Patents by Inventor Yao-Hui Lu

Yao-Hui Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060233967
    Abstract: A method and apparatus for forming fine lines by means of a curing coating is to use a first impressing wheel and second wheel in a sequence to impress respectively first spread zones and second spread zones with a curing coating on a carrier to form first lines zones and second lines zones; overlapped zones thereof have the same lines as both of them to allow the overlapped zones of the first lines zones and the second lines zones to be formed with continuous lines to form no-slits continuous lines.
    Type: Application
    Filed: April 15, 2005
    Publication date: October 19, 2006
    Inventors: Wen-Bin Lai, Yao-Hui Lu
  • Publication number: 20060234067
    Abstract: A laser gilding film containing a curing coating and manufacture thereof comprises the following steps: spreading a curing coating layer that is not hermetically sealed to a plastic film onto one face of the plastic film; sticking the curing coating layer to a mold with laser lines; solidifying the curing coating layer and separating the mold after laser lines corresponding to the laser lines is formed thereon; electroplating a layer of metal layer on the curing coating layer with the laser lines; and spreading a heat melt glue layer on the metal layer 33 to form a laser gilding film.
    Type: Application
    Filed: April 15, 2005
    Publication date: October 19, 2006
    Inventor: Yao-Hui Lu
  • Publication number: 20060231195
    Abstract: A method for forming fine lines on a gas permeable and moisture absorptive material comprises the following steps: allowing a water-based resin layer to be spread on a molding plate with lines; allowing the water-based resin layer to be covered with a carrier made from a gas permeable and moisture absorptive materials; evaporating the water contained in the water-based resin layer; removing the molding plate after the water-based resin layer is hardened to be a solidified resin layer and combined with the carrier stably to cause the lines on the molding plate to be transferred onto the solidified resin layer to allow lines corresponding to the lines on the molding plate to be formed on the solidified resin layer.
    Type: Application
    Filed: April 15, 2005
    Publication date: October 19, 2006
    Inventors: Ping-Yu Tsai, Yao-Hui Lu