inside the frame and attached to the handling portion. The wrapping element wraps the frame and fixing element to have the interdental brush furnished. The interdental brush is soft, bendable, comfortable, and with excellent fixation; therefore, the handling portion of the brush will not be pulled off from the inserting aperture of the frame.
    Type: Application
    Filed: January 3, 2007
    Publication date: October 4, 2007
    Inventors: Yao-Huang Huang, Mu-Hua Huang, Chun-Hung Chen